• 대한기계학회논문집A
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• 제31권10호
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• pp.1039-1045
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• 2007

Ultrasonic machining (USM) is suitable for machining hard, brittle and non-conductive materials such as silicon, glass and ceramics. Usually, when micro holes are machined on glass by USM, roundness of hole entrance is poor and cracks appear around the hole exit. In this paper the machining characteristics were studied for roundness improvement and exit crack prevention. From experiments, the tool bending and the shape of tool tip affect hole roundness. When the tool tip is hemispherical, good roundness of holes was obtained. The feedrate and the rotational speed of the tool affect the exit crack. With the machining conditions of 150 rpm in spindle speed and $0.5\;{\mu}m/s$ in feedrate, micro holes with less than $100\;{\mu}m$ in diameter were machined without an exit crack.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.145-146
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• 2010

• 한국정밀공학회지
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• 제16권10호
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• pp.94-100
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• 1999

Micro-EDM is widely used in machining of miro-parts such as micro-shafts and micro-holes. In order to select proper machining conditions and to reduce the machining time, it is necessary to understand machining characteristics under various machining conditions. Micro-hole machining tests were performed with round shape electrodes with different capacitances and voltages of the power source. The effects of the electrode rotational speed and diameter on the machining rate were also observed. From the experimental results, it was found that capacitance and voltage have significant effects on machining rate and the machined surface integrity. With higher capacitance and higher voltage, higher machining rate was observed together with poorer surface integrity. The electrode diameter was also found to have an effect on the machining rate and electrode wear.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 The 8th Asian Symposium on Precision Forging ASPF
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• pp.179-188
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• 2003

The objective of our study is to investigate the micro fabric ability by conventional metal forming processes. In the present investigation, micro hole punching was studied. We tried to control punching process at the micro level and scaled down the standard blanking condition for $25{\mu}m$ hole fabrication. To accommodate this, tungsten carbide tooling sets and micro punching press were carefully designed and assembled meeting accuracy requirements for $25{\mu}m$ hole punching. With our developments, 100, 50, and $25{\mu}m$ holes were successfully made on metal foils such as brass and stainless steel of 100, 50, and $25{\mu}m$ in thickness, respectively, and hole sizes and shapes were measured and analyzed to investigate fabrication accuracy. Shear behavior during micro punching was also discussed. Our study showed that the conventional punching process could produce high quality holes down to $25{\mu}m$.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 춘계학술대회 논문집
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• pp.436-441
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• 2005

In this study, precision injection molding analysis for BGA connector fabrication was performed. A BGA connector model with rectangular micro-holes were introduced to investigate the effect of mirco patterns on the injection molding process. Dual domain(2.5D) mesh and full 3D mesh for BGA connector model were prepared to perform precision injection molding analysis. To verify the Present analysis, experiments of injection molding were performed based on the results of the analysis. It was shown that the type of mesh has a significant effect on the flow pattern of BGA connector

• 한국분무공학회지
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• 제20권3호
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• pp.181-186
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• 2015

This study presents the dynamic wetting characteristics of an impact droplet on hole-patterned textured surfaces. The flat surfaces were manufactured by a drilling machine to generate the micro-order holes, leading to make the surface hydrophobic. Other flat surfaces were fabricated by the anodizing technique to make hydrophilic texture surfaces with a nanometer order. For hydrophilic and hydrophobic textured surfaces with similar texture area fractions, the impinging droplet experiments were conducted and compared with flat surface cases. As results, an anodized textured surface decreases apparent equilibrium contact angle and increases contact diameters, because of increase in contact area and surface energy. This is attributed to more penetration inside holes from larger capillary pressure on nanometer-order holes. On the other hand, temporal evolution of the contact diameter is smaller for the hydrophobic textured surface from less penetration on the micro-order holes.

• 한국분말재료학회지
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• 제19권3호
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• pp.196-203
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• 2012

$TiO_2$ was successfully formed on a Ti specimen by MAO (Micro-Arc-Oxidation) method treated in $Na_3PO_4$ electrolyte. This study deals with the influence of voltage and working time on the change of surface microstructure and phase composition. Voltage affected the forming rate of the oxidized layer and surface microstructure where, a low voltage led to a high surface roughness, more holes and a thin oxidized layer. On the other hand, a high voltage led to more dense surface structure, wider surface holes, a thick layer and fewer holes. Higher voltage increases photocatalytic activity because of better crystallization of the oxidized layer and good phase composition with anatase and rutile $TiO_2$, which is able to effectively separate excited electrons and holes at the surface.

• 한국정밀공학회지
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• 제27권10호
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.

• 한국정밀공학회지
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• 제27권2호
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• pp.13-19
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• 2010

Due to the rapid spread of mobile handheld devices, industrial demands for micro-scale holes with a diameter of even smaller than $10{\mu}m$ in sapphire/silicon wafers have been increasing. Holes in sapphire wafers are for heat dissipation from LEDs; and those in silicon wafers for interlayer communication in three-dimensional integrated circuit (IC). We have developed a sapphire wafer driller equipped with a 532nm laser in which a cooling chuck is employed to minimize local heat accumulation in wafer. Through the optimization of process parameters (pulse energy, repetition rate, number of pulses), quality holes with a diameter of $30{\mu}m$ and a depth of $100{\mu}m$ can be drilled at a rate of 30holes/sec. We also have developed a silicon wafer driller equipped with a 355nm laser. It is able to drill quality through-holes of $15{\mu}m$ in diameter and $150{\mu}m$ in depth at a rate of 100holes/sec.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.317-318
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• 2008