• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 1995.10a
• /
• pp.64-67
• /
• 1995

Transfer Molding is currently the most widely used process for encapsulation integrated circuits(;IC). Although the process has been introduced over 20 years ago, generating billions of parts each year, it is far from being optimized. With each new mold, epoxy mold, epoxy mold compound, and lead-frame, lengthy period and expensive qualification runs have to be performed to minimized defects ranging from wire sweep, incomplete fill, and internal voids etc. This studies describes how simulation can be applied to transfer molding to yield acceptable design and processing parameter. The non-isothermal filling of non-newtonian reactive epoxy molding compound(;EMC) in a multi-cavity mold is analyzed. Sensitivity analysis is conducted to investigate the influence of process deviations on the final molded profile. This study trend is carried out by following some heuristic process guidelines.

• Food Science of Animal Resources
• /
• v.18 no.1
• /
• pp.57-62
• /
• 1998

Changes of palatability traits such as color texture free amino acid and nucleotide-related compound of mold fermented sausages during ripening were investigated. The a-value of mold fermented sausages rapidly increased up to 7th days if ripening. The hardness of mold fermented sausages rapidly increased while springiness and cohesiveness slightly decreased during ripening. Total free amino acid of mold fermented sausages gradually increased during ripening. Contents of nucleotide-related compounds such as ATP, ADP, AMP and IMP of mold fermented sausages rapidly decreased during ripening.

• Mycobiology
• /
• v.47 no.1
• /
• pp.87-96
• /
• 2019

Fungi produce various secondary metabolites that have beneficial and harmful effects on other organisms. Those bioactive metabolites have been explored as potential medicinal and antimicrobial resources. However, the activities of the culture filtrate (CF) and metabolites of whiterot fungus (Schizophyllum commune) have been underexplored. In this study, we assayed the antimicrobial activities of CF obtained from white-rot fungus against various plant pathogens and evaluated its efficacy for controlling anthracnose and gray mold in pepper plants. The CF inhibited the mycelial growth of various fungal plant pathogens, but not of bacterial pathogens. Diluted concentrations of CF significantly suppressed the severity of anthracnose and gray mold in pepper fruits. Furthermore, the incidence of anthracnose in field conditions was reduced by treatment with a 12.5% dilution of CF. The active compound responsible for the antifungal and disease control activity was identified and verified as schizostatin. Our results indicate that the CF of white-rot fungus can be used as an eco-friendly natural product against fungal plant pathogens. Moreover, the compound, schizostatin could be used as a biochemical resource or precursor for development as a pesticide. To the best of our knowledge, this is the first report on the control of plant diseases using CF and active compound from white-rot fungus. We discussed the controversial antagonistic activity of schizostatin and believe that the CF of white-rot fungus or its active compound, schizostatin, could be used as a biochemical pesticide against fungal diseases such as anthracnose and gray mold in many vegetables.

• Design & Manufacturing
• /
• v.6 no.2
• /
• pp.37-41
• /
• 2012

Usually compound dies are used in clinch washer production. However, in this study, a fine blanking die is designed and manufactured, and clinch washers are produced by the die. Clinch washers are for electric exhaust gas recirculation (EEGR) and they recirculate some of exhaust gas to reduce harmful substances. Fine blanking automation production eliminates difficulties operators face on conventional press.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.19 no.4
• /
• pp.455-461
• /
• 2010

Automated magnetic abrasive polishing which can be applied after machining of the mold on a machine tool without unloading is very effective for finishing a complicated injection mold surface. This study aims to realize one step polishing of free form surface with the same machine tool. For this purpose, magnetic flux density according to the change of curvature radii was simulated for selecting polishing conditions and experimental verification was performed with a complicated mold of aluminum alloy. As a result, it was seen by the simulation that the magnetic flux density at a gradual curvature of the mold was higher than at a steep curvature and the higher magnetic flux density produced the better surface roughness in the experimentation. The deviation for the surface roughness of the mold decreased on the whole and the uniform mold surface was obtained after the automated magnetic abrasive polishing.

