• Title/Summary/Keyword: Module packaging

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Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation (고온동작소자의 패키징을 위한 천이액상확산접합 기술)

  • Jung, Do-hyun;Roh, Myung-hwan;Lee, Jun-hyeong;Kim, Kyung-heum;Jung, Jae Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.1
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    • pp.17-25
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    • 2017
  • Recently, research and application for a power module have been actively studied according to the increasing demand for the production of vehicles, smartphones and semiconductor devices. The power modules based on the transient liquid phase (TLP) technology for bonding of power semiconductor devices have been introduced in this paper. The TLP bonding has been widely used in semiconductor packaging industry due to inhibiting conventional Pb-base solder by the regulation of end of life vehicle (ELV) and restriction of hazardous substances (RoHS). In TLP bonding, the melting temperature of a joint layer becomes higher than bonding temperature and it is cost-effective technology than conventional Ag sintering process. In this paper, a variety of TLP bonding technologies and their characteristics for bonding of power module have been described.

RF High Power Amplifier Module using AlN Substrate (AlN 기판을 이용한 RF 고전력 증폭기 모듈)

  • Kim, Seung-Yong;Nam, Choong-Mo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.10
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    • pp.826-831
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    • 2009
  • In this paper, a high power RF amplifier module using AlN substrate of high thermal conductivity has been proposed. This RF amplifier module has the advantage of compact size and effective heat dissipation for the packaging of high power chip. To fabricate the thru-hole and scribing line on AlN substrate, the key parameters of $CO_2$ laser were experimented. And then, microstrip lines and spiral planar inductors were fabricated on an AlN substrate using the thin-film process. The fabricated microstrip lines on the AlN substrate has an attenuation value of 0.1 dB/mm up to 10 GHz. The fabricated spiral planar inductor has a high quality factor, a maximum of about 62 at 1 GHz for a 5.65 nH inductor. Packaging of a RF power amplifier was implemented on an AlN substrate with thru-hole. From the measured results, the gain is 24 dB from 13 to 15 GHz and the output power is 33.65 dBm(2.3 W).

Experimental investigation of Scalability of DDR DRAM packages

  • Crisp, R.
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.73-76
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    • 2010
  • A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

Ag Sintering Die Attach Technology for Wide-bandgap Power Semiconductor Packaging (Wide-bandgap 전력반도체 패키징을 위한 Ag 소결 다이접합 기술)

  • Min-Su Kim;Dongjin Kim
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.1
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    • pp.1-16
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    • 2023
  • Recently, the shift to next-generation wide-bandgap (WBG) power semiconductor for electric vehicle is accelerated due to the need to improve power conversion efficiency and to overcome the limitation of conventional Si power semiconductor. With the adoption of WBG semiconductor, it is also required that the packaging materials for power modules have high temperature durability. As an alternative to conventional high-temperature Pb-based solder, Ag sintering die attach, which is one of the power module packaging process, is receiving attention. In this study, we will introduce the recent research trends on the Ag sintering die attach process. The effects of sintering parameters on the bonding properties and methodology on the exact physical properties of Ag sintered layer by the realization 3D image are discussed. In addition, trends in thermal shock and power cycle reliability test results for power module are discussed.

Trasient Liquid Phase bonding for Power Semiconductor (전력반도체 패키징을 위한 Transient liquid phase 접합 기술)

  • Roh, Myong-Hoon;Nishikawa, Hiroshi;Jung, Jae Pil;Kim, Wonjoong
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.1
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    • pp.27-34
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    • 2017
  • Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

Fabrication and Characterization of Window Metallization Pattern for Optical Module Package (광모듈 패키지용 Window 의 Metallization Pattern 제작 및 특성 평가)

  • Jo Hyeon Min;Dan Seong Baek;Ryu Heon Wi;Gang Nam Gi
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.239-242
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    • 2003
  • Optical module package is a hermetic metal-ceramic package for carrying optical IC. In case of LD(laser diode) module, window is used for both the path of optical signal and hermetic sealing of package. So, window has the metallization pattern on the surface for brazing process with package wall. In this study, several method were investigated for metallization. Thin film, thick film and mixed method were used for fabrication of metallization pattern. After brazing process, hermeticity and adhesion strength were tested for characterization of metallization pattern.

