• Journal of Electrical Engineering and Technology
• /
• v.12 no.2
• /
• pp.718-725
• /
• 2017

The method of stator segmentation is generally taken to enhance the electromagnetic performance of surface-mounted permanent magnet (SPM) machine and reduce its production cost. Based on the model with single slot, the expressions of cogging torque in machine with uniform or non-uniform segmentations are deduced and the optimal combination is given. Moreover, this paper discusses a structured skewing method and put forward a novel stator structure model to reduce the cogging torque in segmented permanent magnet machine. The model can reduce the cogging torque amplitude by shifting a proper angle of slot-opening. The shifting angle formula for analysis can also be suitable for other permanent machine with segmented stator. Finally the results of finite element simulation are given to prove that the method is effective and feasible.

• Journal of Korea Multimedia Society
• /
• v.19 no.12
• /
• pp.2014-2023
• /
• 2016

Web presence is one of the key issues for extensive deployment of Internet-of-Things (IoT). An obstacle to overcome for Web presence is relatively low computing power of IoT devices. In this paper, we present implementation of an IoT platform based on Constrained Application Protocol (CoAP) which is a web transfer protocol proposed by Internet Engineering Task Force (IETF) for the low performance IoT devices such as Wireless Sensor Network (WSN) nodes and micro-controllers. To qualify the performance of CoAP-based IoT system for such an application as smart grid, we designed a test platform consisting of Raspberry Pi2, Kmote WSN node and a desktop PC. Using open source softwares, CoAP was implemented on top of the platform. Leveraging the GET command defined at CoAP specification, performance of the system was measured in terms of round-trip time (RTT) from web application to the Kmote sensor node. To investigate abnormal cases among the test results, hop-by-hop delays were measured to analyze resulting data. The average response time of CoAP-based communication except the abnormal data was reduced by 23% smaller than the previous research result.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.58 no.6
• /
• pp.1138-1145
• /
• 2009

This paper presents an active and reactive power compensator for the wind power system with squirrel-cage induction generator. The output power of a wind power system changes irregularly according to the variation of wind speed. The developed system is able to continuously compensate the active and reactive power. The 3-phase inverter operates for the compensation of reactive power, while the DC/DC converter with super-capacitors operates for the compensation of active power. The operational feasibility of the proposed model was verified by simulations with PSCAD/EMTDC and the feasibility of hardware implementation was confirmed by experimental works with a scaled hardware model. The proposed compensator can be expected that developed system may be used to compensated the abrupt power variation due to sudden change of wind speed or sudden power-drop by tower effect. It can be also applied for the distributed generation and the Micro-Grid.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.19 no.7
• /
• pp.53-59
• /
• 2005

In this paper, we proposed the 2-dimensional inspection algorithm for micro-BGA(Ball Grid Array) device using a vision system. The reposed method uses the subpixel algorithm for high precision. The proposed algorithm preferentially extracts the package area of device in the input image. After the extraction of package area, each ball areas are extracted by ball search window method. The parameters for inspection are calculated for the extracted ball area. In the simulation results, we have the average error within 17[${\mu}m$].

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.24 no.4
• /
• pp.129-139
• /
• 2010

This paper presents a basic energy performance data of microturbine, renewable Energy(BIPV and Solar Collector System) and a hybrid energy system(geothermal system and microturbine) installed in hospital building. The efficiency of solar collector and BIPV system was 30[%], 10[%] individually, and lower than micro turbines. Finally, in energy performance aspect, microturbine and geothermal source heat pump system were a high-efficiency system in hospital building. It is confirmed hybrid energy systems also show the most powerful alternative energy system for green hospital building from the simulation results.

• Proceedings of the KIPE Conference
• /
• 2008.06a
• /
• pp.46-48
• /
• 2008

A concern about micro grid connection system is elevated. The reason is that carbon dioxide emission is regionally restricted to prevent the drain of fossil fuel, high oil prices and global warming. The existing photovoltaic DC-DC converter is operated by the full-bridge method. However, the configuration is complicated because a phase shift method is required to raise an efficiency. A photovoltaic DC-DC converter connected with second layered half-bridge converter and boost converter is proposed in this paper. This proposed DC-DC converter is easy to control and has an advantage of reducing the size. Finally, the validity of the proposed converter is verified by the experimentation.

• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.2
• /
• pp.37-42
• /
• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.32 no.2
• /
• pp.186-193
• /
• 2008

[ $Moir{\acute{e}}$ ] interferometry is an optical method, providing whole field contour maps of in-plane displacements with high resolution. The demand for enhanced sensitivity in displacement measurements leads to the technique of microscopic $moir{\acute{e}}$ interferometry. The method is an extension of the $moir{\acute{e}}$ interferometry, and employs an optical microscope for the required spatial resolution. In this paper, the sensitivity of $moir{\acute{e}}$ interferometry is enhanced by an order of magnitude using an immersion interferometry and the optical/digital fringe multiplication(O/DFM) method. In fringe patterns, the contour interval represents the displacement of 52 nm per fringe order. In order to estimate the reliability and the applicability of the optical system implemented, the measurements of rigid body displacements of grating mold and the coefficient of thermal expansion(CTE) for an aluminium block are performed. The system developed is applied to the measurement of thermal deformation in a flip chip plastic ball grid array package.

• Proceedings of the Korean Society of Broadcast Engineers Conference
• /
• 2017.11a
• /
• pp.144-145
• /
• 2017

최근 전자 기기의 크기가 줄어들고 PCB의 사이즈와 반도체 패키지의 크기가 소형화되어 플립 칩 본딩(Flip chip bonding) 기술을 적용한 반도체 패키지 방식이 점점 늘어나고 있다. 이에 따라 PCB와 반도체 칩 사이를 연결하기 위해 응용되던 BGA(Ball Grid Array)에 핀 배열 대신 사용되는 범프(Bump)를 50um 이내의 초미세 범프로 만들어 일정한 배열을 유지하는 것이 중요하다. 또한 초미세 범프의 모양과 품질이 패키지 수율과 밀접하게 연관되기 때문에 이를 검사할 수 있는 기술이 필수적이다. 이에 본 논문은 초미세 범프측정을 할 수 있는 시스템 개발을 위한 측정 대상의 특징과 사용할 수 있는 광학계를 분석하였고, 획득된 영상을 가지고 딥러닝을 적용하여 정확하게 불량여부를 판별할 수 있는 초미세 범프 측정 시스템을 고안하였다.

• Spatial Information Research
• /
• v.10 no.2
• /
• pp.185-199
• /
• 2002

The objective of this study is to investigate the suitable spatio-temporal analysis method considering the zoning effect of spatial analysis termed the modifiable areal unit problem(MAUP). In former studies of spatio-temporal analysis, there were disagreement between attribute data with spatial data, because of variation of administrative district aggregating attribute data. It is need to consider how the analysis zone effects spatial characteristics and spatio-temporal variation of urban region through land price variation analysis. This study considers MAUP through basic mesh system, which is composed of micro grid. Mesh system can solve disagreement of resolution between spatial data and attribute data.