• Journal of Korea Foundry Society
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• v.24 no.3
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• pp.159-164
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• 2004

The aim of the present work is to investigate the possibility of in-situ synthesis and net-shape forming of the titanium matrix (TiC+TiB) hybrid composites using a casting route. From the scanning electron microscopy, electron probe micro-analyzer, X-ray diffraction and thermodynamic calculations, the spherical TiC and needle like TiB reinforced hybrid titanium matrix composites could be obtained in-situ by the conventional melting and casting route between titanium and $B_4C$. No melt-mold reaction occurred between the titanium matrix (TiC+TiB) hybrid composites and the SKK mold, since the mold is consisted with interstitial and substitutional metal-mold reaction products. Not only the sound in-situ synthesis but also the economic net-shape forming of the titanium matrix (TiC+TiB) hybrid composites could be possible by the conventional casting route.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.193-197
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• 2005

This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

• Transactions of Materials Processing
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• v.23 no.8
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• pp.489-494
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• 2014

Micro forming is an appropriate process to manufacture very small metal parts which can be employed in the field of electronic devices or electrically controlled mechanical systems. The purpose of the current study was to investigate the influences of both blankholding force and blank diameter for the deep drawing of very small cups. It is essential to control the blankholding force because improper force can result in defects such as wrinkles in the flange or cracks in the corner of the drawn cups. In the current study blankholding force was controlled by springs connected to the blankholder of a press die. Exchangeable bushing dies with various die-corner radii were also used. To obtain the limit drawing ratio for each working condition several sizes of circular specimens were prepared using blanking tools. Beryllium copper(C1720) alloy sheet of $50{\mu}m$ thickness was chosen for the experiments. The maximum limit drawing ratio of 2.1 was achieved experimentally for the conditions of the blankholder force(BHF)=5.3kgf and Rd=0.3mm. Both thickness and hardness along the central section of drawn cups were measured and compared for different drawing conditions. It was found that the deviation of measured data in the thickness and hardness distribution increases with increasing blankholder force and blank diameter.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.9
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• pp.754-760
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• 2008

A two-photon induced photoreduction process suggests a possibility for fabricating complicated metallic microstructures which can be applied to 3-D micro-circuits and optical devices, etc. The process employs the photoreduction of silver ions in a metallic solution which is composed of metallic salt ($AgNO_3$) and watersoluble polymer ((poly(4-styrenesulfonique acid) 18wt. % in $H_2O$, $(C_8H_8O_3S)_n$)). In this process, the improvement of the resolution and the uniformity of fabricated metallic structures are important issues. To address these problems, continuous forming window (CFW) is obtained from a parametric study on the conditions of laser power and scanning velocity and the direct seed generation (DSG) method is proposed. Silver nano particles are uniformly generated in a metallic solution through the DSG method, which enables the decrease of a laser power to trigger the photoreduction of silver ions as well as the increase of metal contents in a metallic solution. So the two-photon induced photoreduction property of a metallic solution is improved. Through this work, precise silver patterns are fabricated with a minimum line width of 400 nm.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.287.1-287.1
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• 2016

