• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.51-51
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• 2009

In order to understand the properties of high heat input welds made by electro gas welding, two kinds of low temperature steel were welded. Welding heat inputs were controlled by width of root gap and ranged from 118 to 143kJ/cm. Chemical composition and micro-structural analysis were performed. To understand low temperature impact properties, Charpy impact test was conducted at several temperatures. The results were summarized as follows; 1) Grain size of weld metal and heat affected zone was increased with an increase in welding heat input. 2) Impact test values at fusion line were severely fluctuated regardless of base metals, showing enormous difference among the values at the same test temperature.

• Journal of Welding and Joining
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• 제33권4호
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• pp.44-49
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• 2015

The structural epoxy adhesive used in car body assembly needs the highest level of joint mechanical strength under lap shear, T-peel and impact peel conditions. In this study, the effect of nano functionalized block copolymer addition on the impact peel strength of epoxy adhesive was investigated. DSC analysis showed that the addition of nano functionalized block copolymer did not affect the curing reaction of epoxy adhesive. From single lap shear test, it was found out that the addition of nano functionalized block copolymer slightly decreased the cohesive strength of cured adhesive layer. The addition of nano functionalized block copolymer showed beneficial effect on T-peel strength by changing the adhesive failure mode to the mixed mode. However, the addition of nano functionalized block copolymer just decreased the room temperature impact peel strength. It was considered that the addition of nano functionalized block copolymer could have effect on disturbing the crack propagation only for the case of slow strain rate.

• Journal of Welding and Joining
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• 제33권5호
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• 한국해양공학회지
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• 제1권1호
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• pp.120-126
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• 1987

In this paper, the optimizing investigation of characteristics of underwater welding by a gravity type arc welding process is experimentally carried out by using the .phi. 4mm ilmenite type of domestic coated welding electrodes for welding the domestic marine structural steel plates of 8mm thickness in order to develop the underwater welding techniques in practical use, resulting in the quantitative analysis possibility for the relationship between the mechanical propernical properties of underwater welded joint HAZ and the welding heat input.

• Journal of Welding and Joining
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• 제31권3호
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• Journal of Welding and Joining
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• 제34권4호
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• pp.23-27
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• 2016

A 3D printed metal part and thermal plastic polymer part were joined by direct laser irradiation. The 3D metal part was fabricated by using DED(Direct Energy Deposition) with STS316 material. The experiment was carried out through no patterned metal surface, 3D metal printed surface and micro laser patterned surface. The most secure joining quality was obtained at the laser micro patterned surface specimen and the counterparts of polymers were PLA and PE based thermo plastics. The applied laser power was 350Watt and the distance of patterns was maintained at $150{\mu}m$. The laser line width was optimized at $450{\mu}m$ and the laser micro pattern depth was $180{\mu}m$ for the best joining quality. Based on the result analysis, the possibility of laser material joining for metal to polymer was proposed and multi-material joining will be possible in 3D laser direct material fabrication.

• International Journal of Korean Welding Society
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• 제2권2호
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• pp.19-25
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• 2002

In recent years, techniques for micro-assembly with high repeatability under a scanning electron microscope (SEM) are required to construct highly functional micro-devices. Adhesion phenomenon is more significant for smaller objects, because adhesional force is proportional to size of the objects while gravitational force is proportional to the third power of it. It is also known that adhesional force between micro-objects exposed to Electron Beam irradiation of SEM increases with the elapsed time. Therefore, mechanical manipulation techniques using a needle-shaped tool by adhesional force are often adopted in basic researches where micro-objects are studied. These techniques, however, have not yet achieved the desired repeatability because many of these could not have been supported theoretically. Some techniques even need the process of trial-and-error. Thus, in this paper, mechanical and adhesional micro-manipulation are analyzed theoretically by introducing new physical factors, such as adhesional force and rolling-resistance, into the kinematic system consisting of a sphere, a needle-shaped tool, and a substrate. Through this analysis, they are revealed that how the micro-sphere behavior depends on the given conditions, and that it is possible to cause the fracture of the desired contact Interfaces selectively by controlling the force direction in which the tool-tip loads to the sphere. Based on the acquired knowledge, a mode diagram, which indicates the micro-sphere behavior for the given conditions, is designed. By referring to this mode diagram, the practical technique of the pick and place manipulation of a micro-sphere under an SEM by the selective interface fracture is proposed.

• Journal of Advanced Marine Engineering and Technology
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• 제11권3호
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• pp.45-52
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• 1987

Generally the factors affected largely by the cold cracking sensitivity of the weld are the quantity of the diffusible hydrogen, the brittleness and hardness of the bond area and the tensile restraint stress. These factors have relation each other, and if we can reduce one of these factors, it becomes instrumental to the root cracks prevention of weld. This study deals with the gravity type-underwater-welding of KR Grade A-3 marine steel plate using E4303 welding electrode in order to compare wet-underwater-welding with in-air- welding, resulting in obtaining the tensile restraint characteristics, the hardness distribution, the quantity of diffusible hydrogen and the macro- and micro-crack properties in both underwater and in-air welds. The main results obtained are as follows: 1) The quantity of diffusible hydrogen measured for 48 hours is about 18cc/100g-weld-metal for the in-air-weld of one pass and about 48cc/100g-weld-metal for the underwater-weld of one pass which is about 3 times penetration of diffusible hydrogen compairing with the case of the in-air-weld. However, it was experimentally confirmed that, by the multi-pass welding of 2 to 5 passes, the diffusible hydrogen in the underwater weld metal can be reduced as much as 27 to 49%. 2) The hardness of the weld metal indicates the highest value in the heat affected zones of underwater weld for more rapid cooling rate, resulting in the higher sensitivity of cold cracking. So, it is desirable to soften the higher hardness in the HAZ by tempering effect such as the multi-pass welding in the underwater welding. 3) At the bond vicinity of the underwater weld HAZ, micro cracks were found as resulted by both more rapid cooling rate and more diffusible hydrogen and also by the stress corrosion cracking under the tensile restraint stress in the underwater. But this could be prevented by the tempering effect of the following weld bead such as the multi-pass welding.

• Journal of Welding and Joining
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• 제21권5호
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• pp.568-574
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• 2003

In the welding for the steel structure of H-beam with mild steel and 490N/$\textrm{mm}^2$ high tensile steel, we applied the fillet weld mostly and 6-8mm weld length(AISC-spec.). And a new developed metal-cored-wire is used in automatic welding as well as semi-automatic welding. In this study we have attempted to raise the welding productivity and to stabilize the quality on horizontal positions of fillet welding with the following items: - We improved the weld productivity using metal based cored wire with a high deposition rate in the steel structure of H-beam. - We tested the weldability and evaluated the quality of the weldmetal by horizontal fillet $CO_2$ welding. The process is carried out in combination with a special purpose metal-based FCW with excellent resistance to porosity and high welding speed. - We studied the micro structure of the weldmetal by the various welding conditions. - We studied the effect of welding residual stress by the welding conditions in T-joint. Therefore, it can be assured that more productive and superior quality of the weldmetal can be taken from this study results.

• Journal of Welding and Joining
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• 제13권2호
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.