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http://dx.doi.org/10.3795/KSME-A.2008.32.2.186

Nano-level High Sensitivity Measurement Using Microscopic Moiré Interferometry  

Joo, Jin-Won (충북대학교 기계공학부)
Kim, Han-Jun (충북대학교 대학원 기계공학과)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.32, no.2, 2008 , pp. 186-193 More about this Journal
Abstract
[ $Moir{\acute{e}}$ ] interferometry is an optical method, providing whole field contour maps of in-plane displacements with high resolution. The demand for enhanced sensitivity in displacement measurements leads to the technique of microscopic $moir{\acute{e}}$ interferometry. The method is an extension of the $moir{\acute{e}}$ interferometry, and employs an optical microscope for the required spatial resolution. In this paper, the sensitivity of $moir{\acute{e}}$ interferometry is enhanced by an order of magnitude using an immersion interferometry and the optical/digital fringe multiplication(O/DFM) method. In fringe patterns, the contour interval represents the displacement of 52 nm per fringe order. In order to estimate the reliability and the applicability of the optical system implemented, the measurements of rigid body displacements of grating mold and the coefficient of thermal expansion(CTE) for an aluminium block are performed. The system developed is applied to the measurement of thermal deformation in a flip chip plastic ball grid array package.
Keywords
Micro $Moir{\acute{e}}$ Interferometry; Thermal Deformation; Electronic Package; Coefficient of Thermal Expansion;
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Times Cited By KSCI : 2  (Citation Analysis)
Times Cited By SCOPUS : 0
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1 Post, D., Wood. J. D., Han, B. Parks, V. J. and Gerstle, Jr., F. P., 1994, 'Thermal Stresses in a Bimaterial Joint: An Experimental Analysis,' J. Applied Mechanics, Trans. ASME, Vol. 61, No. 1, pp. 192~198   DOI   ScienceOn
2 Han, B., 1998, 'Recent Advancements of Moire and Microscopic Moire Interferometry for Thermal Deformation Analysis of Microelectrics Devices,' Experimental Mechanics, Vol. 38, No. 4, pp. 278~288
3 Post, D., Han, B. and Ifju, P., 1994, High Sensitivity Moire: Experimental Analysis for Mechanics and Materials, Springer-Verlag, New York
4 Joo, J. W., Kim, H. J., Lee, W. H., Kim, J. Y. and Choi, J. H., 2007, 'Material Parameters Identification of Adhesive in Layered Plates Using Moire Interferometry and Optimization Technique,' Trans. of the KSME, A, Vol.31, No.1 pp. 1100~1107   DOI
5 Joo, J. W. and Han, B. T., 2002, 'Thermomechanical and Flexural Analysis of WB-PBGA Package Using Moire Interferometry,' Trans. of the KSME, A, Vol.26, No.7, pp.1302~1308   DOI
6 Joo, J. W., Cho, S and Han, B,, 2005, 'Characterization of Flexural and Thermomechanical Behavior of Plastic Ball Grid Array Package Assembly Using Moire Interferometry,' Micrelectronics Reliability, Vol. 45, Iss. 4, pp.637~646 (2005)   DOI   ScienceOn
7 Han, B. and Guo, Y., 1995, 'Thermal Deformation Aanalysis of Various Electronic Packaging Products by Moire and Microscopic Moire Interferometry,' J. Electronic Packaging, Trans. ASME, Vol. 117, pp. 185~191   DOI
8 Han, B., 1997, 'Deformation Mechanism of Two Phase Solder Column Interconnections Under Highly Accelerated Thermal Cycling Condition: an Experimental Study,' J. Electronic Packaging, Tran. ASME, Vol. 119, pp. 189~196   DOI   ScienceOn
9 Joo, J. and Cho, S., 2004, 'Evaluation of Thermal Deformation Model for BGA Packages Using Moire Interferometry,' KSME International Journal, Vol. 2, No. 2, pp.230~239