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Post, D., Wood. J. D., Han, B. Parks, V. J. and Gerstle, Jr., F. P., 1994, 'Thermal Stresses in a Bimaterial Joint: An Experimental Analysis,' J. Applied Mechanics, Trans. ASME, Vol. 61, No. 1, pp. 192~198
DOI
ScienceOn
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Han, B., 1998, 'Recent Advancements of Moire and Microscopic Moire Interferometry for Thermal Deformation Analysis of Microelectrics Devices,' Experimental Mechanics, Vol. 38, No. 4, pp. 278~288
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Post, D., Han, B. and Ifju, P., 1994, High Sensitivity Moire: Experimental Analysis for Mechanics and Materials, Springer-Verlag, New York
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Joo, J. W., Kim, H. J., Lee, W. H., Kim, J. Y. and Choi, J. H., 2007, 'Material Parameters Identification of Adhesive in Layered Plates Using Moire Interferometry and Optimization Technique,' Trans. of the KSME, A, Vol.31, No.1 pp. 1100~1107
DOI
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Joo, J. W. and Han, B. T., 2002, 'Thermomechanical and Flexural Analysis of WB-PBGA Package Using Moire Interferometry,' Trans. of the KSME, A, Vol.26, No.7, pp.1302~1308
DOI
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Joo, J. W., Cho, S and Han, B,, 2005, 'Characterization of Flexural and Thermomechanical Behavior of Plastic Ball Grid Array Package Assembly Using Moire Interferometry,' Micrelectronics Reliability, Vol. 45, Iss. 4, pp.637~646 (2005)
DOI
ScienceOn
|
7 |
Han, B. and Guo, Y., 1995, 'Thermal Deformation Aanalysis of Various Electronic Packaging Products by Moire and Microscopic Moire Interferometry,' J. Electronic Packaging, Trans. ASME, Vol. 117, pp. 185~191
DOI
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Han, B., 1997, 'Deformation Mechanism of Two Phase Solder Column Interconnections Under Highly Accelerated Thermal Cycling Condition: an Experimental Study,' J. Electronic Packaging, Tran. ASME, Vol. 119, pp. 189~196
DOI
ScienceOn
|
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Joo, J. and Cho, S., 2004, 'Evaluation of Thermal Deformation Model for BGA Packages Using Moire Interferometry,' KSME International Journal, Vol. 2, No. 2, pp.230~239
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