• Journal of the Korea Institute of Military Science and Technology
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• v.27 no.2
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• pp.265-276
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• 2024

The future battlefield operation concept does not focus on advanced and complete weapon systems, but requires a new battlefield operation concept that can effectively demonstrate offensive power by combining a large number of low-cost, miniaturized weapons. Recently, research on the autonomous application of major technologies that make up the mission control system is actively underway. However, since the mission control system is still dependent on the operator's operating ability when operating multiple robots, there are limitations to simply applying the automation technology of the existing mission control system. Therefore, we understand how changes in operator capabilities affect multi-robot operation and propose an adaptive mission control architecture design method that supports multi-robot integrated operation by adjusting the level of autonomy of the mission control system according to changes in operator capability.

• Biotechnology and Bioprocess Engineering:BBE
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• v.9 no.2
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• pp.132-136
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• 2004

The LAL (Limulus amebocyte lysate) test for the detection and quantification of endotoxin is based on the gelation reaction between endotoxin and LAL from a blood extract of Limulus polyphemus. The test is labor intensive, requiring dedicated personnel, a relatively long reaction time (approximately 1 h), relatively large volumes of samples and reagents and the detection of the end-point is rather subjective. To solve these problems, a miniaturized LOC (lab-on-a-chip) prototype, 62mm (L) ${\times}$ 18 mm (W), was fabricated using PDMS (polydimethylsiloxane) bonded to glass. Using this prototype, in which 2mm (W) ${\times}$ 44.3mm (L) ${\times}$ 100 $\mu\textrm{m}$ (D) microfluidic channel was constructed, turbidometric and chromogenic assay detection methods were compared, and the chromogenic method was found the most suitable for a small volume assay. In this assay, the kinetic-point method was more accurate than the end-point method. The PDMS chip thickness was found to be minimized to around 2 mm to allow sufficient light transmittance, which necessitated the use of a glass slide bonding for chip rigidity. Due to this miniaturization, the test time was reduced from 1 h to less than 10 min, and the sample volume could be reduced from 100 to ca. 4.4 ${\mu}$L. In summation, this study suggested that the LOC using the LAL test principle could be an alternative as a semi-automated and reliable method for the detection of endotoxin.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.05a
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• pp.685-688
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• 2008

Planar antennas are very efficient for the use of the out-door data transmission applications due to their low-profile characteristics. But the size of the antenna in UHF band blocks the practical usage. In this paper, a miniaturized planar antenna is investigated for the application of AMR system in UHF band. The designed antenna is fabricated in the form of the microstrip patch on the FR-4 substrate. The miniaturization is achieved by slot-loading on the patch. First, effects of simple slots on the size reduction are analyzed, followed by the design using more complex slots resulting in the reduction ratio of 37.9% in 425.6 MHz and bandwidth of 3.8 MHz. The effect of epoxy coating for the protection is also investigated.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.3
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• pp.348-351
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• 2013

Recently, a brain imaging system with microwave devices has been proposed. The brain imaging system requires a small antenna which has ultra wide band(UWB) operating frequency bandwidth(0.5~2 GHz) and non-varying boresight of antenna over the frequency band. This paper proposes asymmetric corrugations on a tapered slot antenna (TSA) so that the size of the TSA is reduced by 14 % while 10 dB return loss bandwidth is satisfied over the operating frequency band from 0.5 GHz to 2 GHz. A miniaturized TSA with symmetric corrugations shows tilted boresight whilst frequency is getting lower; however, the proposed TSA with asymmetric corrugations maintains direction of boresight for different frequencies. This enhancements make an asymmetric corrugated TSA meet the requirement of the brain imaing system.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.6
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• pp.360-364
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• 2015

Electronic systems based on solid state devices have changed to be more complicated and miniaturized as the electronic systems developed. If the electronic systems are exposed to HPEM (high power electromagnetics), the systems will be destroyed by the coupling effects of electromagnetic waves. Because the HPEM has fast rise time and high voltage of the pulse, the semiconductors are vulnerable to external stress factor such as the coupled electromagnetic pulse. Therefore, we will discuss about malfunction behavior and DFR (destruction failure rate) of the semiconductor caused by amplitude and repetition rate of the pulse. For this experiment, the pulses were injected into the pins of general purpose IC due to the fact that pulse injection test enables the phenomenon after the HPEM is coupled to power cables. These pulses were produced by pulse generator and their characteristics are 2.1 [ns] of pulse width, 1.1 [ns] of pulse rise time and 30, 60, 120 [Hz] of pulse repetition rate. The injected pulses have changed frequency, period and duty ratio of output generated by Timer IC. Also, as the pulse repetition rate increases the breakdown threshold point of the timer IC was reduced.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.3
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• pp.347-353
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• 2012

Recently, multi-functionalization (as in smart phones) has been in demand, and the connectors connecting the electrical signals of each board in a cellular phone have become key components. The miniaturization of these connectors is required to achieve a finer pitch design and enhance the electrical signal transfer capacity. However, the miniaturization of connectors reduces the structural safety, and a finer pitch design may cause contact problems under external impact. In this paper, a preliminary design for miniaturized, finer-pitch connectors is suggested for a product with 50 pins and a thickness of 0.2 mm. The assembly process of the FPCB (Flexible Printed Circuit Board) and connector was simulated to ensure the holding force between the two components and avoid overstressing. The design optimization process was performed with the Taguchi method. Fatigue analysis was also conducted to predict the fatigue life of the terminal, and the theoretical and experimental results were compared.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.4
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• pp.239-247
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• 2001

The Fluorescence-Activated Cell Sorter (FACS) is a well-established instrument used for identifying, enumerating, classifying and sorting cells by their physical and optical characteristics. For a miniaturized FACS device, a disposable plastic microchip has been developed which has a hydrodynamic focusing chamber using soft lithography. As the characteristics of the spatially confined sample stream have an effect on sample throughput, detection efficiency, and the accuracy of cell sorting, systematic fluid dynamic studies are required. Flow visualization is conducted with a laser scanning confocal microscopy (LSCM), and three-dimensional flow structure of the focused sample stream is reconstructed from 2D slices acquired at $1\mutextrm{m}$ intervals in depth. It was observed that the flow structure in the focusing chamber is skewed by unsymmetrical velocity profile arising from trapezoidal cross section of the microchannel. For a quantitative analysis of a microscopic flow structure, Confocal Micro-PIV system has been developed to evaluate the accelerated flow field in the focusing chamber. This study proposes a method which defines the depth of the measurement volume using a detection pinhole. The trajectories of red blood cells (RBCs) and their interactions with surrounding flow field in the squeezed sample stream are evaluated to find optimal shape of the focusing chamber and fluid manipulation scheme for stable cell transporting, efficient detection, and sorting

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.16 no.4
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• pp.27-30
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• 2016

in this paper, to improve the narrow bandwidth problem of the microstrip antenna for WLAN and WiFi dual band array antenna was designed to satisfy the bandwidth of 3.6GHz and 5.2GHz it contained with IEEE 802. 11. The substrate of proposed microstrip array antenna is FR-4(er=4.3) and $25mm{\times}45mm{\times}0.8mm$ size and thickness t=0.035mm, and the simulation was used for CST Microwave Studio 2014. input return loss compared -10dB less than operates at and when gain 3.6GHz 2.516dB, 5.2GHz showed the results of 3.581dB. the antenna designed to be miniaturized and the be used in electronic devices such as mobile phone.