• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.377-382
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• 2005

This paper describes the design of micro machine tools system for mechanical machining of micro/meso scale mechanical parts. The micro machining systems such as $\mu-Late$, $\mu-milling/drilling$ machine and $\mu-grinding$ machine are the basic elements constructing $\mu-factory$ which gains more attention recently because of increasing needs of mico and nano-parts in various industrial and medical area. A miniaturized 3-axis milling machine with VCM stage and air spindle and palm-top size micro-late are designed, and air bearing stage and stepwise linear motion system with PZT are studied for motion system. The micro cutting characteristics are investigated experimentally, and reconfigurable machine structures are also considered.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.1
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• pp.58-64
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• 2001

A microstrip patch antenna with B-WLL applications is designed and manufactured. To make a array antenna the size of patch antenna was miniaturized. A broad band is obtained by two additional parasitic elements, which are closely located to the main patch. The bandwidth of the manufactured antenna is 15% at the center frequency of 26.8 GHz. Radiation patterns are measured over a wide bandwidth.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.10a
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• pp.54-55
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• 2011

In recently, microstrip antenna has been used to be communication devices through compact size, lightweight, and multi-layered integration. Also miniaturized communication system is expected to be power consumption and cost savings. In this paper, Long-distance communication is possible for the purpose of micro-strip antenna design, and prototype antenna were made and analyzed by using network analyzer.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.6 no.5
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• pp.407-411
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• 2005

A simulation investigation on the circular cylindrical reentrant cavity with axial ridges and a cylindrical circumferential slot is presented. This study indicates that by properly adjusting the dimensions of the ridge sand the slot, the size of the cavity can be miniaturized to around $\lambda_0$ The simulation results using CST MWS show good agreement with past theoretical predictions and provide useful insight into fundamental concerns associated with electrically small antennas.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.6
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• pp.598-601
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• 2004

A microstrip filter has been designed and fabricated in hairpin form on a GaAs substrate and its characteristics such as the insertion loss, return loss, and bandwidth have been investigated. The presented filter is realized with relatively small size, 4.5 by 3.6 mm. The insertion loss and return loss of the filter are 1.17 dB and 30 dB, respectively. The filter exhibits 3 dB-bandwidth of 350 MHz at the center frequency, 5.890 GHz. The experimental results show good agreement with the numerical ones. However, the measured center frequency is about 100 MHz higher than the designed one.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.1
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• pp.56-60
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• 2002

A low-temperature cofired-ceramic (LTCC) multi-layer ceramic (MLC) band-pass filter (BPF) is presented, which has the benefits of low cost and small size. The BPF is designed for an IMT-2000 handset. The computer-aided design technology is also presented. The BPF with an attenuation pole at below the passband has been discussed and realized. The equivalent circuit of the BPF was established by transmission lines and lumped capacitors. The frequency characteristics of the LTCC-MLC BPF is well acceptable for IMT-2000 application.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.35-40
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• 2000

MCM technology languished troughout most of the 1990's due to high costs resulting from low yields and issues with known god die. During the last five years of the decade new developments in chip scale packages and high density, build up multi-layer printed wiring boards created new opportunities to design and produce ultra miniaturized modules using conventional surface mount manufacturing capabilities. Focus on the miniaturization of substrate based packages such as ball grid arrays (BGAs) resulted in chip scale packages (CSPs) offering many of the benefits of flip chip along with the handling, testing, manufacturing and reliability capabilities of packaged deviced. New developments in the PWB industry sought to reduce the size, weight, thickness and cost of high density interconnect (HDI) substrates. Shrinking geometries of vias and new constructions significantly increased the interconnect density available for MCM-L applications. This paper describes the most promising CSP and HDI technologies for portable products, high performance computing and dense multi-chip modules.

• Journal of Advanced Navigation Technology
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• v.28 no.2
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• pp.246-249
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• 2024

In this paper, we present a miniaturized differential line (DL) using inductance-enhanced corrugated ground planes (LCGP) for effective common-mode (CM) noise suppression in high-speed packages and printed circuit boards. The LCGP-DL demonstrates the CM noise suppression in the frequency range from 2.09 GHz to 3.6 GHz. Furthermore, to achieve the same low cutoff frequency, the LCGP-DL accomplishes a remarkable 23.2% reduction in size compared to a reference DL.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.12
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• pp.792-796
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• 2015

With high integration of electronic components, power inductors are also miniaturized. Recently, thick film processes for small size power inductors were developed and commercialized. However, the thick film process to prepare soft magnetic green sheets was not reported enough. In this study, we used Fe-Si magnetic and CIP (carbonyl iron powders) as starting materials to lead to a bimodal particle size distribution in the sheet. We proposed a newly developed 'Modified slurry preparation process' to get well dispersed condition even at high solid contents. Using the new process, it was possible to prepare a well dispersed slurry over 70 vol% of solid. BYK-103 was better than BYK-111 as dispersant in this slurry and the optimum amount was 0.6 wt%. The optimized slurry was formed into a sheet by tape casting process and then the sheet was laminated. We conformed that small size powder, large size powder, and epoxy resin were well dispersed in the green sheet.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.1
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• pp.174-179
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• 2013

This paper presents a capacitor loaded tunable bandpass chip filter using multiple split ring resonators (MSRRs) with two transmission zeros. To obtain high selectivity and minimize the chip size, asymmetric feed lines are adopted to make a pair of transmission zeros located on each side of passband. Compared with conventional filters using cross-coupling or source-load coupling techniques, the proposed filter uses only two resonators to achieve high selectivity through a pair of transmission zeros. In order to optimize selectivity and sensitivity (insertion loss) of the filter, the effect of the position of asymmetric feed line on transmission zeros and insertion loss is analyzed. The SOI-CMOS switched capacitor composed of metal-insulator-metal (MIM) capacitor and stacked-FETs is loaded at outer rings of MSRRs to tune passband frequency and handle high power signal up to +30 dBm. By turning on or off the gate of the transistors, the passband frequency can be shifted from 4GH to 5GHz. The proposed on-chip filter is implemented in 0.18-${\mu}m$ SOI CMOS technology that makes it possible to integrate high-Q passive devices and stacked-FETs. The designed filter shows miniaturized size of only $4mm{\times}2mm$ (i.e., $0.177{\lambda}g{\times}0.088{\lambda}g$), where ${\lambda}g$ denotes the guided wave length of the $50{\Omega}$ microstrip line at center frequency. The measured insertion loss (S21)is about 5.1dB and 6.9dB at 5.4GHz and 4.5GHz, respectively. The designed filter shows out-of-band rejection greater than 20dB at 500MHz offset from center frequency.