• Biotechnology and Bioprocess Engineering:BBE
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• 제9권2호
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• pp.132-136
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• 2004

The LAL (Limulus amebocyte lysate) test for the detection and quantification of endotoxin is based on the gelation reaction between endotoxin and LAL from a blood extract of Limulus polyphemus. The test is labor intensive, requiring dedicated personnel, a relatively long reaction time (approximately 1 h), relatively large volumes of samples and reagents and the detection of the end-point is rather subjective. To solve these problems, a miniaturized LOC (lab-on-a-chip) prototype, 62mm (L) ${\times}$ 18 mm (W), was fabricated using PDMS (polydimethylsiloxane) bonded to glass. Using this prototype, in which 2mm (W) ${\times}$ 44.3mm (L) ${\times}$ 100 $\mu\textrm{m}$ (D) microfluidic channel was constructed, turbidometric and chromogenic assay detection methods were compared, and the chromogenic method was found the most suitable for a small volume assay. In this assay, the kinetic-point method was more accurate than the end-point method. The PDMS chip thickness was found to be minimized to around 2 mm to allow sufficient light transmittance, which necessitated the use of a glass slide bonding for chip rigidity. Due to this miniaturization, the test time was reduced from 1 h to less than 10 min, and the sample volume could be reduced from 100 to ca. 4.4 ${\mu}$L. In summation, this study suggested that the LOC using the LAL test principle could be an alternative as a semi-automated and reliable method for the detection of endotoxin.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2008년도 춘계종합학술대회 A
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• pp.685-688
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• 2008

평면 안테나는 막대형 모노폴 안테나에 비하여 돌출부위가 없으므로 옥외 계측자동화 시설의 데이터 전송에 효과적으로 사용될 수 있다. 그러나 UHF 대역에서는 크기로 인하여 평면 안테나의 사용이 상당히 제한되고 있다. 본 논문에서는 400MHz UHF 대역의 ISM 밴드를 사용하는 AMR(Automatic Meter Reading) 시스템에 적용할 수 있는 평면 안테나의 소형화 설계를 연구하였다. 평면 안테나는 FR-4 기판의 마이크로스트립 패치 구조이며, 소형화는 패치에 슬롯을 장하하여 설계되었다. 먼저 직사각형 슬롯을 사용하여 슬롯이 안테나 소형화에 미치는 영향을 파악한 후 보다 복잡한 형태의 슬롯을 적용하여 UHF 대역에서 37.9% 크기가 감소된 안테나를 제작하였다. 제작된 안테나는 야외 설치를 위한 안테나 보호용으로 표면에 에폭시 코팅 처리가 이루어졌으며, 공진 주파수 변화에 대한 에폭시 코팅의 영향도 분석되었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국전자파학회논문지
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• 제24권3호
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• pp.348-351
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• 2013

최근 전자파를 이용하여 두뇌를 영상화하는 시스템이 제안되고 있다. 이러한 시스템은 초광대역 특성(0.5~2 GHz)과 주빔의 방향이 모든 동작 주파수 대역에서 일정하게 유지되는 소형 안테나를 요구한다. 위의 요구 조건을 만족하기 위해서 본 논문에서는 비대칭형 corrugation들을 일반 TSA에 적용하여 안테나의 크기는 14 % 감소시키고, 요구되는 동작 주파수 대역인 0.5 GHz에서 2 GHz까지 반사 손실이 10 dB 이하의 값을 가지도록 설계하였다. 특히 대칭형 corrugation들을 적용한 TSA가 가지는 주빔의 방향이 주파수에 따라 변하는 점을 개선하였고, 이러한 비대칭형 corrugated TSA는 전자파를 이용한 두뇌 영상장치의 구현을 위해서 요구되는 조건을 모두 만족한다.

• 한국전기전자재료학회논문지
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• 제28권6호
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• pp.360-364
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• 2015

Electronic systems based on solid state devices have changed to be more complicated and miniaturized as the electronic systems developed. If the electronic systems are exposed to HPEM (high power electromagnetics), the systems will be destroyed by the coupling effects of electromagnetic waves. Because the HPEM has fast rise time and high voltage of the pulse, the semiconductors are vulnerable to external stress factor such as the coupled electromagnetic pulse. Therefore, we will discuss about malfunction behavior and DFR (destruction failure rate) of the semiconductor caused by amplitude and repetition rate of the pulse. For this experiment, the pulses were injected into the pins of general purpose IC due to the fact that pulse injection test enables the phenomenon after the HPEM is coupled to power cables. These pulses were produced by pulse generator and their characteristics are 2.1 [ns] of pulse width, 1.1 [ns] of pulse rise time and 30, 60, 120 [Hz] of pulse repetition rate. The injected pulses have changed frequency, period and duty ratio of output generated by Timer IC. Also, as the pulse repetition rate increases the breakdown threshold point of the timer IC was reduced.

