• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.308-312
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• 2003

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics ($Al_2O_3-SiO_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a $Cu/Al_2O_3-SiO_2$ ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• Journal of the Korean Ceramic Society
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• v.20 no.1
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• pp.70-78
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• 1983

This paper discusses the application of Si-Borosilicate glass sealing to a new sealing method which utilizes a large electrostatic field to pormote bound formation at relatively low temperature. Bonding mechanism and the effect of bonding time bonding temperature glass thickness and surface roughness on the bond strength were investigated. Application of a de voltage across bonded specimen gradually produced a layer of glass adjacent silicon which was depleted of mobile ions. As a consequence a n increasingly larger fraction of the applied voltage appeared across the depleted region and very large electric field resulted This field accompanyed by large electrostatic force acted as driving force the of strong bond. And stronger bond was formed with increasing bonding time and temperature. A low temperature preoxidation is advantageous for the Si surface having a rougher surface finish that 1 microinch.

• The Journal of Korean Academy of Prosthodontics
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• v.47 no.3
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• pp.312-319
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• 2009

Statement of problem: Delamination of veneering porcelain from underlying ceramic substructures has been reported for zirconia-ceramic restorations. Colored zirconia cores for esthetics have been reported that their bond strength with veneered porcelain is weaker compared to white zirconia cores. Purpose: This study aimed to investigate the shear bond strength by manufacturing the veneering porcelain on the colored zirconia core, using the layering technique and heat-pressing technique, and to evaluate the clinical stability by comparing the result of this with that of conventional metal ceramic system. Material and methods: A Metal ceramic (MC) system was tested as a control group. The tested systems were Katana zirconia with CZR (ZB) and Katana Zirconia with NobelRondo Press (ZP). Thirty specimens, 10 for each system and control, were fabricated. Specimen disks, 3 mm high and 12 mm diameter, were fabricated with the lost-wax technique (MC) and the CAD-CAM (ZB and ZP). MC and ZB specimens were prepared using opaque and dentin veneering ceramics, veneered, 3 mm high and 2.8 mm in diameter, over the cores. ZP specimens were prepared using heat pressing ingots, 3 mm high and 2.8mm in diameter. The shear bond strength test was performed in a Shear bond test machine. Load was applied at a cross-head speed of 0.50 mm/min until failure. Mean shear bond strengths (MPa) were analyzed with the One-way ANOVA. After the shear bond test, fracture surfaces were examined by SEM. Results: The mean shear bond strengths (SD) in MPa were MC control 29.14 (2.26); ZB 29.48 (2.30); and ZP 29.51 (2.32). The shear bond strengths of the tested systems were not significantly different (P > .05). All groups presented cohesive and adhesive failures, and showed predominance of cohesive failures in ceramic veneers. Conclusion: 1. The shear bond strengths of the tested groups were not significantly different from the control group (P >.05). 2. There was no significant different between the layering technique and the heat pressing technique in the veneering methods on the colored zirconia core. 3. All groups presented cohesive and adhesive failures, and showed predominance of cohesive failures in ceramic veneers.

• The Journal of the Korea Contents Association
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• v.10 no.11
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• pp.228-234
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• 2010

Ni-Cr and Co-Cr alloy uncontained Be element for using as dental porcelain alloy were analyzed the mechanical properties through bonding strength and fracture test after the bonding with porcelain. The bonding strengths between alloy and ceramic were measured through the shear bond strength test. Consequently, the T-3 group contained Be element that had shear strength of 41.13(${\pm}5.11$)MPa was showed the highest shear strength than the other groups. The second highest group was a verabond contained Be element that had shear strength of 40.72(${\pm}5.98$)MPa. The results of the other groups according to the shear strength were Wirobond(38.40(${\pm}9.66$)MPa) belonged to Co-Cr alloy, and Verabond 2V(32.77(${\pm}4.31$)MPa), Bellabond N(28.63(${\pm}6.39$)MPa), Bellabond plus(24.97(${\pm}6.13$)MPa), Argeloy N.P. Star(22.69(${\pm}3.41$)MPa) uncontained Be element, respectively. The morphological aspects of the fracture surface between alloys and ceramic were observed that all groups were caused mixed failure as conformation attached ceramic fragments to metallic surface by fracture process.

