• Journal of the Korean Institute of Telematics and Electronics B
• /
• v.32B no.7
• /
• pp.952-965
• /
• 1995

In the hypercube multiprocessor system. repeated allocations and deallocations of subcubes generate a fragmented hypercube from which. even if sufficient free processors are available, a subcube that is large enough to accomodate a new task cannot be formed. To eliminate the fragmentation, we need a processor relocation to move a task-occupied subcube to a free subcube, and gather dispersed small subcubes. In this paper, we propose a routing algorithm for task migration in circuit- switched hypercube to relocate processors. In the circuit-switched hypercube, we have to find a set of dedicated link-disjoint routing paths for each node to move a task from a busy subcube to a free subcube in fragmentation. The proposed algorithm is based on the PGC(packed Gray code) which detects all kinds of subcubes.

• Korean Journal of Materials Research
• /
• v.20 no.1
• /
• pp.19-24
• /
• 2010

The current study examined Ag migration from the Ag paste bump in the SABiT technology-applied PCB. A series of experiments were performed to measure the existence/non-existence of Ag in the insulating prepreg region. The average grain size of Ag paste was 30 nm according to X-ray diffraction (XRD) measurement. Conventional XRD showed limitations in finding a small amount of Ag in the prepreg region. The surface morphology and cross section view in the Cu line-Ag paste bump-Cu line structure were observed using a field emission scanning electron microscope (FE-SEM). The amount of Ag as a function of distance from the edge of Ag paste bump was obtained by FE-SEM with energy dispersive spectroscopy (EDS). We used an electron probe micro analyzer (EPMA) to improve the detecting resolution of Ag content and achieved the Ag distribution function as a function of the distance from the edge of the Ag paste bump. The same method with EPMA was applied for Cu filled via instead of Ag paste bump. We compared the distribution function of Ag and Cu, obtained from EPMA, and concluded that there was no considerable Ag migration effect for the SABiT technology-applied printed circuit board (PCB).

• Journal of Auto-vehicle Safety Association
• /
• v.13 no.2
• /
• pp.30-34
• /
• 2021

Electrical failures and reliability problems of electronic components by ionic migration between adjacent device terminals have become an issue in automotive electronics. Especially unlike galvanic corrosion, ionic migration is occurred at high temperature and high humidity under applied electric field condition. Until now, although extensive studies of the ionic migrations dealing with PCBs, electrodes, and solders were reported, there is no study on the effect of insulation polymers and metallic fillers for ionic migration. In this research, therefore, ionic migration induced by the types and contents of polymers and metallic fillers, and variety conditions of temperature, humidity, and applied voltage was studied in detail. Ester and amide types of liquid crystal polymer (LCP) and poly (phthalamide) (PPA) were used as base polymers, respectively and compounded with the metallic fillers of Copper iodide (CuI), Zinc stearate (Zn-st), or Calcium stearate (Ca-st) in various compositions. The compounding polymers were fabricated in IPC-B-24 of SIR test coupon according to ISO 9455-17 with Cu electrodes for ionic migration test. While there is no change in LCP-based samples, ionic migration in PPA compounding sample with a high water absorption property was accelerated in the presence of 0.25 wt% or above of CuI at the environmental conditions of 85℃, 85% RH and 48V. The dendritic short-circuit growth of Cu caused by ionic migration between the electrodes on the surface of compounded polymers was systematically observed and analyzed by using optical microscopy and SEM (EDX).

• Journal of Applied Reliability
• /
• v.5 no.2
• /
• pp.261-272
• /
• 2005

In evaluation of electronic reliability on the PCB(Printed Circuit Board), electrochemical migration is one of main test objects. The phenomenon of electrochemical migration occurs In the environment of the high humidity and the high temperature under bias through a continuous aqueous electrolyte. In this paper, the generating mechanism of electrochemical migration is investigated by using water droll acceleration test under various waters. The waters used in the water drop test are city water, distilled water and ionic water. It found that the generated velocity of electrochemical migration depended on the temperature of water and the electrolyte quantity which included in the various waters.

