• Proceedings of the KIEE Conference
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• 2015.07a
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• pp.996-997
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• 2015

This paper proposes parameter design principle of the sub-module capacitance, Arm inductance and a control method to reduced the circulating currents in modular multilevel converter(MMC) under unbalanced voltage conditions. Under balanced voltage conditions, only negative-sequence circulating currents exist. Consequently, the conventional method has considered only negative-sequence circulating currents in MMC. However, under unbalanced voltage conditions, there are positive-sequence, zero-sequence and negative-sequence circulating currents in MMC. Thus, under unbalanced voltage conditions, a control method should consider these all components. This study proposes the control method to reduced the circulating currents under the unbalanced voltage.

• Honam Mathematical Journal
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• v.18 no.1
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• pp.91-97
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• 1996

• Journal of the Korean Mathematical Society
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• v.34 no.1
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• pp.69-75
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• 1997

• Journal of applied mathematics & informatics
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• v.3 no.1
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• pp.79-88
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• 1996

In this paper we define a new short exact sequence of automata and we investigate module-like properties on projective and injective automata

• Kyungpook Mathematical Journal
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• v.63 no.3
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• pp.333-344
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• 2023

In this paper, we generalize the notions uniformly S-flat, briefly u-S-flat, modules and dimensions. We introduce and study the notions of weak u-S-flat modules. An R-module M is said to be weak u-S-flat if Tor^R₁ (R/I, M) is u-S-torsion for any ideal I of R. This new class of modules will be used to characterize u-S-von Neumann regular rings. Hence, we introduce the weak u-S-flat dimensions of modules and rings. The relations between the introduced dimensions and other (classical) homological dimensions are discussed.

• Communications of the Korean Mathematical Society
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• v.36 no.2
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• pp.257-266
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• 2021

In this paper, by using the sequence of adjointable operators from C^*-algebra 𝓐 into Hilbert 𝓐-module E, the woven frames of multipliers in Hilbert C^*-modules are introduced. Meanwhile, we study the effect of operators on these frames and, also we construct the new woven frame of multipliers in Hilbert 𝓐-module 𝓐. Finally, compositions of woven frames of multipliers in Hilbert C^*-modules are studied.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.353-359
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• 1988

In this paper, the design and implementation of a multi-processor based die bonder machine for the semiconductor will be described. This is a final research results carried out for two years from June, 1986 to July, 1988. The mechanical system consists of three subsystems such as bonding head module, wafer feeding module, and lead frame feeding module. The overall control system consists of the following three subsystems each of which employs a 16 bit microprocessor MC 68000 : (i) supervisory control system, (ii) visual recognition / inspection system and (iii) the display system. Specifically, the supervisory control system supervises the whole sequence of die bonder machine, performs a self-diagnostics while it controls the bonding head module according to the prespecified bonding cycle. The vision system recognizes the die to inspect the die quality and deviation / orientation of a die with respect to a reference position, while it controls the wafer feeding module. Finally, the display system performs a character display, image display ans various error messages to communicate with operator. Lead frame feeding module is controlled by this subsystem. It is reported that the proposed control system were applied to an engineering sample and tested in real-time, and the results are sucessful as an engineering sample phase.

• Tribology and Lubricants
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• v.31 no.6
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• pp.239-244
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• 2015

Chemical mechanical polishing (CMP) is one of the most important processes for enabling sub-14 nm semiconductor manufacturing. Moreover, post-CMP defect control is a key process parameter for the purpose of yield enhancement and device reliability. Due to the complexity of device with sub-14 nm node structure, CMP-induced defects need to be fixed in the CMP in-situ cleaning module instead of during post ex-situ wet cleaning. Therefore, post-CMP in-situ cleaning optimization and cleaning efficiency improvement play a pivotal role in post-CMP defect control. CMP in-situ cleaning module normally consists of megasonic and brush scrubber processes. And there has been an increasing effort for the optimization of cleaning chemistry and brush scrubber cleaning in the CMP cleaning module. Although there have been many studies conducted on improving particle removal efficiency by brush cleaning, these studies do not consider the effects of brush contamination. Depending on the process condition and brush condition, brush cross contamination effects significantly influence post-CMP cleaning defects. This study investigates brush cross contamination effects in the CMP in-situ cleaning module by conducting experiments using 300mm tetraethyl orthosilicate (TEOS) blanket wafers. This study also explores brush pre-treatment in the CMP tool and proposes recipe effects, and critical process parameters for optimized CMP in-situ cleaning process through experimental results.

• Communications of the Korean Mathematical Society
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• v.33 no.2
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• pp.527-533
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• 2018

Let $\mathcal{X}$ be a countably generated Hilbert module over a locally $C^*$-algebra $\mathcal{A}$ in multiplier module M($\mathcal{X}$) of $\mathcal{X}$. We propose the necessary and sufficient condition such that a sequence $\{h_n:n{{\in}}\mathbb{N}\}$ in M($\mathcal{X}$) is a standard frame of multipliers in $\mathcal{X}$. We also show that if T in $b(L_{\mathcal{A}}(\mathcal{X}))$, the space of bounded maps in set of all adjointable maps on $\mathcal{X}$, is surjective and $\{h_n:n{{\in}}\mathbb{N}\}$ is a standard frame of multipliers in $\mathcal{X}$, then $\{T{\circ}h_n:n{\in}\mathbb{N}}$ is a standard frame of multipliers in $\mathcal{X}$, too.

• International Journal of Fuzzy Logic and Intelligent Systems
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• v.3 no.2
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• pp.239-243
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• 2003

Recently, there has been active research conducted on the intelligent agent in various fields. The results have been widely applied to intelligent user-friendly interfaces. In this system, we modeled, designed, and implemented an intelligent agent system that can be applied to stock and news. Some procedures such as login sequence to the web site, process to get stock information, setting stock in concern, intelligent news system module, news analysis module, and news learning module are modeled in detail and described in block diagram level. In our experiment on stock system, it showed quite a useful alarming screen avatar result and also on news system. it successfully rearranged the order of the news according to the user's preferences.