• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1522-1523
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• 2007

MEMS(Micro Electro Mechanical Systems)기술과 니켈 전기도금 공정을 이용하여 수십 내지 수백개의 탐침소자를 갖는 프르브디바이스(probe device)를 제작하였다. 사용된 기판은 $4000{\AA}$의 oxide가 있는 p-type 실리콘 웨이퍼로서, 기판위에 NiCr과 Au를 증착한 후 PR 패터닝을 통하여 니켈을 전기도금법으로 도금하고 니켈 도금층을 제외한 부분의 NiCr과 Au를 식각함으로서 전류가 흐르는 라인(line)배선과 탐침소자가 세워질 라인을 형성하였다. 그 후 후막의 PR을 코팅하고 탐침소자가 세워질 부분을 패터닝 한 후 전기도금법을 이용하여 니켈 탐침소자를 제작하였다. 제작된 탐침소자 하나의 크기는 $60{\mu}m$의 폭과 $70{\mu}m$의 높이를 보이며, 탐침소자 전체의 크기는 $250{\mu}m$이고 탐침소자와 탐침소자 사이의 간격은 $50{\mu}m$로 제작되었다. 본 연구에서 제작된 탐침소자의 수는 25*2line으로서 총 50개 이지만 이러한 공정방식을 이용하고 탐침소자의 크기를 작게 제작한다면 하나의 프르브 디바이스에 수백 내지수천 개의 탐침소자를 제작할 수 있을 것이다.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.178-184
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• 2006

Hot embossing is to fabricate desired pattern on the polymer substrate by pressing the patterned mold against the substrate which is heated above the glass transition temperature, and it is a high throughput fabrication method for bio chip, optical microstructure, etc. due to the simultaneous large area patterning. However, the bad pattern fidelity in large area patterning is one of the obstacles to applying the hot embossing technology for mass production. In the present study, PDMS pad was used as a cushion on the backside of the micro-patterned 4 inch Si mold to improve the pattern fidelity over the 4 inch PMMA sheet by increasing the conformal contact between the Si mold and the PMMA sheet. The pattern replicability improvement over 4 inch wafer scale was evaluated by comparing the replicated pattern height and depth for PDMS-cushioned Si mold against the rigid Si mold without PDMS cushion.

• Journal of Sensor Science and Technology
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• v.31 no.6
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• pp.366-370
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• 2022

A 12 ㎛ pixel-sized 360 × 240 microbolometer focal plane array (MBFPA) was fabricated using a complementary metaloxide-semiconductor (CMOS)-compatible process. To release the MBFPA membrane, an amorphous carbon layer (ACL) processed at a low temperature (<400 ℃) was deposited as a sacrificial layer. The thermal time constant of the MBFPA was improved by using serpentine legs and controlling the thickness of the SiNx layers at 110, 130, and 150 nm on the membrane, with response times of 6.13, 6.28, and 7.48 msec, respectively. Boron-doped amorphous Si (a-Si), which exhibits a high-temperature coefficient of resistance (TCR) and CMOS compatibility, was deposited on top of the membrane as an IR absorption layer to provide heat energy transformation. The structural stability of the thin SiNx membrane and serpentine legs was observed using field-emission scanning electron microscopy (FE-SEM). The fabrication yield was evaluated by measuring the resistance of a representative pixel in the array, which was in the range of 0.8-1.2 Mohm (as designed). The yields for SiNx thicknesses of SiNx at 110, 130, and 150 nm were 75, 86, and 86%, respectively.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.19 no.5
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• pp.262-267
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• 2009

Superhydrophobic $TiO_2$ thin films were successfully fabricated on a glass substrate by wet process. Layer-by-layer (LBL) deposition and liquid phase deposition (LPD) methods were used to fabricate the thin films of micro-nano complex structure with a high roughness. To fabricate superhydrophobic $TiO_2$ thin films, the (PAH/PAA) thin films were assembled on a glass substrate by LBL method and then $TiO_2$ nanoparticles were deposited on the surface of (PAH/PAA) thin film by LPD method, Subsequently, hydrophobic treatment using fluoroalkyltrimethoxysilane (FAS) was carried out on the surface of prepared $TiO_2$ thin films. The $TiO_2$ thin film fabricated with 45 minutes immersion time on $(PAH/PAA)_{10}$ showed the RMS roughness of 65.6nm, water contact angel of $155^{\circ}$ and high transmittance of above 80% (>650nm in wavelength) after the hydrophobic treatment. The Surface morphologies, optical properties and contact angel of prepared thin films with different experimental conditions were measured by field emission scanning electron microscope (FE-SEM), atomic force microscope (AFM), UV-Vis spectrophotometer and contact angle meter.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.299-299
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• 2014

