• Journal of Magnetics
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• 제11권1호
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• pp.25-29
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• 2006

Recent experiments have demonstrated high TMR ratios in MTJs with the MgO barrier [1,2]. The CoFeB/MgO/CoFeB junctions showed better properties than the CoFe/MgO/CoFe junctions because the MgO layer had a good crystalline structure with (001) texture and smooth and sharp interface between CoFeB/MgO [3]. The amorphous CoFeB with 20 at%B starts the crystallization at $340^{\circ}C$ [4] and this crystallization of the CoFeB helps obtaining the high TMR ratio. In this work, the compositional changes in the MgO barrier and at the interface of CoFeB/MgO/CoFeB after the CoFeB crystallization were studied in annealed MTJs. XPS depth profiles were utilized. TEM analyses showed that the MgO barrier had (100) texture on CoFeB in the junctions. B in the bottom CoFeB layer diffused into the MgO barrier and B-oxide was formed at the interface of CoFeB/MgO/CoFeB after the CoFeB crystallization.

• 전기학회논문지
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• 제64권11호
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• pp.1587-1591
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• 2015

For a higher definition discharge cell, the method of high speed addressing is necessary. In order to modify the surface charges, the liquefied $TiO_2$ or MgO powder is added on MgO layer in front glass and on the phosphor in rear glass in micro barrier discharge. Both the electro-optical properties and the discharge time lag characteristics are measured from 4 inch. test panel, such as the discharge voltage, current, luminance, luminous efficacy and discharge time lag. As the results, the statistic time lag is improved by about 40 %.

• 한국재료학회지
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• 제10권2호
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• pp.160-165
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• 2000

Sputter Cu(1-4.5at.%Mg) alloy를 100mTorr이하의 산소압력에서 온도를 증가시키며 열처리하였을 때 표연과 계면에서 형성된 MgO의 확산방지막 특성을 살펴보았다 먼저, $Cu(Mg)/SiO_2/Si$ 구조의 샘플을 열처리했을 때 계면에서는 $2Mg+SiO_2{\rightarrow}2MgO+Si$의 화학반응에 의해 MgO가 형성되는데 이 MgO충에 의해 Cu가 $SiO_2$로 확산되는 것이 현저하게 감소하였다. TiN/Si 기판 위에서도 Cu(Mg)과 TiN 계면에 MgO가 형성되어 Cu(4.5at.%Mg)의 경우 $800^{\circ}C$까지 Cu와 Si의 확산을 방지할 수 있었다. 표면에 형성된 MgO위에 Si을 증착하여 $Si/MgO(150\;{\AA})/Cu(Mg)/SiO_2/Si$구조로 만든 후 열처리했을 때 $150\;{\AA}$의 MgO는 $700^{\circ}C$까지 Si과 Cu의 확산을 방지할 수 있었다. 표면에 형성된 MgO($150\;{\AA}$)의 누설전류특성은 break down 5V, 누설전류 $10^{-7}A/\textrm{cm}^2$의 값을 나타냈다. 또한 $Si_3N_4/MgO$ 이중구조에서는 매우 낮은 누설전류밀도를 나타냈으며 MgO에 의해 $Si_3N_4$ 증착시 안정적인 계면이 형성됨을 확인하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.387-387
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• 2013

Currently, the flash memory and the dynamic random access memory (DRAM) have been used in a variety of applications. However, the downsizing of devices and the increasing density of recording medias are now in progress. So there are many demands for development of new semiconductor memory for next generation. Magnetic random access memory (MRAM) is one of the prospective semiconductor memories with excellent features including non-volatility, fast access time, unlimited read/write endurance, low operating voltage, and high storage density. MRAM is composed of magnetic tunnel junction (MTJ) stack and complementary metal-oxide semiconductor (CMOS). The MTJ stack consists of various magnetic materials, metals, and a tunneling barrier layer. Recently, MgO thin films have attracted a great attention as the prominent candidates for a tunneling barrier layer in the MTJ stack instead of the conventional Al2O3 films, because it has low Gibbs energy, low dielectric constant and high tunneling magnetoresistance value. For the successful etching of high density MRAM, the etching characteristics of MgO thin films as a tunneling barrier layer should be developed. In this study, the etch characteristics of MgO thin films have been investigated in various gas mixes using an inductively coupled plasma reactive ion etching (ICPRIE). The Cl2/Ar, CH3OH/Ar, and CH4/Ar gas mix were employed to find an optimized etching gas for MgO thin film etching. TiN thin films were employed as a hard mask to increase the etch selectivity. The etch rates were obtained using surface profilometer and etch profiles were observed by using the field emission scanning electron microscopy (FESEM).

