• 제목/요약/키워드: Metalorganic chemical vapor deposition

검색결과 134건 처리시간 0.035초

Precursor alternating metalorganic chemical vapor deposition에 의한 (100) GaAs 기판위로의 InGaAs 성장시의 높은 indium 유입 (High indium incorporation in the growth of InGaAs on (100) GaAs by precursor alternating metalorganic chemical vapor deposition)

  • 정동근
    • 한국진공학회지
    • /
    • 제5권4호
    • /
    • pp.354-358
    • /
    • 1996
  • precuror alternating metalorganic chemical vapor deposition(PAMOCVD)에 의한 InGaAs의 성장시에 높은 indium의 유입이 관찰되었다. gallium과 indium의 전구물질의 분해의 차이 그리고 이에따른 분해된 전구물질 분자의 흡착행동의 차이를 고려함으로써 PAMOCVD 성장시의 결정내로의 높은 indium유입의 mechanism을 제안하였다.

  • PDF

Al 박막의 underlayer로서의 Ionized Physical Vapor Deposition (I-PVD) Ti 또는 I-PVD Ti/Metal-Organic Chemical Vapor Deposition TiN (Ti Prepared by ionized physical vapor deposition (I-PVD) and TiN prepared by metal-organic chemical vapor deposition(MOCVD) as underlayers of aluminum TiN)

  • 이원준;나사균
    • 한국진공학회지
    • /
    • 제9권4호
    • /
    • pp.394-399
    • /
    • 2000
  • Underlayer의 종류 및 두께가 Al 박막의 texture 및 면저항 변화에 미치는 영향을 연구하였다. Al의 underlayer로는 ionized physical vapor deposition(I-PVD)에 의해 제조된 Ti와 I-PVD Ti 위에 metalorganic chemical vapor deposition(MOCVD)에 의해 제조된 TiN을 적층한 구조가 사용되었으며, 각각에 대해 두께를 변화시키면서 Al 박막의 배향성, 면저항을 조사하고, $400^{\circ}C$, $N_2$분리기에서 열처리하면서 면저항의 변화를 조사하였다. I-PVD Ti만을 Al의 underlayer로 사용한 경우, Ti두께가 5 nm이어도 Al 박막이 우수한 <111> 배향성을 나타내었으나, Al-Ti반응 때문에 열처리 후 Al 배선의 면저항이 크게 상승하였다. I-PVD 와 Al 사이에 MOCVD TiN을 적용함에 의해 Al <111> 배향성의 큰 저하없이 Al-Ti 반응에 의한 면저항의 증가를 억제할 수 있었으며, MOCVD TiN의 두께가 4 nm 이하일 때 특히 우수한 Al <111> 배향성을 나타내었다.

  • PDF

Characterization of SrRuO3 Conducting Thin Films Grown on p-Si (100) Substrates by Metalorganic Chemical Vapor Deposition

  • Cuong Nguyen Duy;Yoon, Soon-Gil
    • Transactions on Electrical and Electronic Materials
    • /
    • 제6권1호
    • /
    • pp.14-17
    • /
    • 2005
  • The SrRuO_{3}$ films for application of the bottom electrode were deposited on p-Si (001) substrates by metalorganic chemical vapor deposition (MOCVD). The films are characterized by various deposition parameters. The optimum deposition condition for SRO films is the deposition temperature of $500{\circ}C$, Sr/Ru input mol ratio of 1.0, and a flow rate of precursors of 15 ml/h. The films deposited by an optimum condition exhibited a single phase of SrRuO_{3}$, an rms roughness of 8 nm, and a resistivity of approximately $900{\mu}{\Omega}{\cdot}cm$. The high resistivity of the films for application of a bottom electrode should be improved through a characterization of an interface.

수평형 MOCVD 반응기 내의 InP 필름성장 제어인자에 대한 영향 평가 (Onset on the Rate Limiting Factors of InP Film Deposition in Horizontal MOCVD Reactor)

  • 임익태
    • 대한기계학회:학술대회논문집
    • /
    • 대한기계학회 2003년도 추계학술대회
    • /
    • pp.73-78
    • /
    • 2003
  • The InP thin films grown by metalorganic chemical vapor deposition (MOCVD) are widely used to optoelectronic devices such as laser diodes, wave-guides and optical modulators. Effects of various parameters controlling film growth rate such as gas-phase reaction rate constant, surface reaction rate constant and mass diffusivity are numerically investigated. Results show that at the upstream region where film growth rate increases with the flow direction, diffusion including thermal diffusion plays an important role. At the downstream region where the growth rate decreases with flow direction, film deposition mechanism is revealed as a mass-transport limited. Mass transport characteristics are also studied using systematic analyses.