기존의 고출력 광원들이 환경문제 등으로 외국에서 규제대상으로 지정되고 있는 가운데고체 상태의 광원인 Light-emitting diode (LED)는 기존의 광원에 비해 에너지 절감효과 크기 때문에 인해 널리 사용되고 있는 추세이다. 대부분의 백색 LED의 경우 청색 LED에 황색 형광체를 사용하는 것이 일반적이다. 그러나 이의 경우 빛의 흡수와 재방출 과정에서 생기는 에너지 변환손실의 문제가 불가피하다. 또한, 두 종류의 색을 섞어서 나타나는 낮은 연색성의 문제가 있고 사용할 수 있는 형광체의 종류와 조합도 일본 등 해외에 출원된 특허권으로 연구개발에 어려움이 있다. 이를 해결하기 위해 본 연구에서는 형광체를 사용하지 않는 단일 백색 LED를 개발을 위하여 극성과 반극성을 조합한 구조를 연구하였다. Photo-lithography를 이용하여 다양한 크기와 구조의 홀 패턴을 얻을 수 있었으며, metal organic chemical vapor deposition을 이용하여 다양한 형태의 피라미드 구조를 성장할 수 있었다. 패턴의 홀 크기와 홀 사이의 간격을 조절하면서 성장을 진행 하였고, 그 결과 pyramid와 truncated pyramid 모양의 GaN 구조를 성장할 수 있었다. [그림 1] Pyramid 구조의 반극성 면과 truncated pyramid 구조의 극성 면사이의 성장속도 차이 때문에 양자우물의 두께가 달라짐을 확인하였다. 이로 인해 양자구속효과가 달라져 다른 파장의 발광을 기대할 수 있었다. 뿐만 아니라 In의 확산거리가 Ga보다 길어서 홀사이 간격을 달리하면 In조성비가 달라지는 효과가 있음을 확인하였고 다양한 홀 사이 간격으로부터 각기 다른 파장의 발광을 얻을 수 있었다. 파장을 조금 더 상세하게 분석하기 위하여 Photoluminescence과 Cathodoluminescence을 사용하였다. 이로써 여러 파장을 발광하는 패턴을 섞어 넓은 영역의 발광 스펙트럼을 만들었다. 특히 패턴을 섞는 방법도 홀과 에피 구조를 섞는 방법, 크기가 다른 홀 패턴을 배열하는 방법등 다양히 하며 가장 좋을 패턴을 연구하였다. 그리하여 최적의 패턴과 구조, 성장조건을 찾아 백색의 CIE 좌표값을 얻을 수 있었다.

• Journal of the Optical Society of Korea
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• v.18 no.5
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• pp.569-573
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• 2014

We demonstrate a low-cost, superbly efficient way of etching for the nano-, and micro-sized pyramid patterns on (100)-oriented Si wafer surfaces for use as a patterned master. We show a way of producing functional optical films for the viewing angle direction brightness-enhancement of Lambertian LED (light emitting diode)/OLED (organic light emitting diode) planar lighting applications. An optimally formulated KOH (Potassium hydroxide) wet etching process enabled random-positioned, and random size-distributed (within a certain size range) pyramid patterns to be developed over the entire (100) silicon wafer substrates up to 8" and a simple replication process of master patterns onto the PC (poly-carbonate) and PMMA (poly-methyl methacrylate) films were performed. Haze ratio values were measured for several film samples exhibiting excellent values over 90% suitable for LED/OLED lighting purposes. Brightness was also improved by 13~14% toward the viewing angle direction. Computational simulations using LightTools$^{TM}$ were also carried out and turned out to be in strong agreement with experimental data. Finally, we could check the feasibility of fabricating low-cost, large area, high performance optical films for commercialization.