• Proceedings of the Korean Reliability Society Conference
• /
• 2005.06a
• /
• pp.339-348
• /
• 2005

In evaluation of electronic reliability on the PCB(Printed Circuit Board),electrochemical migration is one of main test objects. The phenomenon of electrochemical migration occurs In the environment of the high humidity and the high temperature under bias through a continuous aqueous electrolyte. In this paper, the generating mechanism of electrochemical migration is investigated by using water drop acceleration test under various waters. The waters used in the water drop test are city water, distilled water and ionic water. It found that the generated velocity o of electrochemical migration depended on the temperature of water and the electrolyte quantity which included in the various waters.

• The Journal of Information Technology
• /
• v.12 no.1
• /
• pp.21-27
• /
• 2009

Telecommunications infrastructure based on circuit switch network is rswidly migrating to "all IP" network. However migration to IP has betw slower thaw in mawy other ve "icals because the potis ial risks and adve se impact of se vice impedi is s that may result from a migration ofttw outweigh the btwefi s of IP network. IP Telephony network has several strattgy for the replace is rof the existing Privatto nranch Exchangt, the construction of new IP networks cswible of suwoo "ing multiple communication se vices and applications, includirattgytelephony and the t ofgration of the remainiratexisting Privatto nranch Exchangts t oo new IP tfor the repfrastructure. ThTele "icle suggts s the IP tfor the network infrastructure for migration.

• Journal of Applied Reliability
• /
• v.16 no.4
• /
• pp.331-337
• /
• 2016

Purpose: The purpose of this study is the analysis of the failure mechanisms effect of circuit design characteristics of the ballast for LED Lamp Methods: Recently, electronic circuit of ballasts for LED lamp are being occurred on various failure mechanisms (whiskers, ion migration, heat dissipation problem, switching element damage) because electronic ballast circuit design characteristics are becoming more and more diverse. Results: we analysis failure mechanisms that occurs in accordance with the circuit design characteristics The ballast for LED lamp were divided into three different types (Type A, Type B, Type C) considering circuit design characteristics (thermal design, PCB patten spacing, element material) and it was experimented in the acceleration test conditions ($85^{\circ}C$, 85% R.H). Conclusion: We confirmed that failure mechanism of the ballast for LED Lamp had occurred differently in accordance with the circuit design characteristics.

• KSII Transactions on Internet and Information Systems (TIIS)
• /
• v.6 no.1
• /
• pp.305-321
• /
• 2012

Since Internet Protocol (IP) is the most important protocol in Next Generation Networks (NGNs), 3rd Generation Partnership Project (3GPP) utilizes Session Initial Protocol (SIP) based on IP as the base protocol for negotiating sessions in IP Multimedia Subsystem (IMS). Different from traditional circuit-switched network, in IMS, the media traffic and signaling are delivered through IP transport. The media traffic may affect the signaling efficiency in core network, due to traffic collisions and best effort packets delivery. This paper proposes a novel path-migration mechanism for enhancing the traffic efficiency in integrated NGN-IMS. The simulation results show that the interference and traffic collision can be reduce by applying proposed path-migration mechanism and the signaling efficiency in core network can be improved with higher system capability and voice quality.

• Corrosion Science and Technology
• /
• v.6 no.2
• /
• pp.50-55
• /
• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• Journal of Ecology and Environment
• /
• v.29 no.1
• /
• pp.1-16
• /
• 2006

Environmental variables, fishing and biological data of the common squid, Todarodes pacificus were used to describe changes in structure, migration and abundance of the squid population in relation to ocean climate shifts. It was possible to consider the main groups of the squid (autumn and winter-spawned groups) as a single population to aid conservation in the waters around Korea and Japan (TWC and KOC regions). The patterns of yearly fluctuations in abundance of the squid population in the two regions were the same during 52 years of $1952{\sim}2003$. The abundance of the squid began to decrease in both regions in the early 1970s, remained low in the 1980s and the main squid groups synchronously increased in the 1990s coincident with favorable changes of thermal conditions and plankton production in those ecosystems. The mechanisms of changes in the structure, distribution and abundance of common squid population in relation to current-mediated migration circuits are explained on the basis of phenological variables responding to climate shifts.