• Korean Journal of Materials Research
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• v.29 no.3
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• pp.155-159
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• 2019

Surface plasmon resonance is the resonant oscillation of conduction electrons at the interface between negative and positive permittivity material stimulated by incident light. In particular, when light transmits through the metallic microhole structures, it shows an increased intensity of light. Thus, it is used to increase the efficiency of devices such as LEDs, solar cells, and sensors. There are various methods to make micro-hole structures. In this experiment, micro holes are formed using a wet chemical etching method, which is inexpensive and can be mass processed. The shape of the holes depends on crystal facets, temperature, the concentration of the etchant solution, and etching time. We select a GaAs(100) single crystal wafer in this experiment and satisfactory results are obtained under the ratio of etchant solution with $H_2SO_4:H_2O_2:H_2O=1:5:5$. The morphology of micro holes according to the temperature and time is observed using field emission - scanning electron microscopy (FE-SEM). The etching mechanism at the corners and sidewalls is explained through the configuration of atoms.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1924-1926
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• 2001

A novel wet release process ($\mu$ CARP - Micro Channel Assisted Release Process) for releasing an extreme large-area plate structure without etching hole is proposed and experimented. Etching holes in conventional process reduce a effective area and degrade an optical characteristics by a diffraction. In addition, as the area of a released structure increases, the stietion becomes more serious. The proposed process resolves these problems by the introduction of a micro fluidic channel beneath the structure which will be released. In this paper, a 5 mm${\times}$5mm-single crystal silicon plate structure was released by the proposed $\mu$CARP without etch holes on the structure. The variation in etching time with respect to the of the introduced micro channel is also examined. This process is expected to be beneficial for the actuator of a nano-scale data storage and the scanning mirror.

• Journal of ILASS-Korea
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• v.16 no.2
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• pp.104-109
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• 2011

The present study investigated experimentally the spreading characteristics of a single liquid impinging on the inclined micro-textured aluminum (Al 6061) surfaces manufactured by using a micro computerized numerical control (${\mu}$-CNC) milling machine. The textured surfaces were composed of patterned micro-holes (diameter of $125\;{\mu}m$ and depth of $125\;{\mu}m$). In our experiment, the de-ionized (DI) water droplet of $4.3\;{\mu}l$ was impinged normally on the non-textured and textured surfaces at two different Weber numbers, and the droplet impinged on the inclined surfaces with different angles. A high speed camera was used to capture sequential digital images for measurement of the maximum spreading distance. It was found that for the textured surface, the measured apparent equilibrium contact angle (ECA) increased up to $105.8^{\circ}$, higher than the measured ECA of $87.6^{\circ}$ for the non-textured (bare) surface. In addition, it is conjectured that the spreading distance decreased because of a liquid penetration during droplet spreading through the holes, the increase in hydrophobicity, and viscous dissipation during impact process.

• Transactions of Materials Processing
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• v.21 no.5
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• pp.312-318
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• 2012

With an increasing trend toward miniaturization, electrical discharge machining(EDM) has been receiving a lot of attention as a suitable production technology for micro-parts, since it enables the machining of hard conductive materials with a high degree of repeatability and without alteration to the material. When a micro-hole is fabricated by EDM, however, the diameter of the inlet hole is larger than that of the outlet region due to the additional discharge effect caused by the eroded particles. In this paper, a shot blasting surface treatment, in which an abrasive material is accelerated through a pressurized nozzle and directed at the surface of a part, is suggested as an effective method to reduce the tapered shape of EDM micro-hole. In addition, the influence of process parameters such as spark-on time and electrode diameter on the machining performance was investigated. It is shown quantitatively that the difference in diameter between the inlet and outlet holes decreases with the shot blasting treatment and with decreasing spark-on time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1195-1198
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• 2003

Micro former has been known as a useful tool for machining micro parts. It makes micro holes automatically with punches, a hole-shape die and material by rotation of crank shaft synchronously. Micro displacement in micro forming affects on the performance of machining because micro forming size is similar with its mechanical displacement. Therefore, the measurement of this micro displacement is essential to be guaranteed to obtain high forming precision in the whole machine as well as its devices. This paper addresses the development of a laser interferometer to measure micro displacement for a micro former. The laser interferometer is able to measure micro displacement during a few micro seconds with non-contact. For the experiment, a laser probe is installed on the optical table with optical devices and a micro displacement generating device. The velocity decoding board is also added to calculate doppler shift frequency directly. Finally simple experiments are conducted to confirm its functional operation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1897-1901
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• 2003

Recently, with the development of semiconductor technology the miniaturization of products as well as parts and the products with high precision are being required. In addition as a national competitive power is increasingly effected by micro part development through micro machining and the secure of micro machining technology, the study of micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tool under the size of 30$\mu\textrm{m}$ and machine micro holes through micro tool fabrication by grinding, the application of ELID to grinding wheel and the measurement of surface roughness for micro tool.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1277-1280
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• 2005

A high-aspect-ratio and high-resolution stainless steel shadow mask for organic thin-film transistors (OTFTs) circuit has been fabricated by a new method which combines photochemical machining, micro-electrical discharge machining (micro-EDM), and electrochemical etching (ECE). First, connection lines and source-drain holes are roughly machined by photochemical etching, and then the part of source and drain holes is finished by the combination of micro-EDM and ECE processes. Using this method a $100\;\mu{m}$ thick stainless steel (AISI 304) shadow mask for inverter can be fabricated with the channel length of $30\;\mu{m}\;and\;10\;\mu{m}\;respectively.\;The\;width\;of\;connection line\;is\;150\;\mu{m}$. The aspect ratio of the wall is about 5 and 15, respectively. Metal lines and source-drain electrodes of OTFTs were successfully deposited through the fabricated shadow mask.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.5
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• pp.375-380
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• 2014

To enhance biocompatibility between the orthopedic implant stem and obsteoblast cells, bone-forming cells, micro-size holes are patterned in Ti plate surface. Initially, the house built laser power stabilization system is applied to the laser micro patterning machine to convince repeatable result. Various pulse widths are irradiated Ti plate and relationship between diameters of patterned holes and pulsed width is derived. Effect of multi pulse is observed and optimal pulse number is considered to avoid heat affected zone. After MG-63 osbeoblast cells are cultured, micro patterned Ti plates are compared with control plates. In SEM image, cells are well aligned and aggregation is observed in both 60, and $100{\mu}m$ patterned plates. Finally, free form surface stem model is prepared to test micro hole patterning.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1787-1792
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• 2003

Recently with the development of semiconductor technology, the miniaturization of parts and products as well as their high precision is required. In addition, as the national competitiveness is increasingly affected by the development of the micro parts through micro machining technology, the study of the micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tools under the size of $20{\mu}m$ and to machine micro holes using them. The fabrication is done by grinding and the application of ELID to the grinding wheel. The surface roughness of the micro tools is measured to evaluate the study.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.445-446
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• 2002

The purpose of this study was to investigate the effect of micro holes, pattern structure and elastic modulus of pads on the polishing behavior such as the removal rate and WIWNU (within wafer non-uniformity) during CMP. The regular holes on the pad act as the superior abrasive particle's reservoir and regular distributor at the bulk pad, respectively. The superior CMP performance was observed at the laser processed bulk pad with holes. Also, th ε groove pattern shape was very important for the effective polishing. Wave grooved pad showed higher removal rates than K-grooved pad. The removal rate was linearly increased as the top pad's elastic modulus increased.