• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 반도체재료
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• pp.34-37
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• 2001

As the integrated circuit device shrinks to smaller dimensions, chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the inter-metal dielectrics (IMD) layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. To prevent agglomerated slurry particle from inflow, we installed 0.5${\mu}m$ POU (point of use) filter, which is depth-type filter and has 80% filtering efficiency for the $1.0{\mu}m$ size particle. In this paper, we studied the relationship between defect generation and pad count to understand the exact efficiency of the slurry filtration, and to find out the appropriate pad usage. Our preliminary results showed that it is impossible to prevent defect-causing particles perfectly through the depth-type filter. Thus, we suggest that it is necessary to optimize the flow rate of slurry to overcome depth type filters weak-point, and to install the high spray of de-ionized Water (DIW) with high pressure.

• 한국전기전자재료학회논문지
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• 제14권9호
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• pp.707-713
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• 2001

As the integrated circuit device shrinks to smaller dimensions, chemical mechanical polishing (CMP) process was requirdfo the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gest thinner, micro-scratches are becoming as major defects. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. To prevent agglomerated slurry particle from inflow, we installed 0.5${\mu}{\textrm}{m}$ point of use (POU) filter, which is depth-type filter and has 80% filtering efficiency for the 1.0${\mu}{\textrm}{m}$ size particle. In this paper, we studied the relationship between defect generation and polished wafer counts to understand the exact efficiency fo the slurry filteration, and to find out the appropriate pad usage. Our experimental results showed that it sis impossible to prevent defect-causing particles perfectly through the depth-type filter. Thus, we suggest that it is necessary to optimize the slurry flow rate, and to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of depth type filter.

• 한국전기전자재료학회논문지
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• 제30권4호
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• pp.235-240
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• 2017

The effect of particle sizes on the aerosol deposition (AD) of Cu films is investigated in order to understand the deposition behaviors of metal powder during the AD process. The Cu coatings fabricated by using $2{\mu}m$ Cu powders had a dense microstructure, a high deposition rate ($1.6{\pm}0.2{\mu}m/min$), and low resistance ($9.42{\pm}0.4{\mu}{\Omega}{\cdot}cm$) compared to that from using Cu powder with a particle size greater than $5{\mu}m$. Also, from estimating the internal micro-strain of Cu films, the Cu coatings fabricated by using $2{\mu}m$ Cu particles exhibited a high micro-strain value of $3.307{\times}10^{-3}$. On the other hand, the strain of Cu coatings fabricated with $5{\mu}m$ particles was decreased to $2.76{\times}10^{-3}$. These results seem to show that the impacted Cu particles are compressed and flattened by shock waves, and that their bonding is associated with the high internal micro-strain caused by plastic deformation.

• Advances in materials Research
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• 제9권2호
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• pp.99-107
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• 2020

Reinforced aluminum alloy base composites have become increasingly popular for engineering applications, since they usually possess several desirable properties. Recently, Warm Accumulative Roll Bonding (WARB) process has been used as a new novel process to fabricate particle reinforced metal matrix composites. In the present study, TiO₂ particles are used as reinforcement in aluminum metal matrix composites fabricated through warm accumulative roll bonding process. Firstly, the raw aluminum alloy 1060 strips with TiO₂ as reinforcement particle were roll bonded to four accumulative rolling cycles by preheating for 5 min at 300℃before each cycle. The mechanical and bonding properties of composites have been studied versus different volume contents of TiO₂ particles by tensile test, peeling test and vickers micro-hardness test. Moreover, the fracture surface and peeling surface of samples after the tensile test and peeling test have been studied versus different amount of TiO₂ volume contents by scanning electron microscopy. The results indicated that the strength and the average vickers micro-hardness of composites improved by increasing the volume content of TiO₂ particles and the amount of their elongation and bonding strength decreased significantly.

• Nuclear Engineering and Technology
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• 제38권4호
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• pp.353-358
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• 2006

Alpha track analysis for the determination of the trace amount of alpha emitting nuclides in a very small particle was performed as an efficient and powerful technique during safeguard inspection. Metal particles with well-defined spherical shape, size and isotopic compositions as a reference material were used to correlate the number of tracks or track diameter with an isotopic composition eventually to identify the uranium enrichment in the environmental swipe samples. Slopes in the number of tracks versus the exposure time curve provide a simple insight into the uranium enrichment of an unknown particle. Low enriched uranium metal particles result in slopes still steeper than the depleted or natural uranium metal particles. In addition, a linear relationship between track diameter and particle size Is thought to be a useful first stage analytical tool as an efficient and convenient inspection guide. The significance of the simple linear model was also judged using the usual statistical tests.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2011년도 제36회 춘계학술대회논문집
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• pp.341-350
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• 2011

