• Title/Summary/Keyword: Metal thin film

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Irradiation enduced In-plane magnetization in Fe/MgO/Fe/Co multilayers

  • Singh, Jitendra Pal;Lim, Weon Cheol;Song, Jonghan;Kim, Jaeyeoul;Asokan, K.;Chae, Keun Hwa
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.188.1-188.1
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    • 2015
  • For present investigation Fe/MgO/Fe/Co multilayer stack is grown on Si substrate using e-beam evaporation in ultrahigh vacuum. This stack is irradiated perpendicularly by 120 MeV $Ag^{8+}$ at different fluences ranging from $1{\times}10^{11}$ to $1{\times}10^{13}ions/cm^2$ in high vacuum using 15UD Pelletron Accelerator at Inter University Accelerator Centre, New Delhi. Magnetic measurements carried out on pre and post irradiated stacks show significant changes in the shape of perpendicular hysteresis which is relevant with previous observation of re-orientation of magnetic moment along the direction of ion trajectory. However increase in plane squareness may be due to the modification of interface structure of stacks. X-ray reflectivity measurements show onset of interface roughness and interface mixing. X-ray diffraction measurements carried out using synchrotron radiation shows amorphous nature of MgO and Co layer in the stack. Peak corresponding body centered Fe [JCPDS-06-0696] is observed in X-ray diffraction pattern of pre and post irradiated stacks. Peak broadening shows granular nature of Fe layer. Estimated crystallite size is $22{\pm}1nm$ for pre-irradiated stack. Crystallite size first increases with irradiation then decreases. Structural quality of these stacks was further studied using transmission electron microscopic measurements. Thickness from these measurements are 54, 36, 23, 58 and 3 nm respectively for MgO, Fe, MgO, Fe+Co and Au layers in the stack. These measurements envisage poor crystallinity of different layers. Interfaces are not clear which indicate mixing at interface. With increase fluence mixing and diffusion was increased in the stack. X-ray absorption spectroscopic measurements carried out on these stacks show changes of Fe valence state after irradiation along with change of O(2p)-metal (3d) hybridized state. Valence state change predicts oxide formation at interface which causes enhanced in-plane magnetization.

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Nanophase Catalyst Layer for Direct Methanol Fuel Cells

  • Chang Hyuk;Kim Jirae
    • Journal of the Korean Electrochemical Society
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    • v.4 no.4
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    • pp.172-175
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    • 2001
  • Nanophase catalyst layer for direct methanol fuel cell has been fabricated by magnetron sputtering method. Catalyst metal targets and carbon were sputtered simultaneously on the Nafion membrane surface at abnormally higher gas (Ar/He mixture) pressure than that of normal thin film processing. They could be coated as a novel structure of catalyst layer containing porous PtRu or Pt and carbon particles both in nanometer range. Membrane electrode assembly made with this layer led to a reduction of the catalyst loading. At the catalyst loading of 1.5mg $PtRu/cm^2$ for anode and 1mg $Pt/cm^2$ for cathode, it could provide $45 mW/cm^2$ in the operation at 2 M methanol, 1 Bar Air at 80"C. It is more than $30\%$ increase of the power density performance at the same level of catalyst loading by conventional method. This was realized due to the ultra fine particle sizes and a large fraction of the atoms lie on the grain boundaries of nanophase catalyst layer and they played an important role of fast catalyst reaction kinetics and more efficient fuel path. Commercialization of direct methanol fuel cell for portable electronic devices is anticipated by the further development of such design.

Characteristics of Transparent Conductive Tin Oxide Thin Films on PET Substrate Prepared by ECR-MOCVD (PET 기판상에 ECR 화학증착법에 의해 제조된 SnO2 투명도전막의 특성)

  • Kim, Yun Seok;Jeon, Bup Ju;Ju, Jeh Beck;Sohn, Tae Won;Lee, Joong Kee
    • Korean Chemical Engineering Research
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    • v.43 no.1
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    • pp.85-91
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    • 2005
  • $SnO_2$ films were prepared at room temperature under a $(CH_3)_4Sn-H_2-O_2$ atmosphere in order to obtain transparent conductive polymer by using ECR-MOCVD (Electron Cyclotron resonance -Metal Organic Chemical Vapor Deposition) system. The electrical properties of the films were investigated as function of process parameters such as deposition time, microwave power, magnetic current power, magnet/showering/substrate distance and working pressure. An increase in microwave power and magnetic current power brought on $SnO_2$ film formation with low electric resistivity. On the other hand, the effects of process parameters described above on optical properties were insignificant in the range of our experimental scope. The transmittance and reflectance of the films prepared by the ECR-MOCVD exhibited their average values of 93-98% at wave length range of 380-780 nm and 0.1-0.5%, respectively. The grain size of the $SnO_2$ films that are also insensitive with the process parameters were in the range of 20-50 nm. On the basis of experimental data obtained in the present study, electrical resistivity of $7.5{\times}10^{-3}ohm{\cdot}cm$, transmittance of 93%, and reflectance of 0.2% can be taken as optimum values.

