• Korean Journal of Materials Research
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• v.9 no.5
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• pp.491-495
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• 1999

In this study, we focus on Ca contaminant which affects on the roughness Si substrate after thermal process. The initial Si substrates were contaminated intentionally by using a standard Ca solution. The contamination levels of Ca impurity were measured by TXRF and the chemical composition of that was analyzed by AES. Then we gre the thermal oxide to investigate the effect of Ca contaminants. The microroughness of the Si surface, the thermal oxide surface, and the surface after removing the thermal oxide were measured to examine the electrical characteristics. The initial substrates that were contaminated with the standard solution of Ca exhibited the contamination levels of 10\ulcorner~10\ulcorneratoms/$\textrm{cm}^2$ which was measured by TXRF. The Ca contaminants were detected by AES and exhibited the peaks of Ca, SI, C and O.After intentional contamination, the surface microroughness of this initial substrate was increased from $1.5\AA$ to 4$\AA$ as contamination levels became higher. The microroughness of the thermal oxide surfaces of both contaminated and bare Si substrates exhibits similar values. But the microroughness of the contaminated$ Si/SiO_2$ interface was increased as contamination increased. The thermal oxide of contaminated substrate exhibited the small minority carrier diffusion length, low breakdown voltage, and slightly high leakage current.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1296-1299
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• 2004

MIM capacitor has been investigated for the next generation DRAM. Conventional poly-Si bottom electrode cannot satisfy the requirement of electrical properties and comparability to the high k materials. New bottom electrode material such as ruthenium has been suggested in the fabrication of MIM structure capacitor. However, the ruthenium has to be planarized due to the backend scalability. For the planarization CMP has been widely used in the manufacture of integrated circuit. In this research, ruthenium thin film was Polished by CMP with cerium ammonium nitrate (CAN)base slurry. HNO3 was added on the CAN solution as an additive. In the various concentration of chemical and alumina abrasive, ruthenium surface was etched and polished. After static etching and polishing, etching and removal rate was investigated. Also microroughness of surface was observed by AFM. The etching and removal rate depended on the concentration of CAN, and HNO3 accelerated the etching and polishing of ruthenium. The reasonable removal rate and microroughness of surface was achieved in the 1wt% alumina slurry.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.770-776
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• 2003

#140 mesh and #600 mesh wheels were adopted to grind (111) and (100) oriented single crystalline silicon wafer and the grinding induced change of the surface integrity was investigated. For this purpose, microroughness, residual stress and phase transformation were analyzed for the ground surface. Microroughness was analyzed using AFM (Atomic Force Microscope) and crystal structure was analyzed using micro-Raman spectroscopy. The residual stress and phase transformation were also analyzed after thermal annealing in the air. As a result, microroughness of (111) wafer was larger than that of (100) wafer after grinding. It was observed using Raman spectrum that the silicon was transformed from diamond cubic Si-I to Si-III(body centered tetragonal) or Si-XII(rhombohedral). Residual stress relaxation was also shown in cavities which were produced after grinding. The thermal annealing was effective for the recovery of the silicon phase to the original phase and the residual stress relaxation.

• Journal of the Korean Ceramic Society
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• v.36 no.8
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• pp.863-870
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• 1999

SOI(silicon on insulafor) was fabricated through the direct bonding using (100) Si wafer and 4$^{\circ}$off (100) Si wafer to investigate the stacking faults in silicon at the Si/SiO2 oxidized and bonded interface. The treatment time of wafer surface using MSC-1 solution was varied in order to observe the effect of cleaning on bonding characteristics. As the MSC-1 treating time increased surface hydrophilicity was saturated and surface microroughness increased. A comparison of surface hydrophilicity and microroughness with MSC-1 treating time indicates that optimum surface modified condition for time was immersed in MSC-1 for 2 min. The SOI structure directly bonded using (100) Si wafer and 4$^{\circ}$off (100) Si wafer at the room temperature were annealed at 110$0^{\circ}C$ for 30 min. Then the stacking faults at the bonding and oxidation interface were examined after the debonding. The results show that there were anomalies in the gettering of the stacking faults at the bonded region.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.107.4-107
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• 1998

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.32 no.5
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• pp.26-43
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• 2000

It is well accepted that gloss variation deteriorates the print quality and there are various objective ways to measure this. Several studies now have shown that the coefficient of variation in the octave band passed printed gloss image has an excellent correlation with ratings by an expert panel using a magnitude estimation scaling method. The correlation improves when the gloss level is also taken into account beyond that of the COV. There is also evidence that the correlation would improve even more if the gloss spatial distribution could be better accounted for. We show that much (at least 80% and perhaps up to 90%) of the gloss distribution can be accounted for by the paper topography over a wide range of dimensions (scale). Recent work has supported the role that microroughness and multiple surface scattering play in the gloss distribution. This offers the promise of showing that even a greater amount of gloss variationcan be explained by topography.