• 반도체디스플레이기술학회지
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• 제20권3호
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• pp.22-26
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• 2021

Thin-film encapsulation (TFE) technology is most effective in preventing water vapor and oxygen permeation in the organic light emitting diodes (OLED). Of those, a laminated structure of Al₂O₃ and MgO were applied to provide efficient barrier performance for increasing the stability of devices in air. Atomic layer deposition (ALD) method is known as the most promising technology for making the laminated Al₂O₃/MgO and is used to realize a thin film encapsulation technology in organic light-emitting diodes. Atomic layer deposited inorganic films have superior barrier performance and have advantages of excellent uniformity over large scales at relatively low deposition temperatures. In this study, the control system of the MgCP₂ precursor for the atomic layer deposition of MgO was established in order to deposit the MgO layer stably by the injection time of second level and the stable heating temperature. The deposition rate was obtained stably to be from 4 to 10 Å/cycle using the injection pulse times ranging from 3 to 12 sec and a substrate temperature ranging from 80 to 150 ℃.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.213-213
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• 2010

Magnetic random access memory (MRAM), based on magnetic tunnel junction (MTJ) and CMOS, is one of the best semiconductor memories because it can provide nonvolatility, fast access time, unlimited read/write endurance, low operating voltage and high storage density. For the realization of high density MRAM, the etching of MTJ stack with good properties is one of a key process. Recently, there has been great interest in the MTJ stack using MgO as barrier layer for its huge room temperature MR ratio. The use of MgO barrier layer will undoubtedly accelerate the development of MTJ stack for MRAM. In this study, high-density plasma reactive ion etching of MgO films was investigated in an inductively coupled plasma of $Cl_2$/Ar gas mixes. The etch rate, etch selectivity and etch profile of this magnetic film were examined on vary gas concentration. As the $Cl_2$ gas concentration increased, the etch rate of MgO monotonously decreased and etch slop was slanted. The effective of etch parameters including coil rf power, dc-bais voltage, and gas pressure on the etch profile of MgO thin film was explored, At high coil rf power, high dc-bais voltage, low gas pressure, the etching of MgO displayed better etch profiles. Finally, the clean and vertical etch sidewall of MgO films was achieved using $Cl_2$/Ar plasma at the optimized etch conditions.

• 한국진공학회지
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• 제10권2호
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• pp.234-240
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• 2001

본 연구에서는 Mg을 첨가한 Cu-alloy에 의해 TiN의 확산방지능력을 향상시키고자 하였다. Cu(Mg) 박막은 대기노출시킨 TiN박막위에 증착되었으며 열처리시 Cu 박막내의 Mg은 TiN의 표면에 있는 산소와 반응하여 매우 얇은(~100 $\AA$) MgO를 형성하게되고 MgO에 의해 TiN의 확산방지능력은 Cu(4.5 at.%Mg)의 경우 $800^{\circ}C$까지 향상됨을 알 수 있었다. 그러나 Cu(Mg) a]toy는 TiN위에서 접착특성이 좋지 않기 때문에 TiN을 $O_2$plasma 처리하였으며 $O_2$ plasma 처리후 $300^{\circ}C$ 진공열처리를 통해 접착력이 크게 향상되는 것을 알 수 있었다. 이는 $O_2$ plasma 처리에 의해 TiN표면에 Mg과 반응할 수 있는 산소의 양이 증가하는 데 기인하며 이에 따라 Mg의 계면이동이 크게 증가되어 치밀한 MgO가 형성됨을 확인하였다. 그리고 $O_2$ plasma 처리시 RF power를 증가시키면 계면으로 이동하는 Mg의 양이 오히려 감소하였고 이것은 TiN의 표면이 $TiO_2$로 변하여 Mg과 결합할 수 있는 산소의 양이 상대적으로 감소하였기 때문인 것으로 생각된다. 또한 접착층으로서 Si을 50$\AA$ 증착하여 접착력을 크게 향상시켰으며 Si 증착에 의한 TiN의 확산방지능력은 감소되지 않는 것을 알 수 있었다.