Improvement of Conductive Micro-pattern Fabrication using a LIFT Process (레이저 직접묘화법을 이용한 미세패턴 전도성 향상에 관한 연구)

  • Lee, Bong-Gu
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.5
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    • pp.475-480
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    • 2017
  • In this paper, the conductivity of the fine pattern is improved in the insulating substrate by laser-induced forward transfer (LIFT) process. The high laser beam energy generated in conventional laser induced deposition processes induces problems such as low deposition density and oxidation of micro-patterns. These problems were improved by using a polymer coating layer for improved deposition accuracy and conductivity. Chromium and copper were used to deposit micro-patterns on silicon wafers. A multi-pulse laser beam was irradiated on a metal thin film to form a seed layer on an insulating substrate(SiO2) and electroless plating was applied on the seed layer to form a micro-pattern and structure. Irradiating the laser beam with multiple scanning method revealed that the energy of the laser beam improved the deposition density and the surface quality of the deposition layer and that the electric conductivity can be used as the microelectrode pattern. Measuring the resistivity after depositing the microelectrode by using the laser direct drawing method and electroless plating indicated that the resistivity of the microelectrode pattern was $6.4{\Omega}$, the resistance after plating was $2.6{\Omega}$, and the surface texture of the microelectrode pattern was uniformly deposited. Because the surface texture was uniform and densely deposited, the electrical conductivity was improved about three fold.

Microstructure and Magnetic Properties of Zn1-xCoxO Film Prepared by Pulsed DC Magnetron Sputtering (펄스 DC 마그네트론 스퍼터링법에 의한 Zn1-xCoxO 박막의 미세조직 및 자기적 특성)

  • Ko, Yoon-Duk;Ko, Seok-Bae;Choi, Moon-Soon;Tai, Weon-Pil;Kim, Ki-Chul;Kim, Jong-Min;Soh, Su-Jeung;Kim, Young-Sung
    • Journal of the Korean Ceramic Society
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    • v.42 no.3 s.274
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    • pp.211-217
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    • 2005
  • [ $Zn_{1-x}Co_{x}O$ (x=0-0.3) films were grown on Corning 7059 glasses by asymmetrical bipolar pulsed dc magnetron sputtering. The c-axis orientation along (002) plane was enhanced with increasing Co concentration. The $Zn_{1-x}Co_{x}O$ films are grown with fibrous grains of tight dome shape. The transmittance spectra measured from UV-visible showed that sp-d exchange interactions and typical d-d transitions become activated with increasing Co concentration. The electrical resistivity of $Zn_{1-x}Co_{x}O$ films increased with increasing Co concentration, especially it increased greatly at $30at\% Co. X-ray photoelectron spectroscopy and alternating gradient magnetometer analyses indicated that no Co metal cluster is formed and the ferromagnetic properties are exhibited. The low electrical resistivity and room temperature ferromagnetism of $Zn_{1-x}Co_{x}O$ thin films suggested the possibility of the application to Diluted Magnetic Semiconductors (DMSs).

A Study on the Self-annealing Characteristics of Electroplated Copper Thin Film for DRAM Integrated Process (DRAM 집적공정 응용을 위한 전기도금법 증착 구리 박막의 자기 열처리 특성 연구)

  • Choi, Deuk-Sung;Jeong, Seung-Hyun
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.3
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    • pp.61-66
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    • 2018
  • This research scrutinizes the self-annealing characteristics of copper used to metal interconnection for application of DRAM fabrication process. As the time goes after the copper deposited, the grain of copper is growing. It is called self-annealing. We use the electroplating method for copper deposition and estimate two kinds of electroplating chemicals having different organic additives. As the time of self-annealing is elapsed, sheet resistance decreases with logarithmic dependence of time and is finally saturated. The improvement of sheet resistance is approximately 20%. The saturation time of experimental sample is shorter than that of reference sample. We can find that self-annealing is highly efficient in grain growth of copper through the measurement of TEM analysis. The structure of copper grain is similar to the bamboo type useful for current flow. The results of thermal excursion characteristics show that the reliability of self-annealed sample is better than that of sample annealed at higher temperature. The self-annealed sample is not contained in hillock. The self-annealed samples grow until $2{\mu}m$ and develop in [100] direction more favorable for reliability.

Electrically Controllable Asymmetric Split-Loop Terahertz Resonator with Outer Square Loop (전기적 제어 가능한 외곽 사각 고리 추가형 테라헤르츠 비대칭 분리고리공진기)

  • Park, Dae-Jun;Ryu, Han-Cheol
    • Korean Journal of Optics and Photonics
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    • v.28 no.2
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    • pp.59-67
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    • 2017
  • This paper proposes an asymmetric split-loop resonator with an outer square loop (ASLR-OSL), which can actively control terahertz wave transmission properties while maintaining a high-Q-factor of the asymmetric split-loop resonator (ASLR). An added outer square loop is designed to play the roles of both a metamaterial and a micro-heater, which can control the temperature through a directly applied bias voltage. A vanadium dioxide ($VO_2$) thin film, which exhibits an insulator-metal phase transition with temperature change, is used to control the transmission properties. The proposed ASLR-OSL shows transmission properties similar to those of the ASLR, and they can be successfully controlled by directly applying bias voltage to the outer square loop. Based on these results, an electrically controllable terahertz high-Q metamaterial could be achieved simply by adding a square loop to the outside of a well-known high-Q metamaterial.

