• 한국전기전자재료학회논문지
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• 제22권2호
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• pp.123-127
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• 2009

In order to get more higher integration density of devices, it is getting to be used more and more micro via interconnection lines for interconnecting layers or devices. However, it is very important to enhance the electrical characteristic by reducing the electrical resistivity of micro via interconnection line because it affects the reliability of packaging. In this paper, Micro vias were patterned with a diameter from 10 to 100 um by increasing the step of 10 um and 100 um height and were fabricated by micromachining technology to investigate the electrical characteristic of micro via interconnection lines. These micro vias were filled with copper by electroplating process with appling pulse current mode. And the electrical characteristics of micro via interconnection lines were measured. The measured value of electrical resistivity shows with a range from 20 to $26\;m{\Omega}$. This value from micro via interconnection lines fabricated by pulse current mode electroplating process shows better result than the resistivity from than micro via interconnection lines fabricated by DC mode ($31\;m{\Omega}$).

• 전력전자학회논문지
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• 제19권2호
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• pp.157-163
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• 2014

This paper proposes a two-stage step-down buck and a tapped-inductor boost cascaded converter for high efficiency photovoltaic micro-inverter applications. The proposed inverter is a new structure to inject a rectified sinusoidal current into a low-frequency switching inverter for single-phase grid with unity power factor. To build a rectified-waveform of the output current. the converter employs both of a high efficiency step-up and a step-down converter in cascade. In step-down mode, tapped inductor(TI) boost converter stops and the buck converter operates alone. In boost mode, the TI converter operates with the halt of buck operation. The converter provides a rectified current to low frequency inverter, then the inverter converts the current into a unity power-factor sinusoidal waveform. By applying a TI, the converter can decrease the turn-on ratios of the main switch in TI boost converter even with an extreme step-up operation. The performance validation of the proposed design is confirmed by an experimental results of a 120W hardware prototype.

• 한국공작기계학회논문집
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• 제18권1호
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• pp.36-41
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• 2009

This paper presents the development of a micro punching system with modified cymbal mechanism. To realize the micro punching, we introduced the hybrid system with a macro moving part and micro punching part. The macro moving part consists of a ball screw, a linear guide and the micro step motor and micro punching part includes the PZT actuators and displacement amplification device with modified cymbal mechanism. The PZT actuator is capable of producing very large force, but they provide only limited displacements which are several micro meters. Thus the displacement amplification device is necessary to make those actuators more efficient and useful. For this purpose, a cymbal mechanism in series is proposed. The finite element method was used to design the cymbal mechanism and to analyze the mode shape of the one. The displacement and mode shape error between the FEM results and experiments are within 10%. A considerable design effort has been focused on optimizing the flexure hinge to increase the output displacement and punching force.

• 한국생산제조학회지
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• 제9권1호
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• pp.38-44
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• 2000

The background of this study lies in he investigation of the formation mechanism of ductile mode(nkanometer-size) chips of brittle materials such as fine ceramics glass and silicon. As the first step to achieve this purpose this paper intends to observe the micro-deformation behavior of these materials in sub${\mu}{\textrm}{m}$ depth indentation tests using a diamond indentor. In this study it was developed Ultra-Micro Indentation. Device using the PZT actuator. Experimentally by using the Ultra-Micro Indentation device the micro fracture behavior of the silicon wafer was investigated. It was possible that ductile-brittle transition point in ultimate surface of brittle material can be detected by adding an acoustic emission sensor system to the Ultra-Micro Indentation appartus.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2366-2371
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• 2007

Spray combustion characteristics of a conducting fuel electrospray have been studied for clean combustion technology. The multiplexing system which can retain the characteristics of the cone-jet mode is inevitable for the electrospray application. Charged micro droplets can be obtained in almost uniform size during operating the electrospray in the cone-jet mode. This experiment device set up the multiplexed grooved nozzle system with the extractor. Using the grooved nozzle, the stable cone-jet mode can be achieved at the each groove in the grooved mode. This electrospray system was applied to the diffusion combustion. It is the first step to discover the diffusion combustion characteristics of the electrospray. In case of the single grooved nozzle electrospray, the diffusion flames are occurred at each jet of grooved mode and they are quite stable. The exhaust gas analysis was indicated that there is the critical point which can make very stable diffusion combustion.

