• 제목/요약/키워드: Micronization

검색결과 25건 처리시간 0.027초

난용성 약물의 용출 증가(제4보) -재결정법에 의한 푸로세미드의 미세화- (Enhancement of Dissolution Properties of Poorly Soluble Drugs(IV) -Micronization of Furosemide by Recrystallization Method-)

  • 고익배;신상철;오인준
    • Journal of Pharmaceutical Investigation
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    • 제18권2호
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    • pp.55-59
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    • 1988
  • The size of furosemide was reduced by the recrystallization method in order to increase the dissolution rate of the drug. Surfactants or hydrophilic polymers were used to suppress the aggregation in the crystal formation-growth process of microparticles by dispersing action. Dissolution rate of microparticles increased remarkably due to the size reduction of microparticle. The particle size decreased with increasing the concentration of the drug and the dispersing agents, i.e., surfactants or hydrophilic polymers. No polymorphic transition occurred during the microcrystallization process, but the habit of crystal formation was altered in the case of anionic surfactant.

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SOI 웨이퍼의 열적거동 해석 (Thermal Behaviors Analysis for SOI Wafers)

  • 김옥삼
    • 한국마린엔지니어링학회:학술대회논문집
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    • 한국마린엔지니어링학회 2000년도 춘계학술대회 논문집(Proceeding of the KOSME 2000 Spring Annual Meeting)
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    • pp.105-109
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    • 2000
  • Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor the size of the pressure sensor diaphragm have become smaller year by year and a microaccelerometer with a size less than 200-300${\mu}m$ has been realized. In this paper we study some of the micromachining processes of SOI(silicon on insulator)for the microaccelerometer and their subsequent processes which might affect thermal loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in structural engineering discipline for design of SOI wafers. Successful thermal behaviors analysis and design of the SOI wafers based on the tunneling current concept using SOI wafer depend on the knowledge abut normal mechanical properties of the SCS(single crystal silicon)layer and their control through manufacturing process

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5 nm 급 반도체 배선 공정 기술 개발 (Development of Interconnect Process Technology for 5 nm Technology Nodes)

  • 최은미;표성규
    • 마이크로전자및패키징학회지
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    • 제23권4호
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    • pp.25-29
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    • 2016
  • The semiconductor industry has been developed mainly by micronization process due to many advantages of miniaturization of devices. Mass production of semiconductors of 10 nm class has been started recently, and it is expected that the technology generation of 5 nm & 7 nm technology will come. However, excessive linewidth reduction affects physical limits and device reliability. To solve these problems, new process technology development and new concept devices are being studied. In this review, we introduce the next generation technology and introduce the advanced research for the new concept device.

유한요소법을 이용한 SCS 절연 웨이퍼의 온도분포 해석 (Analysis of Temperature Distribution using Finite Element Method for SCS Insulator Wafers)

  • 김옥삼
    • 동력기계공학회지
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    • 제5권4호
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    • pp.11-17
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    • 2001
  • Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor, the size of the pressure sensor diaphragm have become smaller year by year, and a microaccelerometer with a size less than $200{\sim}300{\mu}m$ has been realized, In this paper, we study some of the bonding processes of SCS(single crystal silicon) insulator wafer for the microaccelerometer. and their subsequent processes which might affect thermal loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in micro structural engineering discipline for design of SCS insulator wafers. Successful temperature distribution analysis and design of the SCS insulator wafers based on the tunneling current concept using microaccelerometer depend on the knowledge about normal mechanical properties of the SCS and $SiO_2$ layer and their control through manufacturing processes.

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극저온 볼 밀링을 통한 Ibuprofen 분말의 마이크로화 (Micronization of Ibuprofen by Cryogenic Ball Milling)

  • 조현갑;이경엽;백영남;박훈재;이상목
    • 한국정밀공학회지
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    • 제21권11호
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    • pp.195-199
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    • 2004
  • For the present study, the cryogenic ball milling process was applied to make Ibuprofen microsized. The cryogenic ball milling was performed at low temperature of about -18$0^{\circ}C$ for 6 hours. The particle size distribution was determined before and after the cryogenic process. X-ray diffraction (XRD) measurement was made to determine the effect of cryogenic process on the crystallinity of Ibuprofen. The results showed that the size of Ibuproffn was reduced about 10 times by the cryogenic process. The degree of crystallinity of Ibuproffn was slightly reduced by the cryogenic process.

초임계 이산화탄소를 이용한 미립 항비듬제 제조 (Preparation of Micronized Anti-dandruff Agents Using Supercritical Carbon Dioxide)

  • 신문삼
    • 대한화장품학회지
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    • 제34권3호
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    • pp.209-215
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    • 2008
  • 화장품, 의약품에서 항비듬제로 널리 사용되는 요도프로피닐 부틸카바메이트와 클림바졸을 초임계 유체를 이용하여 미세입자를 제조하였다. 초임계 유체로는 임계온도와 임계압력이 상대적으로 낮은 이산화탄소가 사용되었다. 초임계 이산탄소에 용해력이 있는 요도프로피닐 부틸카마메이트와 클림바졸을 항비듬제로 선택되었다. 초임계 용액 급속팽창법을 이용하여 압력과 온도를 변화시켜 입자크기와 형상에 미치는 영향을 분석하였다.

