• 제목/요약/키워드: Micro roughness

검색결과 494건 처리시간 0.031초

Bond behaviour at concrete-concrete interface with quantitative roughness tooth

  • Ayinde, Olawale O.;Wu, Erjun;Zhou, Guangdong
    • Advances in concrete construction
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    • 제13권3호
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    • pp.265-279
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    • 2022
  • The roughness of substrate concrete interfaces before new concrete placement has a major effect on the interface bond behaviour. However, there are challenges associated with the consistency of the final roughness interface prepared using conventional roughness preparation methods which influences the interface bond performance. In this study, five quantitative interface roughness textures with different roughness tooth angles, depths, and tooth distribution were created to ensure consistency of interface roughness and to evaluate the bond behaviour at a precast and new concrete interface using the splitting tensile test, slant shear test, and double-shear test. In addition, smooth interface specimens and two separate the pitting interface roughness were also utilized. Obtained results indicate that the quantitative roughness has a very limited effect on the interface tensile bond strength if no extra micro-roughness or bonding agent is added at the interface. The roughness method however causes enhanced shear bond strength at the interface. Increased tooth depth improved both the tensile and shear bond strength of the interfaces, while the tooth distribution mainly influenced the shear bond strength. Major failure modes of the test specimens include interface failure, splitting cracks, and sliding failure, and are influenced by the tooth depth and tooth distribution. Furthermore, the interface properties were obtained and presented while a comparison between the different testing methods, in terms of bond strength, was performed.

광반도체용 사파이어웨이퍼 기계연마특성 연구 (A Study on the Micro-lapping process of Sapphire Wafers for optoelectronic devices)

  • 황성원;신귀수;김근주;서남섭
    • 한국정밀공학회지
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    • 제21권2호
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    • pp.218-223
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    • 2004
  • The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by Micro-lapping process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of crystalline sapphire wafer at surface has a full width at half maximum of 250 arcsec. This value at the surface sapphire wafer surfaces indicated 0.12${mu}m$ sizes. Surfaces of sapphire wafers were mechanically affected by residual stress and surface default. As a result, the value of surface roughness of sapphire wafers measured by AFM(Atom Force Microscope) was 2.1nm.

AIP법에서 증착시간이 SM45C 강의 TiN 코팅층 성질에 미치는 영향 (Effect of Deposition Time on the Properties of TiN-coated Layer of SM45C Steel by Arc Ion Plating)

  • 김해지
    • 한국기계가공학회지
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    • 제10권5호
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    • pp.44-50
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    • 2011
  • The effect of deposition time in arc ion plating on surface properties of the TiN-coated SM45C steel is presented in this paper. The surface roughness, micro-particle, micro-hardness, coated thickness, atomic distribution of TiN, and adhesion strength are measured for various deposition times. It has been shown that the deposition time has a considerable effect on the micro-hardness, the coated thickness, and the atomic distribution of TiN of the SM45C steels but that it has little influence on the surface roughness and adhesion strength.

광반도체용 사파이어웨이퍼 기계연마특성 연구 (A Study on the Micro-lapping process of Sapphire Wafers for optoelectronic devices)

  • 황성원;김근주;서남섭
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.82-85
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    • 2003
  • The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by Micro-lapping process. The sapphire crystalline wafers were characterized by DCXD(Double Crystal X-ray Diffraction). The sample quality of crystalline sapphire wafer at surface has a FWHM(Full Width at Half Maximum) of 250 arcsec. This value at the sapphire wafer surfaces indicated 0.12${\mu}{\textrm}{m}$ sizes. Surfaces of sapphire wafers were mechanically affected by residual stress and surface default. Also Surfaces roughness of sapphire wafers were measured 2.1 by AFM(Atom Force Microscope).

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AIP 법에서 질소가스 압력이 고속도강의 TiN 코팅층 성질에 미치는 영향 (Effect of Nitrogen Gas Pressure on the Property of TiN-Coated Layer of High Speed Steel by Arc ion Plating)

  • 김해지;전만수
    • 한국정밀공학회지
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    • 제25권7호
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    • pp.124-130
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    • 2008
  • The effect of nitrogen gas pressure in arc ion plating on surface properties of the TiN-coated high speed steel(SKH51) is presented in this paper. The surface roughness, micro-particle, micro-hardness, coated thickness, atomic distribution of TiN, and adhesion strength are measured fur various nitrogen gas pressures. It has been shown that the nitrogen gas pressure has a considerable effect on the surface roughness, adhesion strength, atomic distribution of TiN, and surface deposition of TiN of the high speed steels but that it has little influence on the micro-hardness and coated thickness.