Three-dimensional (3-D) semiconductor nanoarchitectures, including nano- and micro- rods, pyramids, and disks, are emerging as one of the most promising elements for future optoelectronic devices. Since these 3-D semiconductor nanoarchitectures have many interesting unconventional properties, including the use of large light-emitting surface area and semipolar/nonpolar nano- or micro-facets, numerous studies reported on novel device applications of these 3-D nanoarchitectures. In particular, 3-D nanoarchitecture devices can have noticeably different current spreading characteristics compared with conventional thin film devices, due to their elaborate 3-D geometry. Utilizing this feature in a highly controlled manner, color-tunable light-emitting diodes (LEDs) were demonstrated by controlling the spatial distribution of current density over the multifaceted GaN LEDs. Meanwhile, for the fabrication of high brightness, single color emitting LEDs or laser diodes, uniform and high density of electrical current must be injected into the entire active layers of the nanoarchitecture devices. Here, we report on a new device structure to inject uniform and high density of electrical current through the 3-D semiconductor nanoarchitecture LEDs using metal core inside microtube LEDs. In this work, we report the fabrications and characteristics of metal-cored coaxial $GaN/In_xGa_{1-x}N$ microtube LEDs. For the fabrication of metal-cored microtube LEDs, $GaN/In_xGa_{1-x}N/ZnO$ coaxial microtube LED arrays grown on an n-GaN/c-Al2O3 substrate were lifted-off from the substrate by wet chemical etching of sacrificial ZnO microtubes and $SiO_2$ layer. The chemically lifted-off layer of LEDs were then stamped upside down on another supporting substrates. Subsequently, Ti/Au and indium tin oxide were deposited on the inner shells of microtubes, forming n-type electrodes of the metal-cored LEDs. The device characteristics were investigated measuring electroluminescence and current-voltage characteristic curves and analyzed by computational modeling of current spreading characteristics.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.68-73
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• 2014

Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.

• Advances in Computational Design
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• v.7 no.2
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• pp.129-137
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• 2022

Compo-casting method is one of the popular technique to produce metal based matrix composites. But, one of the main challenges in this process is un-uniform spreading of reinforced subdivisions (particles) inside the metallic matrix and the lack of desirable mechanical properties of the final produced composites due to the low bonding strength among the metal matrix and reinforcement particles. To remove these difficulties and to promote the mechanical properties of these kind of composites, the WARM ARB technique was utilized as supplementary technique to heighten the mechanical and microstructural evolution of the casted Al/Al₂O₃ composite strips. The microstructure evolution and mechanical properties of these composites have been considered versus different WARM ARB cycles by tensile test, average Vickers micro hardness test, wear test and scanning electron microscopy (SEM). The SEM results revealed that during the higher warm- ARB cycles, big alumina clusters are broken and make a uniform distribution of alumina particles. It was shown that cumulating the forming cycles improved the mechanical properties of composites. In general, combined compo-casting and ARB process would consent making Al/Al₂O₃ composites with high consistency, good microstructural and mechanical properties.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.254-257
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• 2007

In this paper, anisotropic tensile properties of the AZ31B Mg-alloy sheet are obtained with the tensile test at elevated temperatures. Change of microscopic structures and the hardness is inspected after the solution heat treatment process in order to confirm the micro-structural stability of the used sheet metal. Results obtained from tensile tests show that it is very difficult to apply the conventional modeling scheme with the assumption of strain hardening to the forming analysis of the magnesium alloy sheet which shows the strain-softening behavior at the elevated temperature.

• The Journal of the Korea institute of electronic communication sciences
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• v.6 no.3
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• pp.355-362
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• 2011

In this paper, we developed the equipment to forming the insulation film which there are operated an electrolysis principles in particular solution. In the earlier, there are supplied the anode by unipolar voltage with pulse, in this paper, there are supplied the anode by bipolar voltage with pulse, alternately. And then, we examinate the system that there are developed the bipolar anodizing equipment using H-bridge. There are modulated pulse width for the variable current. In the results, we obtained the results of the uniform film surface that compared with the unipolar anodizing.

• The Journal of the Korea Contents Association
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• v.10 no.6
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• pp.352-359
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• 2010

The objective of this paper is to study on the property transformation for materials and to evaluate the precision through marginal gap depending on heat-treatment of metal-porcelain by the gold electro-forming system. Specimens for evaluating property of hardness treat non-treat(HC), once(H1), twice(H2), and three times(H3) by heating, respectively. Specimens for marginal gap classified as each groups of special bonder(FS), special bonder, opaque(FO), special bonder, opaque, body(FB) and non-treatment(FC). As a result for micro-hardness test, the level of hardness on each groups of H1, H2, H3 decreased rather than HC group(p<0.05). In addition, marginal gap was not affected by the number of times being treated by heating. Therefore, the marginal fitness and the precision for mterials were not affected by the heat-treatment on the process to make GES metal-porcelain.