마이크로 크기의 단일 마그네슘 입자의 연소 해석을 위해 간단하면서도 점화와 연소과정 전체를 모사한 모델을 사용하여 각각의 주요 파라메터별 영향을 도출하는 연구를 수행하였다. 계산에 사용된 모델은 액적 연소의 경우와 유사하게 보존 및 이송 방정식들을 사용하여 모사되었으며 입자의 온도가 1200 K에 도달하면 점화단계를 종료하고 준정상연소 단계로 전환되었다. 선행 연구를 참고하여 주요 파라메터를 선정하였으며 주요 파라메터로는 초기 입자크기, 대류 열전달의 유무, 외기 온도, 압력 등이 선정되었고, 간단한 열역학적 모델임에도 불구하고 정량적으로 실험 데이터와 유사하게 각각의 파라메터의 영향을 평가할 수 있음을 확인하였다.

• Journal of Welding and Joining
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• 제32권3호
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• pp.68-73
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• 2014

Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2010년도 제35회 추계학술대회논문집
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• pp.321-327
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• 2010

마이크로 크기의 단일 알루미늄 해석을 위한 간단한 모델을 작성하고, 현상의 주요 파라메터를 도출하는 연구를 수행하였다. 금속 입자의 연소는 점화와 준정상상태의 연소 단계로 구성하였고, 각 단계는 액적 연소의 경우와 유사하게 보존 및 이송 방정식들을 사용하여 모사되었다. 모델은 기존의 실험 데이터와의 엄격한 비교를 통해 신뢰성을 검증하였고, 이 과정에서 현상의 주요 변수를 도출하여 그 영향을 평가하였다. 주요 변수로는 초기 입자크기, 산화 피막 두께, 대류 열전달의 유무, 외기온도, 압력 등이 선정되었고, 간단한 열역학적 모델임에도 불구하고 정량적으로 실험 데이터와 유사하게 각각의 파라메터의 영향을 평가할 수 있음을 확인하였다.

• Advances in nano research
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• 제3권4호
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• pp.243-255
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• 2015

In this investigation, ecotoxicity of nano and micro metal oxides, namely silica ($SiO_2$) and alumina ($Al_2O_3$), on the growth of green algae (Porphyridium aerugineum Geitler) is discussed. Effects of nano and micro particles on the growth, chlorophyll content and protein content of algae are analysed using standard protocols. Results indicate that $SiO_2$ nano and micro $SiO_2$ particles are non-toxic to P. aerugineum Geitler up to a concentration of 1000 mg/L. In addition, $Al_2O_3$ microparticles are less toxic to P. aerugineum Geitler, whereas $Al_2O_3$ nanoparticles are found to be highly toxic at 1000 mg/L. Moreover, $Al_2O_3$ nanoparticles decrease the growth, chlorophyll content, and protein content of tested algae. In addition, zeta potential and contact angle are also important in enhancing the toxicity of metal oxide nanoparticles in aquatic environment. This study highlights a new insight into toxicity evaluation of nanoparticles on beneficial aquatic organisms such as algae.

• 한국전기전자재료학회논문지
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• 제26권5호
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• pp.401-409
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• 2013

Numerical analysis on RF (Radio-Frequency) thermal plasma treatment of micro-sized Ni metal was carried out to understand the synthesis mechanism of nano-sized Ni powder by RF thermal plasma. For this purpose, the behaviors of Ni metal particles injected into RF plasma torch were investigated according to their diameters ($1{\sim}100{\mu}m$), RF input power (6 ~ 12 kW) and the flow rates of carrier gases (2 and 5 slpm). From the numerical results, it is predicted firstly that the velocities of carrier gases need to be minimized because the strong injection of carrier gas can cool down the central column of RF thermal plasma significantly, which is used as a main path for RF thermal plasma treatment of micro-sized Ni metal. In addition, the residence time of the injected particles in the high temperature region of RF thermal plasma is found to be also reduced in proportion to the flow rate of the carrier gas In spite of these effects of carrier gas velocities, however, calculation results show that a Ni metal particle even with the diameter of $100{\mu}m$ can be completely evaporated at relatively low power level of 10 kW during its flight of RF thermal plasma torch (< 10 ms) due to the relatively low melting point and high thermal conductivity. Based on these observations, nano-sized Ni metal powders are expected to be produced efficiently by a simple treatment of micro-sized Ni metal using RF thermal plasmas.