• Journal of Advanced Marine Engineering and Technology
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• v.33 no.8
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• pp.1137-1143
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• 2009

Experiments were conducted to evaluate pool boiling heat transfer performance between plain and micro finned surfaces with FC-72, which is chemically and electrically stable. Three kinds of micro fins with the dimension of $100{\mu}m\;{\times}\;10{\mu}m$, $150{\mu}m\;{\times}\;10{\mu}m$ and $200{\mu}m\;{\times}\;10{\mu}m$ (width $\times$ height) were fabricated on the surface of a silicon chip. The experiments were carried out on the liquid subcooling of 5, 10 and 15 K under the atmospheric condition. The micro finned surface with a larger fin width of $200{\mu}m$ provided a better pool boiling heat transfer performance. Also, the micro finned surfaces showed a sharp increase in heat flux with increasing wall superheat and a larger heat transfer enhancement compared to a plain surface.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.10
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• pp.1089-1095
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• 2011

Numerical simulation is performed for nucleate boiling on a micro-finned surface, which has been widely used to enhance heat transfer, by solving the equations governing the conservation of mass, momentum, and energy in the liquid and vapor phases. The bubble motion is determined by a sharp-interface level-set method, which is modified to include the effect of phase change and to treat the no-slip and contact-angle conditions, as well as the evaporative heat flux from the liquid microlayer on immersed solid surfaces such as micro fins and cavities. The numerical results for bubble formation, growth, and departure on a microstructured surface including fins and cavities show that the bubble behavior during nucleate boiling is significantly influenced by the fin-cavity arrangement and the fin-fin spacing.

• Journal of Fisheries and Marine Sciences Education
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• v.20 no.3
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• pp.410-415
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• 2008

To evaluate the performance of nucleate boiling heat transfer between a plain and micro-fin surfaces, the experimental tests have been carried out under various conditions with fluorinert liquid FC-72, which is chemically and electrically stable. Two kinds of micro fins with the dimensions of $200{{\mu}m}{\times}20{{\mu}m}$ and $100{{\mu}m}{\times}10{{\mu}m}$ (width x height) were fabricated on the surface of a silicon chip. The experiments were performed on the liquid subcooling of 5, 10 and 20K under the atmospheric condition. The presented data showed a similar trend in the comparison with result of Rainey & You. Due to its expanded surface areas, the heat flux properties has been significantly enhanced on micro-fin surface comparing to the plain surface.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.11
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• pp.121-126
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• 2021

In this study, the effect of thermal contact resistance between pin-channel tubes on the heat transfer characteristics was analytically examined around the channel tubes with the pins attached to two consecutive arranged channel pipes. The numerical results showed that the heat transfer coefficient decreased geometrically as the thermal contact resistance increased, and the corresponding temperature change on the contact surface increased as the thermal contact resistance increased. The thinner the pin, the more pronounced the geometric drop in the heat transfer coefficient. It was confirmed that the higher the height of the pin, the higher was the heat transfer coefficient, however, the greater the size of the thermal contact resistance, the smaller was the heat transfer coefficient. It was found that the temperature change in the inner wall of the channel tube did not significantly affect the heat transfer characteristics owing to the thermal contact resistance. Furthermore, the velocity of air at the entrance of the channel tube was proportional to the heat transfer coefficient due to a decrease in the convective heat resistance corresponding to an increase in the flow rate.