• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05a
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• pp.197-201
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• 2002

This paper presents optimized design, fabrication and thermal characteristics of micro-heaters for thermal MEMS (micro electro mechanical system) applications using SOI and trench structures. The micro-heaters are based on a thermal measurement principle and contains thermal isolation regions of 10 ${\mu}m$-thick Si membranes consisting of oxide-filled trenches in the SOI membrane rim. The micro-heaters were fabricated with Pt-RTD on the same substrate via MgO buff layer between Pt thin-film and $SiO_2$ layer. The thermal characteristics of micro-heater with trench-free SOI membrane structure was $280^{\circ}C$ at input power 0.9 W; in the presence of 10 trenches, it was $580^{\circ}C$ due to reduction of the external thermal loss. Therefore, a micro-heater with trenches in SOI membrane rim structure provides a powerful and versatile alternative technology for enhancing the performance of micro-thermal sensors and actuators.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.146-150
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• 1996

A thermal micro actualtor has been fabricated using surface micromachining techniques. It consists of doped ploysilicon as a moving part and TEOS(Tetra Ethyl Ortho Silicate) as a sacrificial layer. The polysilicon was annealed for the reduction of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE(vapor phase etching)process was also used as an effective release method for the elimination of sacrificaial layer. With noliquid involved during any of the steps for relasing, unlike other reported relase techniques, the HF VPE pocess has produced polysilicon microstructures with virtually no process-induced stiction problem. The actuation is incured by the thermal expasion due to current flow in active polysilicon cantilever, which motion is amplified bylever mechanism. The thickness of pllysilicon is 2 .mu. m and the length of active and passive polysilicon cantilever are 500 .mu. m, respectively. The moving distance of polysilicon actuator was experimentally conformed as large as 21 .mu. m at the input voltage level of 10 V and 50Hz square wave. These micro actuator technology can be utilized for the fabrication of MEMS (microlectromechanical system) such as microrelay, which requires large displacement or contact force but relatively slow response.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.10a
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• pp.463-467
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• 2004

This paper presents the fabrication possibility of the micro actuator which uses a micro-thermal bubble, generated b micro-heater under pulse heating. The valve-less micropump using the diffuser/nozzle is consists of the lower plate, he middle plate, the upper plate. The lower plate includes the channel and chamber are fabricated on high processability silicon wafer by the DRIE(Deep Reactive Ion Etching) process. The middle plate includes the chamber and diaphragm d the upper plate is the micro-heater. The Micropump is fabricated by bonding process of the three layer. This paper resented the possibility of the PCR chip operation by the fabricated micropump.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.191-194
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• 2002

In optical pick-up, optical components such as objective lens, collimator, mirror, laser diode and photo diode are mounted on the pick-up base. These components must keep their original position during operation for proper transmittance of information from laser diode to optical disk and back to photo diode. However, micro thermal deformation of pick-up base which is induced by thermal environment during operation can deteriorate the performance of optical pick-up. Therefore, it is important to measure and analyze the thermal deformation behavior of pick-up base under thermal environment. In the present study, a measurement system using holographic interferometry was designed to measure micro thermal deformation of pick up base. The measurement system was verified by using the deformation of cantilever with prescribed motion actuated by PZT with 1 nm resolution. Interferometric measurement was compared quantitatively with that induced by PZT actuator. Finally, micro thermal deformation of pick-up base under actual thermal environment was measured using the present holographic interferometry and the results were analysed.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1613-1616
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• 2007

A microgripper using thermal actuator and SU-8 polymer was designed and fabricated to manipulate cells and microparts. A chip size of a microgripper was 3 mm ${\times}$ 5 mm. The thermally actuated microgripper consisted of two couples of hot and cold arm actuators. The high thermal expansion coefficient, 52 $ppm/^{\circ}C$, of SU-8 compared to silicon and metals, allows the actuation of the microgripper. Thickness and width of SU-8 as an end-effector were 26 ${\mu}m$ and 80 ${\mu}m$, respectively. Initial gap between left jaw and right jaw was 120 ${\mu}m$. The ANSYS program as FEM tool was introduced to analyze the thermal distribution and displacement induced by thermal actuators. $XeF_2$ gas was used for isotropic silicon dry etching process to release SU-8 end-effector. Mechanical displacements of the fabricated microgripper were measured by optical microscopy in the range of input voltage from 0 V to 2.5 V. The maximum displacement between two jaws of a microgripper Type OG 1_1 was 22.4 ${\mu}m$ at 2.5 V.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.259-267
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• 2002

