Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2001.07c
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- Pages.1924-1926
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- 2001
Study on the Micro Channel Assisted Release Process
미세 유체통로를 이용한 대면적 평판 구조의 부양에 관한 연구
- Kim, Che-Heung (School of Electrical Engineering and Computer Science, Seoul National University) ;
- Lee, June-Young (School of Electrical Engineering and Computer Science, Seoul National University) ;
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Kim, Yong-Kweon
(School of Electrical Engineering and Computer Science, Seoul National University)
- Published : 2001.07.18
Abstract
A novel wet release process (