• Korean Journal of Optics and Photonics
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• v.1 no.1
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• pp.73-86
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• 1990

The technique of Spectroscopic Ellipsometry (SE) has been examined with emphasis on its inherent sensitivity to the existence of thin films or surface equivalents. A brief review of related theories like the Fresnel reflection coefficients, the effect of a multilayer upon reflectivities, together with the validity of the effective medium theory and the modelling procedure, is followed by a short description of the experimental setup of a rotating polarizer type SE as well as the necessful expressions which lead to tan and cos. Out of its numerous, successful applications, a few are exampled to convince a reader that SE can be applied to a variety of research fields related to surface, interface and thin films. Specifically, those are adsorption and/or desorption on metals or semiconductors, oxidation process, formation of passivation layers on an electrode, thickness determination, interface between semiconductor and its oxide, semiconductor heterojunctions, surface microroughness, void distribution of dielectric, optical thin films, depth profile of multilayered samples, in-situ or in-vitro characterization of a solid surface immersed in electrolyte during electrochemical, chemical, or biological treatments, and so on. It is expected that the potential capability of SE will be widely utilized in a very near future, taking advantage of its sensitivity to thin films or surface equivalents, and its nondestructive, nonperturbing characteristics.

• Korean Journal of Optics and Photonics
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• v.8 no.4
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• pp.277-282
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• 1997

The complex refractive index of Diamond-like Carbon (DLC) thin films, which can be applied to optical devices or electrical devices, have been determined using optical methods. DLC thin films are grown on Si(100) substrates and vitreous silica substrates respectively, using the technique of plasma enhanced chemical vapor deposition (PECVD). The spectroscopic ellipsometry data($\psi$, $\Delta$) and the transmission spectra of these DLC films are obtained. These optical spectra are analyzed with the help of the Sellmeier dipersion relation and a quantum mechanically derived dispersion relation. Using spectroscopic ellipsometry data at their transparent region, the refractive index and the effective thickness of DLC films on vitreous silica are model calculated, Then the transmission spectra are inverted to yield the extinction coefficient spectra k(λ) at absorbing region. These spectra are fit to the quantum mechanical dispersion relation and the best fit dispersion constants are determined. The complex refractive indices are easily calculated with these constants. The spectroscopic ellipsometry data at the absorbing region in model calculated to give the packing densities and the degrees of surface microroughness of DLC films. Discussions are made in correlation with the growth condition of DLC films.

• Journal of the Korean Chemical Society
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• v.47 no.6
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• pp.608-613
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• 2003

In order to remove particles on surface of post-oxide CMP wafer, new cleaning solution was prepared by mixing with DHF (Diluted HF), nonionic surfactant PAAE (Polyoxyethylene Alkyl Aryl Ether), DMSO (Dimethylsulfoxide) and D.I.W.. Silicone wafers were intentionally contaminated by silica, alumina and PSL (polystylene latex) which had different zeta potentials in cleaning solution. This cleaning solution under megasonic irradiation could remove particles and metals simultaneously at room temperature in contrast to traditional AMP (mixture of $NH_4OH,\;H_2O_2$ and D.I.W) without any side effects such as increasing of microroughness, metal line corrosion and deposition of organic contaminants. This suggests that this cleaning solution would be useful future application with copper CMP in brush cleaning process as well as traditional post CMP cleaning process.

• Nuclear Engineering and Technology
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• v.21 no.3
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• pp.165-170
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• 1989

The strain rate effects on fracture toughness and fracture resistance characteristics of A533B-1 nuclear pressure vessel steels were examined in the quasi-dynamic test conditions through the microscopic investigation of the intense strain region around crack tip and the microroughness of fracture surface. J-value calculated from the recrystallization etch technique was the same as calculated from the modified-J when the crack extension is less than 1.5mm in a 1/2T-CT specimen. Local fracture strain was calculated from the fracture surface micro-roughness. The local strains were calculated to be the values of 1.8 and 2.0 and were much higher than the macroscopically measured values. It was nearly independent on strain rate and was regarded as a material constant in ductile dimpled rupture. The fracture toughness increased with increase in strain rate while the tearing modulus showed little variation.