We present a novel 3D fabrication method with single X-ray process utilizing an X-ray mask in which a micro-actuator is integrated. An X-ray absorber is electroplated on the shuttle mass driven by the integrated micro-actuator during deep X-ray exposures. 3D microstructures are revealed by development kinetics and modulated in-depth dose distribution in resist, usually PMMA. Fabrication of X-ray masks with integrated electrothermal xy-stage and electrostatic actuator is presented along with discussions on PMMA development characteristics. Both devices use $20-\mu\textrm{m}$-thick overhanging single crystal Si as a structural material and fabricated using deep reactive ion etching of silicon-on-insulator wafer, phosphorous diffusion, gold electroplating, and bulk micromachining process. In electrostatic devices, $10-\mu\textrm{m}-thick$ gold absorber on $1mm{\times}1mm$ Si shuttle mass is supported by $10-\mu\textrm{m}-wide$, 1-mm-long suspension beams and oscillated by comb electrodes during X-ray exposures. In electrothermal devices, gold absorber on 1.42 mm diameter shuttle mass is oscillated in x and y directions sequentially by thermal expansion caused by joule heating of the corresponding bent beam actuators. The fundamental frequency and amplitude of the electrostatic devices are around 3.6 kHz and $20\mu\textrm{m}$, respectively, for a dc bias of 100 V and an ac bias of 20 VP-P (peak-peak). Displacements in x and y directions of the electrothermal devices are both around $20{\;}\mu\textrm{m}$at 742 mW input power. S-shaped and conical shaped PMMA microstructures are demonstrated through X-ray experiments with the fabricated devices.

• Journal of Mechanical Science and Technology
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• v.20 no.3
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• pp.297-309
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• 2006

This paper deals with a novel structure for single-cell characterization which makes use of bimorph micro thermal actuators combined with electrical sensor device and integrated microfluidic channel. The goal for this device is to capture and characterize individual biocell. Quantitative and qualitative characteristics of bimorph thermal actuator were analyzed with finite element analysis methods. Furthermore, optimization for the dimension of cantilevers and integrated parallel probe systems with microfluidic channels is able to be realized through the virtual simulation for actuation and the practical fabrication of prototype of probes. The experimental value of probe deflection was in accordance with the simulated one.

• Advances in Computational Design
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• v.2 no.2
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• pp.107-119
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• 2017

The Micro circular diaphragm (MCD) is the mechanical actuator part used in the micro electro-mechanical sensors (MEMS) that combine electrical and mechanical components. These actuators are working under harsh mechanical and thermal conditions, so it is very important to study the mechanical and thermal behaviors of these actuators, in order to do with its function successfully. The objective of this paper is to determine the thermo-mechanical behavior of MCD by developing the traditional bulge test technique to achieve the aims of this work. The specimen is first pre-stressed to ensure that is no initial deflection before applied the loads on diaphragm and then clamped between two plates, a differential pressure (P) and temperature ($T_b$) is leading to a deformation of the MCD. Analytical formulation of developed bulge test technique for MCD thermo-mechanical characterization was established with taking in-to account effect of the residual strength from pre-stressed loading. These makes the plane-strain bulge test ideal for studying the mechanical and thermal behavior of diaphragm in both the elastic and plastic regimes. The differential specimen thickness due to bulge effect to describe the mechanical behavior, and the temperature effect on the MCD material properties to study the thermal behavior under deformation were discussed. A finite element model (FEM) can be extended to apply for investigating the reliability of the proposed bulge test of MCD and compare between the FEM results and another one from analytical calculus. The results show that, the good convergence between the finite element model and analytical model.

• Transactions of the Society of Information Storage Systems
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• v.2 no.1
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• pp.21-25
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• 2006

The new multimedia information environment requires smaller optical data storage systems. However, one of the difficulties encountered in designing small form factor(SFF) optical pick-up is to emit the heat which is generated from laser diode(LD). Heat generated at the LD can reduce the optical performance of the system and the lifetime of LD. Therefore, it is important to include the thermal design in the design stage of SFF optical pick-up system for high performance and the longer lifetime of LD, and furthermore, to analyze the thermal characteristics of LD in detail micro heat transfer analysis is necessary. In the present study, micro heat transfer analysis was performed using the finite element method for the $28{\times}11{\times}2mm^3$ super slim swing-arm type optical pick-up actuator for Blu-ray disk. Two different materials were used for a swing-arm; a double layer polycarbonate/steel structure and a single aluminum structure.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.4
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• pp.161-167
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• 2002

For the purpose of applying to micro-actuator, thermal properties and displacement of electrostrictive polyurethane(PU) elastomers have been measured. In order to understand an effect of PU component, crosslinking agent are controlled by 0.5 wt% and 1 wt%. DMPA and anther chain extenders were used. PU sample that chain extenders are DMPA is added NaOH for comprehension of effect of ionic groups. The deposited electrode sire on PU films is equal to acrylic holder size when the displacement was measured. Dynamic response according to frequency, displacement and recovery time according to PU thickness were measured. 1 wt% crosslinking agent contents PU samples have higher displacement and lower recovery time than 0.5 wt% crosslinking agent contents PU. If the PU thickness is increased, the actuating voltage for generating of same displacement is increased, too.