• Title/Summary/Keyword: Micro-Actuator

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진행파를 이용한 압전 마이크로 펌프의 설계와 해석 (Design and Analysis of Piezoelectric Micro-Pump Using Traveling-Wave)

  • 나영민;이현석;박종규
    • 대한기계학회논문집A
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    • 제38권5호
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    • pp.567-573
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    • 2014
  • 최근에, 의학 분야의 MEMS 기술이 발전하면서 다양한 미세 유체 이송 시스템이 연구되고 있다. 본 논문에서는 기존의 펌프와는 다른, 두 개의 분리된 압전 판을 이용해 위장의 연동 운동을 모방한 마이크로 압전 펌프를 제안한다. 본 펌프는 진행파를 이용해 연동 운동을 일으켜 작동된다. 특히, 압전판에서 인가된 입력 전압에 의해 발생된 변위에 의해 동작된다. 이에 두 판 사이에서 진행파가 일어나며 유체는 진행파에 의해 생성된 압력차에 의해 이동된다. 압전 소자, 탄성체, 유체가 복합된 시스템을 이해하기 위해서 유한 요소 해석을 사용하였다. 챔버의 높이, 세라믹 개수 등의 설계 변수들을 변화시켜 유체의 유량을 확인하였다.

마이크로 스피커 진동판에 대한 분할진동 모드와 열전달의 관계 분석 (Relationship Analysis of Break-up Mode and Heat Transfer of Micro-Speaker Diaphragm)

  • 김현갑;김희식
    • 대한기계학회논문집A
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    • 제41권4호
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    • pp.333-336
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    • 2017
  • 스피커 진동판은 고유 특성에 의해 분할진동을 발생 시킨다. 이 분할진동은 진동판의 형상 변화를 가져올 정도로 뚜렷한 영향을 주는데, 본 논문에서는 IT 분야의 첨병인 스마트 폰을 포함한 초박형 멀티미디어 기기에서 많이 사용되는 마이크로 스피커를 그 대상으로 삼는다. 마이크로 스피커는 일반적인 스피커와 다른 평판형의 구조적인 형태와 공간적인 제약이 존재한다. 특히 구동 공간이 밀폐형으로 설계되어 무빙 코일에서 발생하는 열의 냉각이 열악하고 보조적인 서스펜션 구조를 갖추기 어렵다. 본 연구에서는 진동판의 열전달과 분할진동 모드의 연관성을 연구한다. 이를 위해 진동판의 레이저 스캔을 통한 분할진동 측정과 열화상 카메라 촬영을 통한 열변화 측정의 두 단계로 나누어 실험을 진행한다. 이를 통해 특정 주파수 범위에서 분할진동 모드와 열전달 형태를 비교함으로써, 열화상 카메라를 통한 촬영 결과로 진동판 분할진동 모드의 경향성을 빠르게 예상할 수 있어, 마이크로 스피커의 최적 설계에 도움이 되는 지표를 제공할 수 있을 것으로 기대한다.

교류전압 하에서의 액적의 전기습윤현상 (Electrowetting of a droplet under an AC Electric Fields)

  • 홍진석;고성희;강관형;강인석
    • 유체기계공업학회:학술대회논문집
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    • 유체기계공업학회 2006년 제4회 한국유체공학학술대회 논문집
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    • pp.175-176
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    • 2006
  • Electrowetting is prevailing for its various applicability on lap-on-a-chip, and MEMS devices, such as a pump, lens, micro-actuator in the micro-TAS technology. In the usual electrowetting, an AC power is preferred to DC practically. The AC electric field delays the contact angle-saturation, decreases the hysterisis, and is more stable in the view point of dielectric strength. But researches for AC electric field on electrowetting have not been reported very much yet. The different effect of AC on the electrowetting system, especially the effect of a frequency needs to be understood more concretely. In this work, the usual system for electrowetting, water droplet on the dielectric coated electrode (EWOD) is analyzed. Experimental study on the response of contact angles on input frequencies is performed. The simple circuit-model for EWOD system is considered to explain the experimental results. For more concrete understanding, the system is analyzed numerically, where simple AC-conduction model is used. Wetting tensions are analyzed under various input frequency to excavate the experimental results for the responses of the system on input frequencies.

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Sol-Gel 법으로 제조된 후막 PZT의 두께, 전극형상 및 분극 공정에 따른 $e_{31,f}$ 특성 (Transverse Piezoelectric Coefficient ($e_{31,f}$) of Thick PZT films Fabricated by Sol-Gel Method with Thicknesses, Electrode Shapes and Poling Process)

  • 박준식;양성준;박광범;윤대원;박효덕;김승현;강성군;최태훈;이낙규;나경환
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1326-1331
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    • 2003
  • Thick PZT films are required for the cases of micro actuators and sensors with high driving force, high breakdown voltage and high sensitivity, and so on. In this work, thick PZT films were fabricated by Sol-Gel multi-coating method. Total 8 types of samples using thick PZT films with thicknesses, about $1{\mu}m$ and $2{\mu}m$, and Pt top electrodes shapes for measuring transverse piezoelectric coefficient ($e_{31,f}$) were fabricated using MEMS processes. They were characterized by fabricated e31,f measurement system before and after poling. $e_{31,f}$ values of samples after poling were higher than before poling. Those of $2{\mu}m$ thick PZT films were also higher than $1{\mu}m$ thick PZT films. And those with long electrodes as top electrodes were also higher than shorter.

