• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.3
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• pp.265-271
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• 2008

TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.

• Proceedings of the KIPE Conference
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• 2012.11a
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• pp.103-104
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• 2012

In the AC module system, mismatch problem between AC power and constant input power is occurred. To solve this problem, electrolytic capacitor is utilized for diminishing power pulsation in PV side. However, it has disadvantages of low life span and weak in temperature. Decoupling method has been studied to reduce the capacitance and replaces electrolytic capacitor to film capacitor. This paper proposes design method for decoupling circuit which bidirectional DC-DC converter using soft switching. Proposed system is verified by design optimization and simulation results.

• Journal of IKEEE
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• v.24 no.4
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• pp.1028-1033
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• 2020

The existing in-band interference reduction method recommends the physical separation distance between wireless devices and interference signals, and the interference can be suppressed through the separation distance. If the in-band interference signals can be reduced in a wireless device, a margin can be given to the physical separation distance. Since there is an effect of extending the receiver dynamic range of receivers, it is highly useful for interference reduction and improvement method. In this paper, the structure of an in-band analog IRM(Interference Reduction Module) is proposed and the design and implementation of the proposed analog IRM are described. To design an analog IRM, the interference reduction performance according to the delay mismatch, phase error and the number of delay lines that affect the performance of the analog IRM was simulated. The proposed analog IRM composed of 16 delay lines was implemented and the implemented IRM has the interference reduction performance of about 10dB for a 5G(NR-FR1-TM-1.1) signal having a 40MHz bandwidth at a center frequency of 3.32GHz. The analog IRM proposed in this paper can be used as an in-band interference canceller.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.1-9
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• 2016

The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.

• Speech Sciences
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• v.15 no.2
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• pp.67-77
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• 2008

In this paper, we implemented a robust speech recognizer using the TMS320VC33 DSP. For this implementation, we had built speech and noise database suitable for the recognizer using spectral subtraction method for noise removal. The recognizer has an explicit structure in aspect that a speech signal is enhanced through spectral subtraction before endpoints detection and feature extraction. This helps make the operation of the recognizer clear and build HMM models which give minimum model-mismatch. Since the recognizer was developed for the purpose of controlling car facilities and voice dialing, it has two recognition engines, speaker independent one for controlling car facilities and speaker dependent one for voice dialing. We adopted a conventional DTW algorithm for the latter and a continuous HMM for the former. Though various off-line recognition test, we made a selection of optimal conditions of several recognition parameters for a resource-limited embedded recognizer, which led to HMM models of the three mixtures per state. The car noise added speech database is enhanced using spectral subtraction before HMM parameter estimation for reducing model-mismatch caused by nonlinear distortion from spectral subtraction. The hardware module developed includes a microcontroller for host interface which processes the protocol between the DSP and a host.

• The Journal of the Korea institute of electronic communication sciences
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• v.13 no.3
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• pp.539-546
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• 2018

Recently, as the solar power generation market is rapidly increasing, interest is focused on research for minimizing the output of the solar cell module. The role of the power optimizer is important when inconsistencies occur in photovoltaic power generation. In the conventional system, centralized inverter method and microinverter method are mainly used. In this paper, we analyze the problem of power generation efficiency loss due to the incompatibility of existing system configuration methods. We also proposed a module - type power compensation method that can improve the mismatch caused by shading. The proposed module - based power optimizer is implemented and compared with the existing operation method. From the simulation result, it was confirmed that the efficiency of the proposed operation method is improved compared to the existing method.

• Journal of the Korean Solar Energy Society
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• v.37 no.4
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• pp.1-11
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• 2017

Most PV modules are fabricated by 6 cell-strings with solar cells connected in series. Moreover, bypass diodes are generally installed every 2 cell-strings to prevent PV modules from a damage induced by current mismatch or partial shading. But, in the case of special purpose PV module, like as BIPV (Building Integrated Photovoltaic), the number of cell-strings per module varies according to its size. Differ from a module employing even cell-strings, the configuration of bypass diode should be optimized in the PV module with odd strings because of oppositely facing electrodes. Hence, in this study, electrical characteristics of special purposed PV module with odd string was empirically and theoretically studied depending on arrangement of bypass diode. Here, we assumed that PV module has 3 strings and the number of bypass diodes in the system varies from 2 to 6. In case of 2 bypass diodes, shading on a center string increases short circuit current of the module, because of a parallel circuit induced by 2 bypass diodes connected to center string. Also, the loss is larger, as the shading area in the center string is enlarged. Thus, maximum power of the PV module with 2 bypass diode decreases by up to 59 (%) when shading area varies from 50 to 90 (%). On the other hand, In case of 3 and 6 bypass diodes, the maximum power reduction was within about 3 (W), even the shading area changes from 50 to 90 (%). As a result, It is an alternative to arrange the bypass diode by each string or one bypass diode in the PV module in order to completely bypass current in case of shading, when PV module with odd string are fabricated.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.7-17
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• 2014

Power electronics modules are semiconductor components that are widely used in airplanes, trains, automobiles, and energy generation and conversion facilities. In particular, insulated gate bipolar transistors(IGBT) have been widely utilized in high power and fast switching applications for power management including power supplies, uninterruptible power systems, and AC/DC converters. In these days, IGBT are the predominant power semiconductors for high current applications in electrical and hybrid vehicles application. In these application environments, the physical conditions are often severe with strong electric currents, high voltage, high temperature, high humidity, and vibrations. Therefore, IGBT module packages involves a number of challenges for the design engineer in terms of reliability. Thermal and thermal-mechanical management are critical for power electronics modules. The failure mechanisms that limit the number of power cycles are caused by the coefficient of thermal expansion mismatch between the materials used in the IGBT modules. All interfaces in the module could be locations for potential failures. Therefore, a proper thermal design where the temperature does not exceed an allowable limit of the devices has been a key factor in developing IGBT modules. In this paper, we discussed the effects of various package materials on heat dissipation and thermal management, as well as recent technology of the new package materials.

• Korean Journal of Optics and Photonics
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• v.16 no.3
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• pp.201-208
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• 2005

In order to realize a 3-D stereoscopic display module with alternating illumination angles, several conditions required for a lenticular lens sheet were established, and then both the lens specification and the module structure were designed. Also the performance of the stereoscopic module and its tolerance characteristics were evaluated by simulating the intensity distribution on the observation plane with a finite-ray tracing technique. From the evaluation, it was known that an intersection area between two adjacent lenses should not be filled and that the lateral mismatch between a planar liquid crystal shutter and a lens sheet should be minimized.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.7
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• pp.809-818
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• 2007

Generally, carriers on which microwave circuits are mounted are used as building blocks of MIC module for the convenience of MIC assembly and the unit module characterization. However the interconnection of the microstrip-based carriers by wire bonding causes the serious problem of mismatch and results in the higher insertion loss as frequency becomes higher. The gap and the depth between carriers are considered as the main reason of the degradation. The CPW can be the solution to cope with such problem considering its field are dominantly concentrated on the top plane. In this paper, we propose and demonstrate the CBFGCPW to microstrip transition with the low insertion loss that can be applied without causing the MIC carrier interconnection problem.