• Title/Summary/Keyword: Micro Dimension Control

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Surface energy control of ITO substrate for Inkjet printing of PEDOT/PSS

  • Kim, M.K.;Lee, S.H.;Hwang, J.Y.;Kang, K.T.;Kang, H.S.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.523-525
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    • 2008
  • Inkjet printing is being considered as an alternative to the conventional lithography in the electronic industry. Surface energy control of substrate is a critical issue in controlling the dimension of microstructures by the inkjet printing. This study introduces the surface energy control of ITO substrate for in/q'et printing of PEDOT/PSS.

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3-D Simulation of Thermal Multimorph Actuator based on MUMPs process

  • Klaitabtim, Don;Tuantranont, Adisorn
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.1115-1117
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    • 2005
  • This paper describes the three dimension model and simulation results of a thermal actuator based on polyMUMPs process, known as thermal multimorph actuator. The device has potential application in micro-transducers such as atomic force microscope (AFM) tip and scanning tunneling microscope (STM) tip. This device made of a multi-layer materials stack together with consisted of polysilicon, $SiO_2$ and gold. A mask layout design, three dimension model and simulation results are reported and discussed.

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Development of micro check valve with polymer MEMS process for medical cerebrospinal fluid (CSF) shunt system (Polymer MEMS 공정을 이용한 의료용 미세 부품 성형 기술 개발)

  • Chang, J.K.;Park, C.Y.;Chung, S.;Kim, J.K.;Park, H.J.;Na, K.H.;Cho, N.S.;Han, D.C.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.05a
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    • pp.1051-1054
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    • 2000
  • We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2*0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5*2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

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Development of a Fast Alignment Method of Micro-Optic Parts Using Multi Dimension Vision and Optical Feedback

  • Han, Seung-Hyun;Kim, Jin-Oh;Park, Joong-Wan;Kim, Jong-Han
    • 제어로봇시스템학회:학술대회논문집
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    • 2003.10a
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    • pp.273-277
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    • 2003
  • A general process of electronic assembly is composed of a series of geometric alignments and bonding/screwing processes. After assembly, the function is tested in a following process of inspection. However, assembly of micro-optic devices requires both processes to be performed in equipment. Coarse geometric alignment is made by using vision and optical function is improved by the following fine motion based on feedback of tunable laser interferometer. The general system is composed of a precision robot system for 3D assembly, a 3D vision guided system for geometric alignment and an optical feedback system with a tunable laser. In this study, we propose a new fast alignment algorithm of micro-optic devices for both of visual and optical alignments. The main goal is to find a fastest alignment process and algorithms with state-of-the-art technology. We propose a new approach with an optimal sequence of processes, a visual alignment algorithm and a search algorithm for an optimal optical alignment. A system is designed to show the effectiveness and efficiency of the proposed method.

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Controlling the Depth of Microchannels Formed during Rolling-based Surface Texturing

  • Bui, Quang-Thanh;Ro, Seung-Kook;Park, Jong-Kweon
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.25 no.6
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    • pp.410-420
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    • 2016
  • The geometric dimension and shape of microchannels that are formed during surface texturing are widely studied for applications in flow control, and drag and friction reduction. In this research, a new method for controlling the deformation of U channels during micro-rolling-based surface texturing was developed. Since the width of the U channels is almost constant, controlling the depth is essential. A calibration procedure of initial rolling gap, and proportional-integral PI controllers and a linear interpolation have been applied simultaneously to control the depth. The PI controllers drive the position of the pre-U grooved roll as well as the rolling gap. The relationship between the channel depth and rolling gap is linearized to create a feedback signal in the depth control system. The depth of micro channels is studied on A2021 aluminum lamina surfaces. Overall, the experimental results demonstrated the feasibility of the method for controlling the depth of microchannels.

Micro-bump Joining Technology for 3 Dimensional Chip Stacking (반도체 3차원 칩 적층을 위한 미세 범프 조이닝 기술)

  • Ko, Young-Ki;Ko, Yong-Ho;Lee, Chang-Woo
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.10
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    • pp.865-871
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    • 2014
  • Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

Photoresist spray coating for three-dimensional micro structure (3차원 마이크로 구조를 위한 포토레지스트 스프레이 코팅)

  • Kim, Do-Wook;Eun, Duk-Su;Bae, Young-Ho;Yu, In-Sik;Suk, Chang-Gil;Jeong, Jong-Hyun;Cho, Chan-Seop;Lee, Jong-Hyun
    • Journal of Sensor Science and Technology
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    • v.15 no.3
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    • pp.153-157
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    • 2006
  • This paper presents the method for three-dimensional micro structure with photoresist spray coating system. The system consists of a high temperature rotational chuck, ultrasonic spray nozzle module, angle control module and nozzle moving module. Spray coating system is effected by several parameters such as the solid contents, the dispensed volume, the scanning speed of the spray nozzle and the wafer of dimension. The photoresist (AZ 1512) has been coated on the three-dimensional micro structure by spray coating system and the characteristics have been evaluated.

High Power Factor Control of High-speed Single-phase BLDC Motor (초고속 단상 BLDC 전동기의 고역률 전력 제어 방법)

  • Lee, Wook-Jin;Jung, Bumun
    • The Transactions of the Korean Institute of Power Electronics
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    • v.21 no.2
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    • pp.144-149
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    • 2016
  • This paper presents a power control method of high-speed single-phase BLDC motor. Most electric appliances require a power factor corrector (PFC) to mitigate grid current harmonics. However, the reactive components and power semiconductors in the PFC increase system cost and dimension. In this paper, a new motor drive system for a high-speed single-phase BLDC motor is proposed, which can decrease grid current harmonics without PFC by directly manipulating motor power and eliminating bulky electrolytic dc-link capacitor. Given that the proposed motor power control method does not require motor current controller, no current sensor is necessary. Moreover, the proposed algorithms can be easily implemented using a low-cost micro-controller. The effectiveness of the proposed power control method is verified by experiments.

Development of Wing and Driving Mechanism for Flapping Micro Air Vehicle using Piezoelectirc and Electroactive Materials. (압전 특성을 이용한 날개짓 비행체의 날개 구동 장치 개발)

  • 이광락;박지형;김성주
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.709-712
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    • 2003
  • The existing technical limitation makes engineer imitate nature to solve engineering problems. Recently Micro Air Vehicle(MAV) imitating the mechanism of birds or insects is being developed. Especially Ultra Flite supported by DARPA is studying hummingbird aerodynamics to relate that information to MAV. To drive MAV bender piezoelectric(PZT) actuators are used due to the convinience of control and the small size. But the displacement of the PZT actuators are very small, and the wing driving mechanism which amplifies the stroke generated by the PZT actuators has constraints in design and manufacture because of the small dimension. In this paper a wing design concept and a efficient driving mechanism are proposed. Electroactive polymers(EAPs) are used as wing mechanism actuators. Using OpenGL the mechanisms are simulated graphically. Also a prototype actuator is being developed and verified by digital Mockup with CATIA. Basic kinematics of the mechanism is studied.

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