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Packaging MEMS, The Great Challenge of the $21^{st}$ Century

  • Bauer, Charles-E.
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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    • pp.29-33
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    • 2000
  • MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than $9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

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표면 미세가공기술을 이용한 마이크로 광학소자 및 구동기의 제작 (Fabrication of Micro-optical Components and Actuators using Surface Micromachining)

  • 김건년;박광범;정석원;이보나;김인회;문현찬;박효덕;신상모
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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    • pp.1151-1153
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    • 1999
  • 3-layer polysilicon 표면미세가공공정을 이용하여 micro zone plate 렌즈와 미러 및 이를 구동하기 위한 구동기를 일체화시킨 마이크로 구동형 광학소자를 설계, 제작하였다. 650nm의 파장대역에서 초점거리가 $500{\mu}m$가 되도록 마이크로 zone plate 렌즈를 설계하였으며, 렌즈의 광학축은 실리콘 기판 상에서 $121{\mu}m$거리에 위치하도록 제작하였다. 마이크로 hinge와 스프링 latch 및 측면지지 plate를 이용하여 마이크로 렌즈와 미러가 실리콘 기판상에서 out-of-plane동작이 가능하도록 하였다. 마이크로렌즈 초점거리의 가변을 위하여 6개의 SDA(Scratch Drive Actuator)어레이를 설계, 제작하였다. 또한 빔 반사를 위한 마이크로 미러를 설계하고 $45^{\circ}$ self-assembly를 위하여 마이크로 hinge와 SDA array를 제작하였다.

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기구학적 커플링으로 구성된 3자유도 병렬 메커니즘 해석 및 설계 (Analysis and Design of 3-DOF Parallel Mechanism Based on Kinematic Couplings)

  • 왕위준;한창수
    • 한국생산제조학회지
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    • 제21권3호
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    • pp.479-486
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    • 2012
  • This paper presents a high-speed automatic micro-alignment system that is a part of an inspection machine for small-sized molded lenses of mobile phones, palm-top computers, and so on. This work was motivated by the shortcomings of existing highest-grade commercial machine. A simple tip/tilt/Z parallel mechanism is designed based on kinematic couplings, which is a 3-degree-of-freedom (3-DOF) moderate-cost alignment stage. It is used to automatically adjust the posture of each lens on the tray, which is impossible by the conventional instrument. Amplified piezoelectric actuators are used to ensure the accuracy and dynamic response. Forward kinematic analysis and simulation show that the parasitic motion is small enough compared to the actuator stroke. From the workspace analysis of the moving platform, it is clear that the output motion range satisfies the design requirements.

마이크로 광디스크 드라이브용 4 × 1 근접장 탐침 어레이를 위한 슬라이더와 서스펜션의 설계 (Design of the Slider and Suspension for 4 × 1 Near-field Probe Array in Micro Optical Disk Drives)

  • 홍어진;정민수;오우석;박노철;양현석;박영필
    • 한국소음진동공학회논문집
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    • 제15권2호
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    • pp.184-191
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    • 2005
  • The near-field scanning micro scope (NSOM) technique is in the spotlight as the next generation storage device. Many different types of read/write mechanism for NSOM have been introduced in the literature. In order for a near-field probe to be successfully implemented in the system, a suitable slider and suspension are needed to be properly designed. The optical slider is designed considering near-filed optics and probe array. The suspension generally supports slider performance, and tracking servo capacity in HDD. Moreover, the suspension for optical slider also should meet the optical characteristics, and is also required to satisfy shock performances for the mobility for the actuator. In this study, the optical slider and the suspension for near-field probe array are designed and analyzed.

Confocal Scanning Microscopy : a High-Resolution Nondestructive Surface Profiler

  • Yoo, Hong-Ki;Lee, Seung-Woo;Kang, Dong-Kyun;Kim, Tae-Joong;Gweon, Dae-Gab;Lee, Suk-Won;Kim, Kwang-Soo
    • International Journal of Precision Engineering and Manufacturing
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    • 제7권4호
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    • pp.3-7
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    • 2006
  • Confocal scanning microscopy is a measurement technique used to observe micrometer and sub-micrometer features due to its high resolution, nondestructive properties, and 3D surface profiling capabilities. The design, implementation, and performance test of a confocal scanning microscopy system are presented in this paper. A short-wavelength laser (405 nm) and an objective lens with a high numerical aperture (0.95) were used to achieve the desired high resolution, while the x- and y-axis scans were implemented using an acousto-optic deflector and galvanomirror, respectively. An objective lens with a piezo-actuator was used to scan the z-axis. A spatial resolution of less than 138 nm was achieved, along with successful 3D surface reconstructions.

알루미늄 마이크로 박판소재의 방향성에 관한 실험적 연구 (An experimental study on the oriented mechanical properties of aluminum micro thin foil material)

  • 이혜진;이낙규;최석우;이형욱;최태훈;황재헉;곽동기
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 추계학술대회 논문집
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    • pp.295-298
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    • 2005
  • This paper is concerned with the precision material property measurement of a micro metal thin foil that is used in MEMS technology. Since these MEMS components require great precision and accuracy, evaluation of reliability such as the lift cycle endurance test, impact test, and residual stress test is necessary for these components. However, in practice, real reliability tests are not easy to perform due to consideration of various factors. Rather than actual testing, it would be much easier to evaluate the reliability of components by the analytical approach. Although the analytical method is utilized by software tools, it is obviously necessary to acquire fundamental properties of materials through real test methods. In this paper, the oriented mechanical properties of aluminum thin foil are measured by nano scale material property measurement system.

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