A Study of Photoelectrolysis of Water by Use of Titanium Oxide Films (산화티타늄 피막의 광 전기분해 특성에 관한 연구)

  • Park, Seong-Young;Cho, Byung-Won;Ju, Jeh-Beck;Yun, Kyung-Suk;Lee, Eung-Cho
    • Applied Chemistry for Engineering
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    • v.3 no.1
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    • pp.88-99
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    • 1992
  • For the development of semiconducting photoelectrode to be more stable and efficient in the process of photoelectrolysis of the water, pure titanium rods were oxidized by anodic oxidation, furance oxidation and flame oxidation and used as electrodes. The Indium islands were formed by electrodeposition of "In" thin film on $TiO_2$ and Ti by electrodeposition. Also $A1_2O_3$ and NiO islands were coated on Ti by the electron-beam evaporation technique. The maximum photoelectrochemical conversion efficiency(${\eta}$) was 0.98% for flame oxidized electrode($1200^{\circ}C$ for 2min in air). Anodically oxidized electrodes have photoelectrochemical conversion efficiency of 0.14%. Furnace oxidized electrode($800^{\circ}C$ for 10min in air) has 0.57% of photoelectrochemical efficiency and shows a band-gap energy of about 2.9eV. The $In_2O_3$ coated $TiO_2$ exhibits 0.8% of photoelectrochemical efficiency but much higher value of ${\eta}$ was obtained with the Increase of applied blas voltage. However, $Al_2O_3$ or NiO coated $TiO_2$ shows much low value of ${\eta}$. The efficiency was dependent on the presence of the metallic interstitial compound $TiO_{0+x}$(x<0.33) at the metal-semiconductor interface and the thickness of the suboxide layer and the external rutile scale.

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The Fabrication of OTFT-OLED Array Using Ag-paste for Source and Drain Electrode (Ag 페이스트를 소스와 드레인 전극으로 사용한 OTFT-OLED 어레이 제작)

  • Ryu, Gi-Seong;Kim, Young-Bae;Song, Chung-Kun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.5
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    • pp.12-18
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    • 2008
  • Ag paste was employed for source and drain electrode of OTFTs and for the data metal lines of OTFT-OLED array on PC(polycarbonate) substrate. We tested two kinds of Ag-pastes such as pastes for 325 mesh and 500 mesh screen mask to examine the pattern ability and electrical performance for OTFTs. The minimum feature size was 60 ${\mu}m$ for 325 mesh screen mask and 40 ${\mu}m$ for 500 mesh screen mask. The conductivity was 60 $m{\Omega}/\square$ for 325 mesh and 133.1 $m{\Omega}/\square$ for 500 mesh. For the OTFT performance the mobility was 0.35 $cm^2/V{\cdot}sec$ and 0.12 $cm^2/V{\cdot}sec$, threshold voltage was -4.7 V and 0.9 V, respectively, and on/off current ratio was ${\sim}10^5$, for both screen masks. We applied the 500 mash Ag paste to OTFT-OLED array because of its good patterning property. The pixel was composed of two OTFTs and one capacitor and one OLED in the area of $2mm{\times}2mm$. The panel successfully worked in active mode operation even though there were a few bad pixels.

Electrical Characteristics of PECVD $Ta_2O_5$ Dielectic Thin Films on HSG and Rugged Polysilicon Electrodes (입체표면 폴리실리콘 전극에서 PECVD $Ta_2O_5$ 유전박막의 전기적 특성)

  • Cho, Yong-Beom;Lee, Kyung-Woo;Chun, Hui-Gon;Cho, Tong-Yul;Kim, Sun-Oo;Kim, Hyeong-Joon;Koo, Kyung-Wan;Kim, Dong-Won
    • Journal of the Korean Vacuum Society
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    • v.2 no.2
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    • pp.246-254
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    • 1993
  • In order to increase the capacitance of storage electrode in the DRAM capacitor, two approaches were performed. First, hemispherical and rugged poly silicon films were made by LPCVD to increase the effective surface area of storage electrode. The even surface morphology of conventional poly silicon electrode was changed into the uneven surface of hemispherical of rugged poly silicon films. Second, PECVD $Ta_2O_5$ dielectric films were deposited and thermally treated to study the dielectrical characteristics of $Ta_2O_5$ film on each electrode. MIS capacitors with $Ta_2O_5$ films were electrically characterized by I-V, C-V and TDDB measurements. As a result, the capacitance of the electrode with uneven surface were increased by a factor of 1.2~1.5 and leakage current was increased compared with those of even surface. TDDB result indicates that the electrode with uneven surface has dielectrically more degraded than that of even surface. These results can be helpful as a basic research to develop new generation DRAM capacitors with $Ta_2O_5$ films.

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