• 대한기계학회논문집B
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• 제31권12호
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• pp.979-985
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• 2007

Spray combustion characteristics of the conducting fuel electrospray has been studied for clean combustion technology. The electrospraying multiplexed system which can maintain the characteristics of the cone-jet mode is able to obtain charged micro droplets with high flow rate. In addition, they have monodisperse distribution during operating the electrospray in the cone-jet mode. The multiplexed grooved nozzle system with the extractor was applied to this experimental device set up. The stable grooved mode can be generated by the grooved nozzle and this electrospray system was applied to the diffusion combustion. It is the first step to discover the diffusion combustion characteristics of the electrospray, In case of the single grooved nozzle electrospray the diffusion flames are occurred at each Jet of grooved mode and they are quite stable. The exhaust gas analysis was indicated that there is the critical point which can make very stable diffusion combustion

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1995년도 Proceedings of the Korea Automation Control Conference, 10th (KACC); Seoul, Korea; 23-25 Oct. 1995
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• pp.211-214
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• 1995

A precise open-loop positioning system using linear pulse motor has been developed. The system is operated in a microstepping mode by controlling the electric current. One step of 508 .mu.m (tooth pitch of the linear pulse motor) is divided into 508 micro-steps equally. The displacement is measured with a system using a Fiezeau-type interferometer. Periodical positioning error with a period of the tooth pitch was observed in this system. Therefore, the position is corrected using the error. The error is stored into computer in advance, and the microstep current is corrected on basis of the stored data. Although the positioning error of the system without the correction was .+-.4.5 .mu.m, that with the correction was decreased to .+-.1.0 .mu.m.

• Transactions on Electrical and Electronic Materials
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• 제3권1호
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• pp.30-37
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• 2002

A focusing grating coupler (FGC) was not fabricated by the 'Continuous Path Control'writing strategy but by an electron-beam lithography system of more general exposure mode, which matches not only the address grid with the grating period but also an integer multiple of the address grid resolution (5 nm). To more simplify the fabrication, we are able to reduce a process step without large decrease of pattern quality by excluding a conducting material or layer such as metal (Al, Cr, Au), which are deposited on top or bottom of an e-beam resist to prevent charge build-up during e-beam exposure. A grating pitch period and an aperture feature size of the FGC designed and fabricated by e-beam lithography and reactive ion etching were ranged over 384.3 nm to 448.2 nm, and 0.5 $\times$ 0.5 mm$^2$area, respectively. This fabrication method presented will reduce processing time and improve the grating quality by means of a consideration of the address grid resolution, grating direction, pitch size and shapes when exposing. Here our investigations concentrate on the design and efficient fabrication results of the FGC for coupling from slab waveguide to a spot in free space.

• 한국정밀공학회지
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• 제31권1호
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• pp.83-90
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• 2014

EHD (electro-hydro-dynamics) patterning was performed under atmospheric pressure at room temperature in a single step. The drop diameter smaller than nozzle diameter and applied high viscosity conductive ink in EHD patterning method provide a clear advantage over the piezo and thermal inkjet printing techniques. The micro electrode pattern was printed by continuous EHD patterning method using 3-type control parameters (input voltage, patterning speed, nozzle pressure). High viscosity (1000cps) conductive ink with 75wt% of silver nanoparticles was used. EHD cone type nozzle having an internal diameter of $50{\mu}m$ was used for experimentation. EHD jetting mode by input voltage and applied 1st order linear regression in stable jet mode was analyzed. The stable jet was achieved at the amplitude of 1.4~1.8 kV. $10{\mu}m$ micro electrode pattern was created at optimized parameters (input voltage 1.6kV, patterning speed 25mm/sec and nozzle pressure -2.3kPa).

• 한국전기전자재료학회논문지
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• 제21권4호
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• pp.354-361
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• 2008

The dielectric characteristics of low-k interlayer dielectric materials was fabricated by plasma enhanced chemical vapor deposition (PECVD). BTMSM precursor was evaporated and introduced with the flow rates from 16 sccm to 25 sccm by 1sccm step in the constant flow rate of 60 sccm $O_2$ in process chamber. Manufactured samples are analyzed components by measuring FT/IR absorption lines. Decomposition each Microscopic structures through two-dimensional correlation analysis about mechanisms for the formation of SiOCH in $SiOCH_3$, Si-O-Si and Si-$CH_3$ bonding group and analyzed correlation between the micro-structure of each group. It is a tendency that seems to be growing of Si-O-Ci(C) bonding group and narrowing of Si-O-$CH_3$ bonding group relative to the increasing flow-rate BTMSM. The order of changing sensitivity about changes of flow-rate in Si-O-Si(C) bonding group is cross link mode$(1050cm^{-1})$ $\rightarrow$ open link mode$(1100cm^{-1})\rightarrow$ cage link mode $(1140cm^{-1})$.