• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2006.05a
• /
• pp.663-664
• /
• 2006

In the electronic, medical, aerospace and automobile industries, many products and parts are manufactured by joining. Recently, as these get smaller, micro joining is becoming more and more important. In this study, micro wire-to-micro wire parallel joining was performed using single mode fiber laser. Maximum power of the fiber laser is 100 W. The CCD(Charge- Coupled Device, CCD) camera to observe the specimen was made up. The objective was applied to micro joining system to make a small spot size of laser beam. In order to control the target position, micro-multi-axis-stage was set up. This paper presents results for the single mode fiber laser joining of micro wires.

• Journal of Welding and Joining
• /
• v.29 no.4
• /
• pp.54-60
• /
• 2011

Adhesive bonding is one of the most promising joining methods which may substitute for conventional metallurgical joining processes, such as welding, brazing and soldering. Curing behavior and mechanical properties of adhesive joint are largely dependent on the curing agent including hardener and catalyst. In this study, effects of curing system on the curing behavior and single-lap shear strength of epoxy adhesive joint are investigated. Dihydrazide, anhydride and dicyandiamide(DICY) were chosen as hardener and imidazole and triphenylphosphine(TPP) were chosen as catalyst. In curing behavior, TPP showed the delay of the curing rate for DICY and ADH at $160^{\circ}C$, compared to imidazole catalyst due to the high curing onset/peak temperature. DICY seemed to be most beneficial in the joint strength for both steel and Al adherends, although the type of adherends affected the shear strength of epoxy adhesive joint.

• Journal of Adhesion and Interface
• /
• v.7 no.4
• /
• pp.28-31
• /
• 2006

Due to the miniaturization of MEMS and microelectronics the joining techniques also have to be adjusted. The dosing technology with viscous adhesives does not permit reproducible adhesive volumes, which are clearly under a nano-liter. A nano-liter means however a diameter of bonding area within the range of several 100 micrometers. Additional, viscous adhesives need a certain time, until they are cross linked or cured. The problem especially in the MEMS is the initial strength, since it gives the time, which is needed for joining an individual adhesive joint. The time up to the initial strength is with viscous, also with fast curing systems, within the range of seconds until minutes. Until the reach of the initial strength, the micro part must be fixed/held. Without sufficient adjustment/clamping it can come to a shift of the micro parts. Also existing micro adhesive bonding processes are not batch able, i.e. the individual adhesive joints of a micro system must be processed successively. In the context of the WCARP III 2006 now an innovative method is to be presented, how it is possible to solve the existing problems with micro bonding. i.e. a method is presented, which is batch able, possess a minimum joining geometry with some micrometers and is so fast that no problems with the initial strength arise. It is a method, which could revolutionize the sticking technology in the micro system engineering.

• Journal of the Korean Society for Precision Engineering
• /
• v.26 no.12
• /
• pp.18-22
• /
• 2009

• Journal of Welding and Joining
• /
• v.32 no.3
• /
• pp.19-26
• /
• 2014

Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.

• Proceedings of the KWS Conference
• /
• 2006.05a
• /
• pp.27-29
• /
• 2006

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.2
• /
• pp.1-10
• /
• 2016

This paper reports the trends of researches and technologies of electronic packaging using graphene. Electronic packaging is to provide the signal and electrical current among electronic components, to remove the heat in electronic systems or components, to protect and support the electronic components from external environment. As the required functions and performances of electronic systems or components increase, the electronic packaging has been intensively attracted attention. Therefore, technologies such as miniaturization, high density, Pb-free material, high reliability, heat dissipation and so on, are required in electronic packaging. Recently, graphene, which is a single two-dimensional layer of carbon atoms, has been extensively investigated because of its superior mechanical, electrical and thermal properties. Until now, many studies have been reported the applications using graphene such as flexible display, electrode, super capacitor, composite materials and so on. In this paper, we will introduce and discuss various studies on recent technologies of electronic packaging using graphene for solving the required issues.

• Journal of the Korean Society for Precision Engineering
• /
• v.23 no.1 s.178
• /
• pp.23-31
• /
• 2006

• Journal of the Korean Society for Precision Engineering
• /
• v.31 no.10
• /
• pp.865-871
• /
• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• Proceedings of the KWS Conference
• /
• v.43
• /
• pp.79-81
• /
• 2004

In this study EB(Electron Beam) welder was modified to apply Ef welder to micro-joining for soldering and micro-brazing. The power and beam current of EB welder is 6kW, 100mA(60kV) and the minimum current was 1mA. The minimum current of EB welder was modified to decrease the amount of beam current to 0.0lmA and the monitoring system to observe materials was made up. The system is developed including teaching function for generating patterns. The control system and CAD/CAM software for EB direct writing was developed and the deflection beam was controlled without moving workpieces. the possibility of applying EB welder to micro-joining for soldering and brazing was studied through this experiments.