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Optical coupling coefficients and packaging of optical transmitter module for optical subscriber (광가입자용 수동광정렬형 광송신 모듈에 대한 광결합 효율 및 패키징)

  • 김상곤;송민규
    • Korean Journal of Optics and Photonics
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    • v.11 no.3
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    • pp.179-186
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    • 2000
  • Optical coupling coefficients and misalignment tolerance of 155 Mbps optical transmitter module of passive alignment technology, to be usable in ATM system, B-NT (Broadband Network Termination) system, and 10 G transmission system for information super-highway networks, were calculated, compaired with it's engineer samples, and discussed. These engineer samples of -4.5 dBm maximum output power were packaged in the method of butt coupling of flat-fiber and tested reliability evaluation. Hence the cheap packaging method of optical transmitter module was researched. rched.

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Study on the extraction of characteristics of LTCC RF components (LTCC RF 소자 특성 추출에 관한 인구)

  • 유찬세;이우성;강남기;박종철
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.05a
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    • pp.214-218
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    • 2002
  • So far, many kinds of researches on the ceramic chip components and MCM-C RF module especially on the 3-dimensional ceramic module using embedded passives have been performed. LTCC system has many kinds of advantages, like low lass, low cost of process, stability of process etc.. But it's so hard to adjust the characteristics of passives in ceramic module after fabrication. So the exact prediction of behavior of components in high frequency region upper than 2 GHz must be made. In this procedure, the exact measurement is need. In this study, many kinds of measurement Jigs are compared and optimized, and measurement methods of each parameter are designed.

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Multi-layer Flexible Substrate for MCM module (MCM module을 위한 다층 연성기판의 제조)

  • Lee, Hyuk-Jae;Yoo, Jin
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.11a
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    • pp.67-67
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    • 2002
  • 패키지 기술의 개발은 저비용, 고성능, 높은 패키징 효율의 추세로 가고 있다. 이러한 추세에 따라 기판재료의 개발 및 구조의 변형이 요구된다. 패키지의 한 형태인 MCM(Multi-Chip Module)에 연성기판을 사용할 경우 fine pattern이 가능하고 부피가 작기 때문에 패키지의 효율이 좋고 또한 reel to reel process에 적용이 가능하기 때문에 대량생산의 이점을 가지고 있다. 연성기판은 좋은 전기적 특성을 가진 polyimide와 구리 층으로 구성된다. 그러나 polyimide와 구리 계층 사이에 약한 접착력과 구리로의 polyamic acid의 diffusion, 다층 기판의 제조의 어려움 등의 문제점을 남겨두고 있다. 본 연구는 일반적인 polyimide/copper가 구조가 가지고 있는 문제점을 해결하고 구리 패턴을 제작하기 위해 에칭을 쓰는 것을 배제함으로 fine pattern을 이루어 내었으며 전기도금으로 완전하게 채워진 pluged via을 사용함으로 각층간의 연결에 신뢰성을 부여하였다. 또한, 연성기판의 구조적인 문제점인 해결하여 다층 연성기판을 제조하려고 한다.

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Analyses on Airbag Sensor Signals by Different Packaging (자동차용 에어백 센서의 패키징 방법에 따른 신호 전달 해석)

  • Kim, Yeong K.;Kang, Hyun Jin;Kim, Joon Ki
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.4
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    • pp.105-109
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    • 2015
  • In this study, a new airbag sensor packaging technique of directly attachment by adhesive to the automobile frame is introduced. To assess the feasibility for the packaging, a test instrument was manufactured to examine the impact sensibility by drop tests. The conventional sensor module attached mechanically by bolts with plastic housing and the new sensor packaging were installed to aluminum channel, and the results were compared with each other. Numerical analysis was also performed to investigate the signal characteristics created by the sensors. The preliminary results showed that the pattern of the MEMS sensor signal was strongly dependent on the structural behavior of the frame where the sensors were installed, which indicated the complexity of the packaging design for proper airbag deployments.