• 한국강구조학회 논문집
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• 제15권4호통권65호
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• pp.403-412
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• 2003

건축물의 바닥판에 대한 합성슬래브 시스템의 사용이 점차 확대되어 오피스 빌딩을 중심으로 널리 사용되고 있다. 최근에는 주상복합형 및 주거용 건물에 대한 확대 적용을 휘해 하부면이 평탄한 플랫 데크플레이트의 필요성이 대두됨에 따라 플랫 데크플레이트가 개발되고 있다. 또한 합성슬래브시스템의 바닥판 상부에 와이어메쉬 대신 일체형으로 생산되는 익스팬디드 메탈을 적용할 경우, 원가 절감, 공기 단축 효과도 기대할 수 있을 것이다. 본 연구에서는 익스팬디드 메탈을 와이어메쉬의 대체재로 사용하여 이를 하부면이 평탄한 플랫 데크플레이트와 결합시킨 신형식의 합성블래브시스템을 제안하였다. 총 12개의 시험체에 대한 실험을 통해 그 구조성능을 평가하고자 하였다. 실험 결과는 시험체의 최대내력과 파괴거동 등을 중심으로 요약하여 나타냈다.

• Steel and Composite Structures
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• 제35권4호
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• pp.475-494
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• 2020

Presented are experimental results from 24 full-scale push test specimens to study the behaviour of composite beams with trapezoidal profiled sheeting laid transverse to the beam axis. The tests use a single-sided horizontal push test setup and are divided into two series. First series contained shear loading only and the second had normal load besides shear load. Four parameters are studied: the effect of wire mesh position and number of its layers, placing a reinforcing bar at the bottom flange of the deck, normal load and its position, and shear stud layout. The results indicate that positioning mesh on top of the deck flange or 30 mm from top of the concrete slab does not affect the stud's strength and ductility. Thus, existing industry practice of locating the mesh at a nominal cover from top of the concrete slab and Eurocode 4 requirement of placing mesh 30 mm below the stud's head are both acceptable. Double mesh layer resulted in 17% increase in stud strength for push tests with single stud per rib. Placing a T16 bar at the bottom of the deck rib did not affect shear stud behaviour. The normal load resulted in 40% and 23% increase in stud strength for single and double studs per rib. Use of studs only in the middle three ribs out of five increased the strength by 23% compared to the layout with studs in first four ribs. Eurocode 4 and Johnson and Yuan equations predicted well the stud strength for single stud/rib tests without normal load, with estimations within 10% of the characteristic experimental load. These equations highly under-estimated the stud capacity, by about 40-50%, for tests with normal load. AISC 360-16 generally over-estimated the stud capacity, except for single stud/rib push tests with normal load. Nellinger equations precisely predicted the stud resistance for push tests with normal load, with ratio of experimental over predicted load as 0.99 and coefficient of variation of about 8%. But, Nellinger method over-estimated the stud capacity by about 20% in push tests with single studs without normal load.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.351.1-351.1
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• 2016

While conventional electronic devices have been fabricated on the rigid and brittle Si based wafer as a semiconducting substrate, future devices are increasingly finding applications where flexibility and stretchability are further integrated to enable emerging and wearable devices. To achieve high flexibility and stretchability, various approaches are investigated such as polymer based conducting composite, thin metal films on the polymer substrate, and structural modifications for stretchable electronics. In spite of many efforts, it is still a challenge to identify a solution that offers both high stretchability and superior electrical properties. In this paper, we introduce a highly stretchable entangled-mesh graphene showing a potential to address such requirements as stretchability and good electrical performance. Entangle-mesh graphene was synthesized by CVD graphene on the Cu foil. To analyze the mechanical properties of entangled-mesh graphene, endurance and stretching tester have been used.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집C
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• pp.492-497
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• 2001

In the finite element analysis of metal forming processes using general Lagrangian formulation, element nodes in the mesh move and elements are distorted as the material is deformed. The excessive degeneracy of mesh interrupts finite element analysis and thus increases the error of plastic deformation energy. In this study, a remeshing scheme using so-called mesh compression method is proposed to effectively analyze the flash which is generated usually in hot forging processes. In order to verify the effectiveness of the method, several examples are tested in two-dimensional and three-dimensional problems.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2009년도 추계학술대회 논문집
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• pp.251-254
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• 2009

A new type of dye-sensitized solar cells(DSCs) based on Ti-mesh electrode without using TCO layer is fabricated for high-efficient and low-cost solar cell application. The TCO-Iess DSCs sample is composed of a [glass/ dye sensitized $TiO_2$ layer/ Ti-mesh electrode/ electrolyte/ metal counter electrode]. The Ti-mesh electrode with high conductivity can collect electrons from the $TiO_2$ layer and allows the ionic diffusion of $I^-/I_3{^-}$ through the mesh hole. Thin Ti-mesh (${\sim}40{\mu}m$ in thickness) electrode material is processed using rapid prototype method. Electrical performance of as-fabricated DSCs is presented and discussed in detail.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1074_1075
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• 2009

A new type of dye-sensitized solar cells(DSCs) based on Ti-mesh electrode without using TCO layer is fabricated for high-efficient low-cost solar cell application. The TCO-less DSCs sample is composed of a [glass/ dye sensitized $TiO_2$ layer/ Ti-mesh electrode/ electrolyte/ metal counter electrode]. The Ti-mesh electrode with high conductivity can collect electrons from the $TiO_2$ layer and allows the ionic diffusion of $I^-/I_3^-$ through the mesh hole. Thin Ti-mesh ($\sim40{\mu}m$ in thickness) electrode material is processed using rapid prototype method. Electrical performance of as-fabricated DSCs is presented and discussed in detail.

