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http://dx.doi.org/10.5916/jkosme.2009.33.8.1137

Heat Transfer Enhancement from Plain and Micro Finned Surfaces According to Liquid Subcooling  

Lim, Tae-Woo (한국해양대학교 기관시스템공학부)
You, Sam-Sang (한국해양대학교 기계정보공학부)
Choi, Hyeung-Sik (한국해양대학교 기계정보공학부)
Abstract
Experiments were conducted to evaluate pool boiling heat transfer performance between plain and micro finned surfaces with FC-72, which is chemically and electrically stable. Three kinds of micro fins with the dimension of $100{\mu}m\;{\times}\;10{\mu}m$, $150{\mu}m\;{\times}\;10{\mu}m$ and $200{\mu}m\;{\times}\;10{\mu}m$ (width $\times$ height) were fabricated on the surface of a silicon chip. The experiments were carried out on the liquid subcooling of 5, 10 and 15 K under the atmospheric condition. The micro finned surface with a larger fin width of $200{\mu}m$ provided a better pool boiling heat transfer performance. Also, the micro finned surfaces showed a sharp increase in heat flux with increasing wall superheat and a larger heat transfer enhancement compared to a plain surface.
Keywords
Liquid subcooling; Micro finned; Wall superheat; Pooling boiling; Heat flux;
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