• Journal of Korea Foundry Society
• /
• v.26 no.3
• /
• pp.123-128
• /
• 2006

Mechanical and thermal properties of spray-cast hypereutectic Al-20wt.%Si-xwt.%Fe alloys (x=0, 1, 3, 5) were investigated. After the spray-casting, hot extrusion was performed at $400^{\circ}C$. Intermetallic compound (${\beta}-Al_5FeSi$) and primary Si are observed in the spray-cast aluminum alloys. The size of primary Si and intermetallic compound of the spray-aluminum alloys became finer and more uniformly distributed than that of the permanent mold cast ones. Ultimate tensile strength of the spray-cast aluminum alloys increased by increasing Fe contents, but that of the permanent mold cast aluminum alloys decreased by increasing Fe contents possibly due to increased amount of coarse intermatallic compound. The coefficient of thermal expansion (CTEs) of the aluminum alloys became lower with finer primary Si and intermetallic compound, and this is attributed to the increased amount of interfacial area between the aluminum matrix and the phases of finer Si and intermetallic compound.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.22 no.3_1spc
• /
• pp.504-508
• /
• 2013

This paper describes in detail the life prediction models and simulations of thermal fatigue under different mold compounds and chip sizes for wafer-level embedded SiP. Three-dimensional finite element models are built to simulate the viscoplastic behaviors for various mold compounds and chip sizes. In particular, the bonding parts between a mold and silicon nitride (Si3N4) are carefully modeled, and the strain distributions are studied. Three different chip sizes are used, and the effects of the mold compounds are observed. Through the numerical studies, it is found that type-C, which has a relatively lower Young's modulus and higher CTE, has a better fatigue life than the other mold compounds. In addition, the $4{\times}4$ chip has a shorter life than the $6{\times}6$ and $8{\times}8$ chips.

• Journal of Korea Foundry Society
• /
• v.17 no.3
• /
• pp.237-244
• /
• 1997

This study has been carried out to investigate into the influence of solidification conditions mold on the structure and mechanical properties of Al-5wt%Mg alloy by metallic mold casting. The percentage of equiaxed grain of Al-5wt%Mg alloy castings increased both when pouring temperature decreased and when the low part or bottom of metallic mold was cooled. The hardness was checked and showed that hardness of outside in the castings was higher than that inside, and that it is the highest at the pouring temperature of $680^{\circ}C$. The castings had the highest U.T.S. and elongation when the bottom of metallic mold was cooled. At the same pouring temperature, the structure of castings was changed as the position of cooling parts of metallic mold was varied. When the castings were solidified through cooling of the bottom of the metallic mold, the morphology of Fe intermetallic compound has tendency to change to a Chinese script and the U.T.S. and elongation of Al-5wt.%Mg alloy castings was increased.

• Transactions of Materials Processing
• /
• v.4 no.1
• /
• pp.39-47
• /
• 1995

The compression molding of SMC (sheet molding compund) at room temperature was analyzed based on rigid-viscoplastic approach by three dimensional finite element program. The developed program was tested by solving the three dimensional compression of wedge type specimens of aluminum alloys at various processing conditions. The simulation results were compared well to the experimental results available in the literature. based on this comparison the program was proved to be valid and was further applied in solving compression molding of SMC, which is a thermosetting material reinforced with chopped fiber glass. To investigate the effects of friction conditions and mold closing speeds for compression molding of SMC charge at room temperature, compressions of the cylindrical and rectangular shaped SMC were analyzed for various friction conditions and mold closing speeds. The calculated load values were compared to the experimental results for the compression molding of cylindrical specimen.

• Transactions of Materials Processing
• /
• v.14 no.3 s.75
• /
• pp.263-268
• /
• 2005

Heating channel layout design and evaluation technology for SMC molding system was investigated in this work. Traditional rules of cooling channel design in injection molding were applied to the present work. Finite element thermal analysis with $ANSYS^{TM}$ was performed to evaluate the temperature distribution of SHC mold surface. SMC mold was manufactured to evaluate the effect of a proposed heating channel layout system on the temperature distribution of SMC mold surface and infrared camera was applied to a measurement of temperature distribution. It was shown that infrared camera application was possible in a measurement of temperature distribution on SHC mold surface.