• Current Photovoltaic Research
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• 제9권1호
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• pp.6-10
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• 2021

The mesh mask screen, which is generally used for screen printing metallization of silicon solar cell, requires high squeegee pressure and low printing speed. These requirements are acting as a limiting factor in production yield in photovoltaic industries. In order to improve the productivity, a metal mask, which has high durability and high printing speed, has been researched. In this paper, the characteristics of each solar cell, in which electrodes were formed by using a metal mask and a mesh mask, were analyzed through recombination current density. In particular, the metal-induced recombination current density (Jom) representing the recombination of the emitter-metal interface was calculated using the shading method, and the resulting efficiency and open-circuit voltage were analyzed through the diode equation. As a result of analyzing the proportion of the metal-induced recombination current density to the total emitter recombination current density, it was analyzed that the reduction of the metal-induced recombination current density through the metal mask is an important factor in reducing the total recombination current density of the solar cell.

• 구강회복응용과학지
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• 제28권4호
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• pp.327-337
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• 2012

본 연구에서는 광중합형 석영 섬유인Quarts Splint$^{TM}$ Mesh를 중심으로 다양한 강화재의 의치상 보강 효과에 대해 알아보고자 하였다. 의치상 레진으로 Lucitone199$^{(R)}$와 QC-20을 사용하였으며 강화재로 폴리에틸렌 섬유인 Ribbond$^{(R)}$, Quarts Splint$^{TM}$ Mesh, 금속 격자 강화재를 사용하였다. $2.0{\times}10.0{\times}65.0mm$ 시편을 각각 10개씩 제작하였으며 $2.5{\times}10.0{\times}65.0mm$, $3.0{\times}10.0{\times}65.0mm$ 시편도 제작하였다. Lucitone199$^{(R)}$ 레진은 QC-20 레진보다 높은 굽힘강도를 나타내었으며, 대조군에서 유의차를 나타내었다(p<0.05). Lucitone199$^{(R)}$ 및 QC-20 레진으로 제작한 2.0 mm 두께 시편에서 굽힘강도는 금속 격자 강화재, Quarts Splint$^{TM}$ Mesh, Ribbond$^{(R)}$, 대조군 순으로 감소되었다. Lucitone199$^{(R)}$ 레진을 이용하여 제작한 두께 2.0 mm, 2.5 mm 시편에서 Quarts Splint$^{TM}$ Mesh로 보강한 군은 대조군보다 유의하게 높은 굽힘강도를 나타내었으며(p<0.05), 두께 3.0 mm 시편에서는 유의차가 없었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 춘계학술대회 논문집
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• pp.81-81
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• 2015

inkjet printing system으로 flexible 기판위에 metal interconnection 혹은 metal mesh를 제작 할 때 metal과 flexible substrate 의 접착력을 향상 시키고 선폭을 조절하기 위하여 surface roughness를 생성 시키고 표면을 hydrophobic 하게 개질 하였다. 그 결과 metal line의 선폭과 접착력이 향상됨을 알 수 있었다.

• 대한치과보철학회지
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• 제30권3호
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• pp.411-436
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• 1992

The purpose of this study was to assess the adhesion of resilient denture liners (such as, heat-cured silicone molloplast B,cold- cured silicone Mollosil) to polymethyl metacrylate (K-33) and metal (Megalloy) in the laboratory by peel test. The resilient denture lines were processed according to manufactures instruction, onto prepared specimens(original resin base plate, rough resin base plate, stippled metal plate, mesh metal plate ) 75mm long and 25m wide. And then, the peel test was performed by instron. The results were as follows : 1. The bonding strength of Mollosil was stronger than that of Molloplast B except the specimen of stippled metal plate. 2. The tensile strength of Mollosil was weaker than that of Molloplast Bas tearing of Mollosil was occured in the peel test. 3. Mesh metal plate had the highest bonding strength in the case of Molloplast B and Mollosil. But stippled metal plate have high bonding strength in the case of Molloplast B and have the lowest bonding strength in the case of Mollosil. 4. The bonding strength of rough resin base plate was stronger than that of original resin base plate in the case of Molloplast B and Mollosil. 5. The bonding strength of metal plates was stronger than that of resin base plates in the case of Molloplast B and Mollosil except the case of bonding strength between the stippled metal plate and Mollosil. 6. It seems that the Increase of surface and retention form of metal plate and resin base plate produces higher physical bonding strength.