• Journal of Pharmaceutical Investigation
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• v.41 no.3
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• pp.147-151
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• 2011

This paper demonstrates the development of a method for preparing micropatterned microdiscs in order to increase contact area with cells and to change the release pattern of drugs. The microdiscs were manufactured with hot embossing, where a polyurethane master structure was pressed onto both solid and porous microparticles made of polylactic-co-glycolic acid at various temperatures to form a micropattern on the microdiscs. Flat microdiscs were formed by hot embossing of porous microparticles; the porosity allowed space for flattening of the microdiscs. Three types of micro-grooves were patterned onto the flat microdiscs using prepared micropatterned molds: (1) 10 ${\mu}M$ deep, 5 ${\mu}M$ wide, and spaced 2 ${\mu}M$ apart; (2) 10 ${\mu}M$ deep, 9 ${\mu}M$ wide, and spaced 5 ${\mu}M$ apart; and (3) 10 ${\mu}M$ deep, 50 ${\mu}M$ wide, and spaced 50 ${\mu}M$ apart. This novel microdisc preparation method using hot embossing to create micropatterns on flattened porous microparticles provides the opportunity for low-cost, rapid manufacture of microdiscs that can be used to control cell adhesion and drug delivery rates.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.2251-2253
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• 2000

MEMS기술을 이용하여 단층 실리콘 나이트라이드($Si_{3}N_4$) 다이아프램을 제조하고, 이 다이아프램상에 저항성 가열 진공증착법과 고주파 마그네트론 스퍼터링법을 이용하여 차례로 In막과 ZnO막을 증착하고, In의 도핑을 위해 열처리하여 $NH_3$ 가스 감지용 마이크로센서를 제작하였다. 감지막의 열처리온도에 따른 구조적 및 전기적 특성은 XRD, SEM, AFM, 4-point probe 및 Electrometer를 통하여 각각 조사하였다. 제작된 센서의 열처리온도와 인가전력에 따라 $NH_3$ 가스에 대한 감도, 선택성 및 시간응답 특성을 조사하였다. 감지막 두께 3000 ${\AA}$, 열처리온도 400$^{\circ}C$로 제조된 마이크로 센서가 히터 인가전력 366 mW에서 100 ppm의 $NH_3$ 가스농도에서 대하여 16 %, 350 ppm의 가스농도에서 대하여 23 %의 가장 우수한 감도를 나타내었다. 그러나 CO 가스 및 $NO_x$ 가스에 대한 감지특성은 관찰되지 않았다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.2
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• pp.107-119
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• 2021

The cross-flow turbine is one of the most famous and widely used hydraulic power systems for a long time. The cross-flow turbine is especially popular in many countries and remote regions where off-grided because of its many benefits such as low cost, high efficiency at low head, simple structure, and easy maintenance. However, most modern turbines, including the cross-flow turbine, are unsuitable for the ultra-low head situation, known as less than 3m water head or zero head with over 0.5m/s flow velocity. In this study, we demonstrated a 20kW class inverted-type cross-flow turbine's performance. First, we reevaluated our previous studies and introduced how to design the inverted-type cross-flow turbine. Secondly, we fabricated the 20kW class inverted-type cross-flow turbine for the performance test. And then, we designed a testbed and installed the turbine system in the demonstration facility. In the end, we compare the demonstration with its previous CFD results. The comparing result shows that both CFD and real model fitted on guide vane angle at 10 degrees. At the demonstration, we achieved 42% turbine efficiency at runner speed 125 RPM.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.1-12
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• 2021

Here, we introduce a laser-induced graphene synthesis technology and its applications for the electric/electronic device manufacturing process. Recently, the micro/nanopatterning technique of graphene has received great attention for the utilization of these new graphene structures, which shows progress developments at present with a variety of uses in electronic devices. Some examples of practical applications suggested a great potential for the tunable graphene synthetic manners through the control of the laser set-up, such as a selection of the wavelength, power adjustment, and optical techniques. This emerging technology has expandability to electric/electronic devices combined together with existed micro-packaging technology and can be integrated with the new processing steps to be applied for the operation in the fields of biosensors, supercapacitors, electrochemical sensors, etc. We believe that the laser-induced graphene technology introduced in this paper can be easily applied to portable small electronic devices and wearable electronics in the near future.