• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 춘계학술대회 논문집
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• pp.47-50
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• 2005

In this study, micro mirror array for small form factor optical pick-up was replicated by micro UV-molding. First, mold for micro mirror array was fabricated using micromachining. Also, to analyze the characteristics of the surface quality, flatness of replicated mirror surface were measured by white light scanning inteferometry system. The results show that the micro mirror array with a sufficient surface quality can be obtained by polymer replication process.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.599-600
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• 2011

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.152-152
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• 2009

We investigate micro-tip properties as Ni-Co plating and CMP processes for MEMS probe card and units. The micro-tip are fabricated by using Ni-Co plating machine, lapping machine, and chemo-mechanical polisher. In order to get high conductive and reliable micro-tip, we control Co contents and thickness by CMP speed. We have found that about 20-25% of Co contents are required and have to lapping speed of 30 rpm. Also, we investigate photolithography and Ni-Co plating processes conditions for the one-step and the three-step micro-tips.

• 한국정밀공학회지
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• 제24권8호통권197호
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• pp.138-143
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• 2007

Microstereolithography technology is similar to the conventional stereolithography process and enables to fabricate a complex 3D microstructure. This is divided into scanning and projection type according to aiming at precision and fabrication speed. The scanning MSL fabricates each layer using position control of laser spot on the resin surface, whereas the projection MSL fabricates one layer with one exposure using a mask. In the projection MSL, DMD used to generate dynamic pattern consists of $1024{\times}768$ micromirrors which have $13.68{\mu}m$ per side. The fabrication range and resolution are determined by the field of view of the DMD and the magnification of the projection lens. If using the projection lens with high power, very fine microstructures can be fabricated. In this paper, the projection MSL system adapted to a large surface for array-type fabrication is presented. This system covers the meso range, which is defined as the intermediate range between micro and macro, with a resolution of a few ${\mu}m$. The fabrication of array-type microstructures has been demonstrated to verify the performance of implemented system.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.207-235
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• 2001

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 춘계학술대회 논문집
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• pp.60-63
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• 2009

Manufacturing technologies of micro spur gear and micro mold by micro PIM were studied with stainless steel feedstock. For molding of gears, micro mold with gear cavity of 1.2 mm in diameter was produced by wire EDM. The proper injection pressure was selected to 70bar by observation and measuring of shapes and shrinkage of gears before/after sintering. For fabrication of micro mold, a tiny polymer gear was produced by injection into the mold. Then, 316L feedstock was again injected/compressed on the polymer gear and debinded together with polymer gear followed by sintering. As a result, another metal mold with gear cavity reduced to about 20% was fabricated and through repetition of this process chain, micro gear mold with cavity about below 800 um was finally obtained. In reduction of size by injection/compression molding, height of gear tooth was shrunk more and the effort for decrease of roughness of micro cavity were carried out ultrasonic polishing and as a result, the roughness in cavity decreased from 3-4 um to about 200 nm.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 춘계학술대회 논문집
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• pp.84-87
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• 2009

This paper describes a novel method for fabricating large area metallic stamp with high aspect ratio micro intaglio features. Micro machined brass master with pillar and larger width groove patterns were electroformed to form inverse structures on the large area metallic stamp. This enabled large area metallic stamp with fine micro high aspect ratio micro intaglio features which were small width groove patterns and quadrilateral hole patterns that cannot be fabricated by direct micro machining process. Fabricated large area metallic stamp with high aspect ratio micro intaglio features was measured and analyzed.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 추계학술대회 논문집
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• pp.274-279
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• 2002

In this paper, the development process of an unique and creative micro/nano-structure fabrication technique based on micro/nano-tribology are reviewed and discussed. The so-called Mechano-Chemical Process(MCP), which has been developed since 1995 by Tribology Research Laboratory at Yonsei University with the motivation to overcome the demerits of the conventional photolithographic techniques, is based on the fundamental understanding of the interaction between the tool tip and the workpiece surface. This process is a maskless process which offers tremendous flexibility in surface patterns that can be created on a workpiece surface without using any capital intensive equipment. It Is capable of fabricating the prototypes of micro/nano-components, micro- structured surface with various geometries, micro-molds for making polymer or metal parts, and micro-fluidic channels for lab-on-a- chip

• 한국정밀공학회지
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• 제22권5호
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• pp.175-180
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• 2005

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. In this research, fabrication of micro plasma electrode was carried out using FIB. The one of problems of FIB-sputtering is the redeposition of material including Ga+ ion source during sputtering process. Therefore the effect of the redeposition was verified by EDX. And the micro plasma electrode of copper was fabricated by FIB.

• 한국산학기술학회논문지
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• 제18권5호
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• pp.674-680
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• 2017

본 논문은 현재 개인 휴대기기 및 대형 디스플레이 장비의 제어에서 폭넓게 사용되고 있는 터치스크린 패널 (TSP; Touch Screen Panel)의 정상 작동 유무를 확인하기 위한 micro bump 제작 기술에 관한 연구이다. 터치스크린 패널은 감압식, 정전식 등의 여러 가지 방식이 있으나 지금은 편리성에 의하여 정전식 방식이 주도하고 있다. 정전식의 경우 해당하는 좌표의 접촉에 따라 전기적 신호가 변화하게 되고, 이를 통하여 접촉 위치를 확인할 수 있으며 따라서 접촉 위치에 따른 전기 특성 검사가 필수적이다. 검사공정에서 TSP의 모델이 변경됨에 따라 새로운 micro bump를 제작이 및 검사 프로그램의 수정이 필수적이다. 본 논문에서는 새로운 micro bump 제작 시 mask를 사용하지 않아 보다 경제적이며 변화에 대응이 유연한 maskless lithography 시스템을 이용하여 micro bump 제작 가능성에 대하여 확인하였다. 이를 위하여 제작되는 bump의 pitch에 따른 전기장 간섭 시뮬레이션을 진행하였으며, maskless lithogrphy 공정을 적용하기 위한 패턴 이미지를 생성하였다. 이후 MEMS 기술에 해당하는 PR(Photo Resist) 패터닝 공정에서 노광(Lithography) 공정 및 현상(Developing) 공정을 통하여 PR 마스크를 제작한 후 electro-plating 공정을 통하여 micro bump를 제작하였다.