  • PDF

Metalorganic Chemical Vapor Deposition of $Ga_2O_3$ Thin Films Using Dimethylgallium Isopropoxide and $O_2$

  • 우정준;박영수;이희주;전두진;김건희;김윤수
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
    • /
    • pp.195-195
    • /
    • 2010
  • $Ga_2O_3$ thin films have been grown on Si(001) substrates by metalorganic chemical vapor deposition (MOCVD) using dimethylgallium isopropoxide ($Me_2GaO^iPr$, DMGIP) with oxygen as the reactant gas. Suitability of the precursor for CVD was confirmed by thermogravimetric analysis (TGA) and vapor pressure measurement. Deposition was carried out in the substrate temperature range $450-650^{\circ}C$. Spectroscopic ellipsometry, X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS) and Rutherford back-scattering spectroscopy (RBS) were used to determine the thickness, crystallinity, and composition and stoichiometry of the films, respectively. From the slope of the Arrhenius plot in the temperature range $500-550^{\circ}C$, the activation energy of deposition was found to be $225.5\;kJ\;mol^{-1}$. As-deposited films were amorphous, but the monoclinic $\beta-Ga_2O_3$ phase was revealed after annealing the films in air at $1050^{\circ}C$. The XPS and RBS analyses indicate that the $Ga_2O_3$ films obtained by using DMGIP were found to be almost stoichiometric.

  • PDF

2단계 MOCVD법에 의해 사파이어 기판 위 성장된 undoped GaN 에피박막의 특성에 미치는 고온성장 온도변화의 영향 (Effects of epilayer growth temperature on properties of undoped GaN epilayer on sapphire substrate by two-step MOCVD)

  • 장경화;권명석;조성일
    • 한국진공학회지
    • /
    • 제14권4호
    • /
    • pp.222-228
    • /
    • 2005
  • 2단계 성장법으로 c-plane 사파이어 단결정 기판 위에 metalorganic chemical vapor deposition(MOCVD)법으로 undoped GaN 에피층을 성장시켰다. 고온 성장시 성장 온도 변화가 undoped GaN 에피층의 표면형상과 거칠기, 구조적 결정성, 광학적 성질, 전기적 성질에 미치는 영향을 연구하였다. 수평형 MOCVD 장치를 이용해 압력 300 Torr 저압에서 성장시켰으며, 저온 핵생성층 성장조건은 $500^{\circ}C$로 고정시키고, 2단계 성장 온도를 $850\~1050^{\circ}C$범위로 변화시켰다. 형성된 undoped GaN 에피층을 원자력현미경, 고분해능 X-선회절장치, 광발광측정, 홀 효과 측정 장치 등을 이용하여 분석, 고찰하였다.

양축 정렬된 Ni기판 위에 MOCVD법에 의한 YBCO 초전도 선재용 $CeO_2$ 완충층의 증착 (Deposition of $CeO_2$ buffer layer for YBCO coated conductors on biaxially textured Ni substrate by MOCVD technique)

  • 김호진;주진호;전병혁;정충환;박순동;박해웅;홍계원;김찬중
    • 한국초전도ㆍ저온공학회논문지
    • /
    • 제4권2호
    • /
    • pp.21-26
    • /
    • 2002
  • Textured CeO2 buffer layers for YBCO coated conductors were deposited on biaxially textured Ni substrate by metalorganic chemical vapor deposition (MOCVD). The degree of texture of deposited $CeO_2$ films was strong1y dependent on the deposition temperature (Td) and oxygen Partial Pressure(PO2). ($\ell$00) textured $CeO_2$ films were well deposited at T=500~52$0^{\circ}C$. PO2=0.90~3.33 Torr. The surface morphology showed that the films consisted of columnar CeO2 films grown from the Ni substrates. The root mean square roughness of CeO$_2$ films estimated by atomic force microscopy(AFM) increased as the deposition temperature(Td) increa- sed. The growth rate of the $CeO_2$ films deposited at T=52$0^{\circ}C$ and PO2=2.30 Torr was 150~200 nm/min that was much faster than that of other Physical deposition methods.

Dielectric properties of Pr$_2$O$_3$ high-k films grown by metalorganic chemical vapor deposition on silicon

  • Nigro, Raffaella-Lo;Vito Raineri;Corrado Bongiomo
    • E2M - 전기 전자와 첨단 소재
    • /
    • 제16권9호
    • /
    • pp.65.2-65
    • /
    • 2003
  • Praseodymium oxid ($Pr_2$$O_3$) thin films have been deposited on Si(100) substrates by metalorganic chemical vapor deposition using praseodymium tris-2,2,6,6-tetramethyl-3,5-heptandionate as source material. Film structural, morphological, and compositional characterizations have been carried out. Dielectric properties have been studied as well by capacitance-voltage and current-voltage measurements on metal-oxide-semiconductor capacitors of several areas. The $Pr_2$$O_3$ films have shown a dielectric constant = 23-25 and a leakage current density of $8.8{\times}10$-e $A/\textrm{mm}^2$ at +1 V.

  • PDF