SCM415 강의 코팅특성에 관한 연구 (A Study on the Coating Characteristics of SCM415 Steel)

  • 장정환;허철수;김해지;김남경;류성기
    • 한국기계가공학회지
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    • 제10권2호
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    • pp.117-123
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    • 2011
  • The purpose of this study is to show the friction and wear characteristics on the vapor deposited coating layers on the SCM415 steel. In this research, frictional wear characteristic of coating materials such as Ti-series, Cr-series & WC/C and TiAlN+WC/C multilayer coating was investigated under room temperature, normal air pressure and no lubricating condition. Therefore, this study carried out research on the friction coefficient, micro hardness(Hv), surface roughness and wear quantity on the vapor deposited coating layers on the SCM415 steel. As the wear experimental result, the excellence of TiAlN+WC/C multilayer coating has been proven by high micro-hardness, low friction coefficient and wear quantity.

Run to Run 제어 기법을 이용한 자기연마 공정 관리 (Optimization of Magnetic Abrasive Polishing Process using Run to Run Control)

  • 안병운;박성준
    • 한국공작기계학회논문집
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    • 제18권1호
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    • pp.22-28
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    • 2009
  • In order to optimize the polishing process, Run to Run control scheme has been applied to the micro mold polishing in this study. Also, to fully understand the effect of parameters on the surface roughness a design of experiment is performed. By linear approximation of main factors such as gap and rotational speed of micro quill, EWMA (Exponential Weighted Moving Average) gradual mode controller is adopted as a optimizing tool. Consequently, the process converged quickly at a target value of surface roughness Ra 10nm and Rmax 50nm, and was hardly affected by unwanted process noises like initial surface quality and wear of magnetic abrasives.

Micro Etch에 의한 주석도금 표면의 거칠기 분석 (Analysis of Immersion Tin Plating Surface Roughness after Micro Etch)

  • 박보현;오현식;홍석표;한정민;홍상진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.148-149
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    • 2007
  • 현재 전자부품 시장은 RoHS 규정으로 인하여 lead free화가 진행되고 있으며 많은 주목을 받고 있다. 본 논문에서는 반도체 패키지 및 부품표면일장에서 사용 되는 무전해 주석 도금과정 중 산 탈지 후 막의 표면 거칠기 정도가 도금 후의 표면 거칠기 정도에 미치는 영향을 평가 한다. 실험의 효율성을 높이기 위해 통계적인 실험계획법을 사용하였으며 실험의 횟수를 줄이고 표면 거칠기 정도는 이미지 프로세싱을 통하여 분석하였으며 통계적인 모델링을 통해 micro etch가 도금 표면의 거칠기에 주는 영향을 분석하였다.

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EP와 MR Polishing 복합공정에 의한 304 스테인리스강의 경면가공 (Mirrorlike Machining of SUS304 by Combined process of EP and MR Polishing)

  • 김동우;홍광표;조명우;이은상
    • 한국생산제조학회지
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    • 제19권2호
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    • pp.267-274
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    • 2010
  • Recently, the magnetorheological (MR) polishing process has been examined as a new ultra-precision polishing technology for mirror surface generation in many applications, such as aspheric lenses, biochips, micro parts, etc. This method uses MR fluids which contains micro abrasives as a polishing media, and can. It is possible to obtain nano level surface roughness under suitable process conditions, however, required polishing time is highly dependent on the applied pre-polishing methods due to its very small material removal rate. Thus, in this study, a combined polishing method is presented to reduce total polishing time for SUS304. First, the electropolishing (EP) method was applied to obtain fine surface roughness, and the MR polishing was followed. Surface roughness variations were investigated according to the process conditions. As the results of this study, it was possible to reduce total polishing time for SUS304 using the proposed combined polishing method.

마이크로 공구를 이용한 미세 구멍 가공기술 (Micro-hole Machining Technology for using Micro-tool)

  • 허남환;이석우;최헌종
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.1897-1901
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    • 2003
  • Recently, with the development of semiconductor technology the miniaturization of products as well as parts and the products with high precision are being required. In addition as a national competitive power is increasingly effected by micro part development through micro machining and the secure of micro machining technology, the study of micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tool under the size of 30$\mu\textrm{m}$ and machine micro holes through micro tool fabrication by grinding, the application of ELID to grinding wheel and the measurement of surface roughness for micro tool.

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