Improvement of bioavailability of poorly water soluble drugs by size reduction technique

  • Choi, Woo-Sik;Kim, Hyun-Il;Kwak, Seong-Shin;Choi, Hee-Kyu;Ha, Jong-Hak;Hwang, Sun-Hwan;Lee, Dong-Beom
    • 대한약학회:학술대회논문집
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    • 대한약학회 2003년도 Proceedings of the Convention of the Pharmaceutical Society of Korea Vol.2-2
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    • pp.225.2-226
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    • 2003
  • The prolonged mechanical grinding process may enhance the bioavailability of the drugs due to the change of solid state such as micronization and decrease of crystallinity. A series of attempts to enhance the bioavailability of insoluble drugs have been made by the fine grinding technique using a planetary mill. The objective of the present study is to investigate the possibility of improving the dissolution properties of poorly water- soluble drugs such as diphenyl hydrantoin (phenytoin) and diphenyl dimethyl dicarboxylate (DDB) based on the molecular interaction between drug and additives during pharmaceutical processing to be related with the bioavailability behavior. (omitted)

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High Pressure Liquid Jet Technology for Nano Particles Production

  • Mazurkiewicz, Marian;Rhee, Chang-Kyu;Weglinski, Bogumil
    • 한국분말재료학회지
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    • 제15권5호
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    • pp.411-421
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    • 2008
  • Principles and historical background of high pressure liquid jet (HPLJ) technology is presented in the paper. This technology can be applied, among others, for production of nano particles. This target can be achieved in various type of disintegration systems developed and designed on the base of this technology. The paper describes principles of two examples of such systems: HPLJ-reactor, called also a linear comminuting system, HPLJ- centrifugal comminuting system, which prototypes have been manufactured. A linear mill, being high energy liquid jet reactor, has been developed and tested for micronization of various types of materials. The results achieved so far, and presented in the paper, show its potential for further improvement toward nano-size particle production. Flexibility of adjustment of the reactors and the mechanism of the process allows for the creation of particles with unprecedented rheology. The reactor can be especially suitable to micronize, mix and densify materials with a wide range of mechanical properties for various industrial needs. Presented prototypes of comminution systems generate interesting potentials toward production of nano particles. Their performance, based on up today research, confirms expected high efficiency of materials disintegration, which opens a new challenge for industrial applications. The paper points out benefits and area of possible applications of presented technology.

턴널전류 효과를 이용한 미소가속도계의 마이크로머시닝 공정에서 온도분포 해석 (Analysis of the Temperature Distribution at Micromachining Processes for Microaccelerometer Based on Tunneling Current Effect)

  • 김옥삼
    • 한국생산제조학회지
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    • 제9권5호
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    • pp.105-111
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    • 2000
  • Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor, the size of the pressure sensor diaphragm have become smaller year by year, and a microaccelerometer with a size less than 200~300${\mu}{\textrm}{m}$ has been realized. Over the past four or five years, numerical modeling of microsensors and microstructures has gradually been developed as a field of microelectromechanical system(MEMS) design process. In this paper, we study some of the micromachining processes of single crystal silicon(SCS) for the microaccelerometer, and their subsequent processes which might affect thermal and mechanical loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in structural engineering discipline for component design of microaccelerometer. Temperature rise sufficiently low at the suspended beams. Instead, larger temperature gradient can be seen at the bottom of paddle part. The center of paddle part becomes about 5~2$0^{\circ}C$ higher than the corner of paddle and suspended beam edges.

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디지털 프린팅 공정을 위한 세라믹 안료의 미립화 거동 분석 (Micronization of Ceramic Pigments for Digital Ink-Jet Printing Process)

  • 이지현;황해진;권종우;김진호;황광택;한규성
    • 한국재료학회지
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    • 제27권2호
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    • pp.82-88
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    • 2017
  • Ink-jet printing techniques with ceramic ink, which contains ceramic pigments as colorant, are in increasingly use in the ceramic industry. Generally, ceramic pigments that are produced by conventional method show diameters of several micrometers; these micrometer sized particles in the ink-jet printing process can cause undesirable behavior such as print head nozzle clogging. To prevent this problem, a particle size reduction process is required. In this study, CMYK (cyan, magenta, yellow, black) pigments were synthesized via solid state method. Each pigment particle was milled to submicron size by an attrition mill. The effects of micronizing on the morphology, mechanical property, crystal structure and color property of the CMYK ceramic pigments were investigated by field emission scanning electron microscopy (FE-SEM), particle size analysis (PSA), X-ray diffraction (XRD) and CIE $L^{\ast}a^{\ast}b^{\ast}$.