• 대한기계학회논문집A
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• 제36권3호
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• pp.347-353
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• 2012

최근 휴대폰은 스마트폰의 출연으로 다기능화가 요구되고 있으며, 각 보드의 전기적 신호를 연결시키는 커넥터는 필수 핵심 부품이 되었다. 커넥터는 많은 양의 전기신호를 처리하기 때문에 소형화, 협피치화가 필요하다. 하지만, 커넥터의 소형화 및 협피치화는 구조적 안전성을 저하시키며, 외부하중에 의한 접촉불량을 발생시킨다. 따라서 본 논문에서는 초소형 협피치 FPC 커넥터를 개발하기 위해 벤치마킹을 통한 초기설계안을 도출하였으며, 터미널 두께 0.2mm, 개수 50 개를 기준으로 하였다. 체결성능을 평가하기 위해 수치해석 모델을 구성하였으며, 다구찌 방법을 이용하여 형상 최적화를 수행하였다. 또한, 터미널의 한계수명을 예측하기 위해 피로해석을 수행하였으며, 체결 성능이 향상된 최종형상을 도출하였다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권4호
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• pp.239-247
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• 2001

The Fluorescence-Activated Cell Sorter (FACS) is a well-established instrument used for identifying, enumerating, classifying and sorting cells by their physical and optical characteristics. For a miniaturized FACS device, a disposable plastic microchip has been developed which has a hydrodynamic focusing chamber using soft lithography. As the characteristics of the spatially confined sample stream have an effect on sample throughput, detection efficiency, and the accuracy of cell sorting, systematic fluid dynamic studies are required. Flow visualization is conducted with a laser scanning confocal microscopy (LSCM), and three-dimensional flow structure of the focused sample stream is reconstructed from 2D slices acquired at $1\mutextrm{m}$ intervals in depth. It was observed that the flow structure in the focusing chamber is skewed by unsymmetrical velocity profile arising from trapezoidal cross section of the microchannel. For a quantitative analysis of a microscopic flow structure, Confocal Micro-PIV system has been developed to evaluate the accelerated flow field in the focusing chamber. This study proposes a method which defines the depth of the measurement volume using a detection pinhole. The trajectories of red blood cells (RBCs) and their interactions with surrounding flow field in the squeezed sample stream are evaluated to find optimal shape of the focusing chamber and fluid manipulation scheme for stable cell transporting, efficient detection, and sorting

• 한국인터넷방송통신학회논문지
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• 제16권4호
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• pp.27-30
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• 2016

본 눈문에서는 마이크로스트립 안테나의 좁은 대역폭 문제를 개선하여 IEEE 802.11의 표준 규격을 모두 포함할 수 있는 WLAN과 WiFi를 위한 3.6GHz와 5.2GHz의 대역에 만족하는 이중 대역 배열 안테나를 설계 하였다. 제안된 마이크로스트립 배열 안테나의 기판은 FR-4(er=4.3)이고, 크기는 $25mm{\times}45mm{\times}0.8mm$, 두께는 t=0.035mm이며 시뮬레이션은 CST Microwave Studio 2014를 사용하였다. 입력 대비 반사손실은 -10dB 이하에서 동작하고, 이득은 3.6GHz일 때 2.5dB, 5.2GHz일 때에는 3.5dB의 결과를 나타내었다. 소형화되어 설계된 안테나를 휴대폰 및 전자 기기에서 충분히 사용할 수 있도록 하였다.

• 한국융합학회논문지
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• 제7권6호
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• pp.29-34
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• 2016

최근 스마트 강아지인식표 등의 사물인터넷(Internet of Things, IoT) 기술을 활용하여 반려동물의 건강관리를 실시간으로 수행하는 기기가 개발되고 수요 또한 증가하고 있으나 반려동물용 IoT 기기들은 복잡한 처리가 어렵고, 단순히 센서 정보을 이용 건강상태를 파악하기 때문에 고급기능을 구현하는데 한계가 있다. 본 논문은 통계적 분석을 활용하여 맞춤형 사료제작, 의약품제작, 반려동물 건강관리 등의 반려동물에게 맞춤형 개인화서비스가 가능한 통합 플랫폼을 설계한다. 반려동물이 착용하고 있는 IoT기기로부터의 센서 정보와 쇼핑몰에서의 고객의 구매 패턴 정보, 소셜미디어(SNS) 정보를 수집하는 미들웨어를 설계 한다. 또한 이를 통해 수집한 데이터를 데이터 베이스화하고 개인화서비스에 활용될 수 있도록 수집된 정보를 정제하고 분석 및 추론 가능한 분석기를 설계 한다.