• 상하수도학회지
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• 제34권1호
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• pp.75-83
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• 2020

This study investigated the degradation characteristics and biodegradability of phenol, refractory organic matters, by injecting MgO and CaO-known to be catalyst materials for the ozonation process-into a Dielectric Barrier Discharge (DBD) plasma. MgO and CaO were injected at 0, 0.5, 1.0, and 2 g/L, and the pH was not adjusted separately to examine the optimal injection amounts of MgO and CaO. When MgO and CaO were injected, the phenol decomposition rate was increased, and the reaction time was found to decrease by 2.1 to 2.6 times. In addition, during CaO injection, intermediate products combined with Ca²⁺ to cause precipitation, which increased the COD (chemical oxygen demand) removal rate by approximately 2.4 times. The biodegradability of plasma treated water increased with increase in the phenol decomposition rate and increased as the amount of the generated intermediate products increased. The biodegradability was the highest in the plasma reaction with MgO injection as compared to when the DBD plasma pH was adjusted. Thus, it was found that a DBD plasma can degrade non-biodegradable phenols and increase biodegradability.

• 한국자기학회지
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• 제22권5호
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• pp.162-166
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• 2012

Fe(100)/MgO(100)/CuPc/Co 자성터널접합 소자의 온도에 따른 전압-전류 특성 변화를 관찰하였다. 화학적 열적 안정성이 비교적 우수한 Cu-Phthalocyanine(CuPc)의 유기박막을 에피성장된 2 nm MgO(100) 박막 위에 2~10 nm 두께로 적층하여 두 강자성 Fe(100)와 Co 전극 사이의 무기-유기 복합 절연격벽으로 이용하였다. 저온 77 K에서 측정된 거대자기저항현상은 CuPc의 두께가 증가함에 따라 급격히 감소하여 10 nm의 CuPc 두께의 경우 전하축적에 의한 쌍안정 스위칭 거동(bistable switching behavior)이 관찰되었다. 이 스위칭 거동은 약 240 K의 온도에 이르면서 점차 소멸되어 상온에서는 정류기와 유사한 비대칭적 전압-전류 특성을 보였다. 이 연구에서 우리는 MgO/CuPc 층상구조에대해 유기물 스핀소자의 절연격벽뿐만 아니라 Polymer Random Access Memory(PoRAM)를 위한 응용 가능성에 대해 논하였다.

• Korean Chemical Engineering Research
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• 제56권1호
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• pp.125-132
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• 2018

유전체 장벽 방전 반응기에서 규칙적인 메조기공 갖는 촉매를 사용하여 플라즈마 에너지를 이용한 메탄의 직접전환반응 연구를 수행하였다. 촉매는 MgO/OMA (ordered mesoporous alumina), $MgO/{\gamma}-Al_2O_3$와 $MgO/{\alpha}-Al_2O_3$를 사용하여 반응하였다. Pulse 고전압을 이용한 플라즈마 반응기에서 촉매 MgO/OMA를 사용하였을 때 $C_2$ 화합물의 선택도는 67%로 최고의 성능을 나타내었다. 금속산화물 종류, 규칙적인 메조기공 구조, 알루미나의 상변화 그리고 전원공급방식에 따른 효과를 고려하여 반응기 성능 및 생성물 분포를 비교하였다. BET (Brunauer, Emmett, Teller), X 선 회절, 주사전자현미경, 열 무게 분석으로 촉매의 반응 전후의 특성을 분석하였다.