• The Journal of Korean Academy of Prosthodontics
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• v.19 no.1
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• pp.61-73
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• 1981

The effects of the opaque porcelain firing temperature, the bonding agent and the degassing prior to the opaque firing On the bond strength were investigated by means of the tensile shear stIe$. The diffusional behaviours at the interface of the porcelain and the alloy, and .the microstructures of the ceramic and metal composite were studied for understanding the bonding mechanism. The results obtained in this experiment were summarizd as follow; 1. With no application of bonding agent, the tensile shear strength of the specimen firing at $1840^{\circ}F$ was higher than that of the specimen firing at $1760^{\circ}F$. 2. The highest bond strength was obtained by application of bonding agent without degassing prior to the opaque firing. 3. Application of bonding agent after the degassing showed the lowest bond strength. 4. The greater number of pores were observed at the firing temperature of $1840^{\circ}F$ than that of $1760^{\circ}F$ in the porcelain and the interface respectively.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05a
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• pp.70-73
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• 2004

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• The Journal of Korean Academy of Prosthodontics
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• v.35 no.1
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• pp.144-164
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• 1997

The purpose of this study were to investigate the chemical composition, mean particle size, linear thermal expansion coefficient and metal-bonding strength of the regular opaque powder and core powder. In this study, 4 types of ceramic powders, namely Duceram Jacket Opaque powder, Duceram Opaque powder, Vita Hi-Ceram powder, Vita VMK Paint On-88 powder were used. Chemical composition was evaluated by EDS(Energy Dispersive X-ray Spectrophotometer, Oxford QX-2000, England), particle size was measured by MALVERN Instruments(MALVERN Instruments SB. OC., U.S.A.. ad linear thermal expansion coefficient was measured by dilatometer(Motoyama, Japan). Bond strength was measured by the Universal tsting machine(Istron Co., Ltd., U.S.A.). The Results were as follows : 1. Through recognition of the relative difference in chemical composition between the core powder and the regular opaque powder, the difference in the proportion of $Al_2O_3$ in each type of material is demonstrated ; Duceram Jaket Opaque powder : 30.16%, Duceram Opaque powder : 16.60%, Vita Hi-Ceram : 63.64%, Vita VMK Paint-On 88 : 16.16%. 2. There was no significant difference in the proportion of metal-bonding materials between the core powder and the regular opaque powder. 3. In the regular opaque powder, alkaline materials were incoporated in order to increase the coefficient of thermal expansion. 4. In the particle size analysis, there was no significant difference in mean particle size or in the particle size distribution between the core powder and the regular opaque powder. 5. In the thermal expansion test for temperature range of $25-600^{\circ}C$, the regular opaque powder had higher coefficient of thermal expansion than that of core powder. 6. In the 4 point flexural bending test, there was no statistically significant difference in the mean bond strength between the core powder and the opaque powder among the Duceram products.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.4
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• pp.2585-2592
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• 2015

The purpose of this study was to evaluate the shear bond strength between metal core fabricated by 3D printing and dental porcelain. Thirty metal cores were fabricated(cast 15ea, 3D printing 15ea). The porcelain for each group was builded to the metal core. Sample was loaded to shear force(crosshead speed 1mm/min) in a universal material testing machine. The fracture samples were analyzed failure aspect. The means were statistical analyzed using by Mann-whitney test(${\alpha}=0.05$). The period of experimental(metal cores fabrication, dental porcelain build up, data analysis, statistical analysis, failure aspect analysis and others) for this study took six months. The $mean{\pm}SDs$ of shear bond strength was $50.14{\pm}1.60MPa$ for the cast group, and $54.36{\pm}3.18MPa$ for the 3D printing group(p=0.035). The failure aspect showed mixed failure. As a results, metal cores fabricated by 3D printing method were clinically acceptable range.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.134-146
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• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

• The Journal of Korean Academy of Prosthodontics
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• v.49 no.3
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• pp.191-196
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• 2011

Purpose: In this study, we evaluated the bond-strength between a few metal ceramic-alloys and veneered-porcelain and found if the bond strength of metal-ceramic alloy with lower gold content than the presently used gold alloy was high enough. Materials and methods: For this study, after plasticizing porcelain only for gold alloy, metal specimen was fabricated using Ni-Cr alloy and gold alloy with different gold content. Three point flexural test were performed to measure their bond-strength. Results: The bonding strength of Group 1 to porcelain was $40.62{\pm}3.32$ MPa, which was the highest (P<.05). In sequence of decreasing value, Group 2 (75%) was $37.47{\pm}1.57$ MPa, Group 3 (52%) $35.85{\pm}1.48$ MPa, Group 4 (51.5%) $35.04{\pm}1.34$ MPa, Group 5 (32%) $33.17{\pm}1.62$ MPa, Group 6 (10%) $30.75{\pm}1.21$ MPa. Bonding strength of Group 3 and Group 4 to porcelain did not show statistically significant difference with comparison to that of Group 5 (Duncan's test, P>.05), while there was a significant difference between that of Group 2, Group 3 and Group 4 and that of Group 6 (Duncan's test, P<.05). The bonding strength between gold alloy and porcelain increased according to the content of gold. In all experimental groups showed higher value than 25 MPa, which is the least value recommended by ISO 9693. Conclusion: In all groups, bonding strength was higher than 25 MPa, which is the least value of ISO9693. Therefore, it is considered that metal gold alloy with low gold content is clinically usable.