• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.6 s.261
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• pp.659-664
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• 2007

$Moire\'{e}$ interferometry is a useful technique to assess the reliability of electronic package because $Moire\'{e}$ interferometry can measure the whole-field and real-time deformations. The shear strain of a small crack site is important to the reliability assessment of electronic package. The optical limitation of $Moire\'{e}$ interferometry makes ambiguous the shear strain of a small area. An atomic force microscope (AFM) is used to measure the profile of a micro site. High resolution of AFM can apply to the $Moire\'{e}$ technique. AFM $Moire\'{e}$ technique is useful to measure the shear strain of a small area. In this research, the method to accurately measure the deformation of a small area by using AFM $Moire\'{e}$ is proposed. A phase-shifting method is applied to improve the resolution of AFM $Moire\'{e}$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.7
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• pp.1302-1308
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• 2002

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) package are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed for several bending loads and temperatures. At the temperature higher than $100^{\circ}C$, the inelastic deformation in solder balls become more dominant, so that the bending of the molding compound decreases while temperature increases. The deformation caused by thermally induced bending is compared with that caused by mechanical bending. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder.

• Journal of Mechanical Science and Technology
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• v.18 no.2
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• pp.230-239
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• 2004

A compact model approach of a network of spring elements for elastic loading is presented for the thermal deformation analysis of BGA package assembly. High-sensitivity moire interferometry is applied to evaluate and calibrated the model quantitatively. Two ball grid array (BGA) package assemblies are employed for moire experiments. For a package assembly with a small global bending, the spring model can predict the boundary conditions of the critical solder ball excellently well. For a package assembly with a large global bending, however, the relative displacements determined by spring model agree well with that by experiment after accounting for the rigid-body rotation. The shear strain results of the FEM with the input from the calibrated compact spring model agree reasonably well with the experimental data. The results imply that the combined approach of the compact spring model and the local FE analysis is an effective way to predict strains and stresses and to determine solder damage of the critical solder ball.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.1
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• pp.160-170
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• 2002

Many of aged and damaged concrete structure have been revitalized with composite reinforcement. Flexural behaviors of composite-patched concrete specimens are characterized by high-sensitivity moire interferometry. The three-mirror, four-beam interferometry system and a compact loading system are used for obtaining singe patterns representing whole-field contour maps of in-plane displacements. It is seen from the calibration test for the loading system that the measured bending displacement is in excellent agreement with the displacement calculated by the beam theory. The crack opening displacement as well as the bending and the horizontal displacement fur the notched and unnotched specimen are investigated. The results also show that the notched specimen reinforced by a composite sheet has sufficient stiffness and strength compared to the original concrete specimen.

• Journal of the Korean Society for Nondestructive Testing
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• v.12 no.1
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• pp.16-24
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• 1992

Moire interferometry using a diffraction grating and a laser is a powerful technique for analizing small deformation of a specimen. In the method, the x and y-directional fringe patterns are obtained by using the x and y-directional sets of two beams. If the both sets of two beams are simultaneously incident to the specimen, the x and y-directional fringe patterns are super imposed. In this case, it is difficult to separate each directional fringe pattern. Therefore each fringe pattern has been separately recorded by selecting each set of two beams. In order to analyze a two-dimensional strain changing with time, Moire interferometry using the two-dimensional fourier transform method is proposed and the x and y-directional fringes are separated. By this method, the thermal deformation of a glass plate is analyzed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.28-32
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• 2003

Thermo-mechanical behavior of a ceramic ball grid array(CBGA) package assembly and wire bond ball grid array(WB-PBGA) package assemblies are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation(warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. The locations of the critical solder ball in WB-PBGA package assemblies are documented.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.5 s.170
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• pp.21-27
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• 2005

• Journal of the Korean Society for Precision Engineering
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• v.15 no.12
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• pp.169-179
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• 1998

Plane mirror type laser interferometers are popularly being used in many modern ultraprecision machines, as they can perform simultaneous measurements of multiple axis positions with nanometer resolution capabilities. One important issue in this application of laser interferometers is to provide a good level of alignment between the reflecting mirrors and the laser beams so that measurement errors due to undesirable coupling effects can be avoided in multiple axis measurements In this investigation, a thorough metrological analysis is given to develop an suitable mathematical model for a precision x-y stage in which the orthogonality misalignment between the reflecting mirrors significantly affects overall x-y mea-surement results. Then a noble calibration method is suggested in which two-dimensional displacement sensors of moire gratings of concentric circles are used to realize the reversal principle of orthogonality evaluation in situ. Finally, actual experimental results are discussed to verify that the suggested method can effectively calibrate the orthogonality error with an uncertainty of 0.2667 arcsec.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.17 no.31
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• pp.155-161
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• 1994

This study presents a systematic and mere economical method to acquire 3-D anthropometric data by the use of Moire' interferometry, image processing and computer vision techniques. An experiment was performed to measure sixty-one anthropometric variables, such as height weight neck-base circumference, contained areas of various contours etc.., of thirty-six male subjects with wide range of ages (14 years to 43 years' old). Cluster analysis was performed with contour information, and somatotyping was performed to obtain four distinct types of body shape. The results were then compared with classifications obtained from traditional somatotyping methods which showed 71.88% consistency. This study developed a simple and inexpensive method for 3-D anthropometric data acquisition and suggests the quantification and interpretation scheme that will enable us to utilize the data for industrial applications.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.424-428
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• 2005

This paper shows a non-contact optical method to inspect micron scale parts which will be manufactured in micro-factory system. This inspection system should have some characteristics like a small size, flexibility, and high measuring speed. In the viewpoint of measuring capabilities, it also has resolution under micron scale with measuring range over millimeter scale. Two methods will be presented in this paper, one is Moire and the other is white-light scanning interferometry. Also some experimental results will be presented to show the possibilities of the proposed inspection system.