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Technologies of TSV Filling and Solder Bumping for 3D Packaging  

Yoo, Se-Hoon (Micro-Joining Center, KITECH)
Ko, Young-Ki (Micro-Joining Center, KITECH)
Shin, Yue-Seon (Micro-Joining Center, KITECH)
Lee, Chang-Woo (Micro-Joining Center, KITECH)
Publication Information
Journal of the Korean Society for Precision Engineering / v.26, no.12, 2009 , pp. 18-22 More about this Journal
Keywords
Through Silicon Via; Via Filling; 3D Package; Solder Bonding;
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