• 제목/요약/키워드: Metal mesh

검색결과 299건 처리시간 0.025초

화학적(化學的)으로 재생(再生)된 금속(金屬) bracket의 접착(接着) 강도(强度)와 slot폭경(幅徑) 변화(變化)에 관(關)한 연구(硏究) (A STUDY OF BONDING STRENGTH AND CHANGE OF BRACKET SLOT WIDTH OF CHEMICALLY RECYCLED METAL BRACKETS)

  • 고영삼;이동주
    • 대한치과교정학회지
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    • 제20권2호
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    • pp.283-291
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    • 1990
  • The purpose of this study was to measure and compare tensile and shear strength for 4 types of new direct-bonding brackets and same brackets after recycling and to evaluate the change of bracket slot width after recycling. Four types of new direct-bond brackets were bonded to recently extracted human premolar teeth and the tensile and shear strength was measured by Universal Testing Machine. The brackets were recycled by chemical process and the tensile and shear test was repeated. To evaluate the change of the bracket slot width, slot width was measured by the Topcon Universal Measuring Microscope before and after recycling. Following results were obtained: 1. There was no satistically significant difference between the tensile and shear strength of recycled brackets and those of new brackets. 2. In both new and recycled brackets, the tensile and shear strength of perforated base bracket was lower than those of photoetched, foilmesh and contou-lok mesh base brackets. (P<0.01) 3. There was no statistically significant difference in bonding strengths of control group bonded only once and two times. 4. There was no statistically significant difference in the change of the bracket slow width after recycling process. 5. Of the failure, the combination type (58%) in the tensile strength and the tooth adhesive interface (65%) in the shear strength was the most common type.

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RIE Damage Remove Etching Process for Solar Cell Surface Texturing Using the TMAH Etching

  • 오정화;공대영;조준환;조찬섭;윤성호;이종현
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.584-584
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    • 2012
  • 결정형 실리콘 태양전지 공정 중 표면 texturing 공정은 표면에 요철을 형성시켜 반사되는 빛 손실을 줄여서, 증가된 빛 흡수 양에 의해 단락전류(Isc)를 증가시키는데 그 목적이 있다. 표면 texturing 공정은 습식 식각과 건식 식각에 의한 방법으로 나눌 수 있다. 습식 식각은 KOH, TMAH, HNA 등의 실리콘 식각 용액을 사용하여 공정상의 위험도가 크고, 사용 후 용액의 폐기물에 의한 환경오염 문제가 있다. 건식 식각은 습식 식각과 달리 폐기물의 처리가 없고 미량의 가스를 이용한다. 그리고 다결정 실리콘 웨이퍼처럼 불규칙적인 결정방향에도 영향을 받지 않는 장점을 가지고 있어서 건식 식각을 이용한 표면 texturing 공정에 관한 많은 연구가 진행되고 있으며, 특히 RIE(reactive ion etching)를 이용한 태양전지 texturing 공정이 가장 주목을 받고 있다. 하지만 기존의 RIE를 이용하여 표면 texturing 공정을 하게 되면 500 nm 이하의 needle-like 구조의 표면이 만들어진다. Needle-like 구조의 표면은 전극을 형성할 때에 접촉 면적이 좁기 때문에 adhesion이 좋지 않은 것과 단파장 대역에서 광 손실이 많다는 단점이 있다. 본 논문에서는 기존의 RIE texturing의 단점을 보완하기 위해 챔버 내부에 metal-mesh를 장착한 후 RIE를 이용하여 $1{\mu}m$의 피라미드 구조를 형성하였고, RIE 공정 시 ion bombardment에 의한 표면 손상을 제거(RIE damage remove etching)하기 위하여 10초간 TMAH(Tetramethyl -ammonium hydroxide, 25 %) 식각 공정을 하였다.

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아연의 가열온도와 표면 거칠기가 원적외선 복사량에 미치는 영향 (Effects of Temperature and Surface Roughness of Zinc on the Far-Infrared Ray Emissivity)

  • 장충근;임진석;김원사
    • 한국광물학회지
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    • 제12권2호
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    • pp.96-100
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    • 1999
  • Effects of surface conditions (temperature and roughness) of test specimens, when measuring emissive power of far-infrared ray, have been investigated using FT-IR spectrometer. Element metal zinc (Zn) was selected in this study as representative specimen of materials consisting of simple element. The zinc specimens were heated to four temperatures, i.e., 333K, 353K, .373K, and also their surface was finished with SiC abrasive papers of 100, 220, 360, 400, 600, 800, and 1000 mesh in size. The results shows that the emissive power (W/㎡) of the far-infrared ray increases with temperature for a given roughness and its relationship may be expressed by the following equations: Yη=1.0=0.142$.$T-0.937 for η=1.0, and Yη=10=0.016$.$T-1.286 for η=10. The emissive power is also known to increase with surface roughness for a given temperature. Their relationship can be represented by the following equations: YT=313K=0.234$.$$\ell$n(η)+3.53, at 313K, YT=353K=0.234$.$$\ell$n(η)+4.02 at 353K and YT=393K=0.243$.$$\ell$n(η)+4.62 at 393K.

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전자제품용 전원 플러그의 사출-구조 연계해석 (Structural Analysis in Conjunction with Injection Molding Analysis for Electrical Power Plug)

  • 박형필;최권일;이영주;이병옥;차백순;홍석관;구본흥
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2007년도 추계학술대회 논문집
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    • pp.271-274
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    • 2007
  • Housing and insulation of electrical connectors are made of plastic resin by injection molding process. The metallic inner tube is easily deformed by high pressure during the injection process. In order to prevent deformation of the inner tube, it is desirable to simulate it by structural CAE analysis. However, it takes a long time to calculate the stress- of the part by commercially available injection molding CAE software with sufficient accuracy. In this study, structural analysis in conjunction with injection molding analysis is proposed to improve accuracy of the structural analysis. Pressure distribution on the inner tube is predicted by the injection molding CAE analysis, and then mapped onto the mesh of structural analysis by a mapping algorithm developed in this study. As a result reliable result is obtained in shorter time than the conventional method. The predicted deformation of the inner tube is compared with the actual part after experiment.

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Zn-Al系 復合電氣鍍金에 미치는 電解條件의 影響 (The Effect of Electrolysis Condition on the Zinc-Aluminum Composite Electro Plating)

  • 예길재;강식성;안덕수
    • 한국표면공학회지
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    • 제20권3호
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    • pp.118-126
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    • 1987
  • The Zn-Al composite electroplating was studied by using chloride zinc bath containing metal hydroxides $(Zn(OH)_2,\;Al(OH)_3))$ and aluminium powder. The size of Al powder codeposited in the beaker bath with Al powder of-400 mesh was under 10${\mu}m$. The Zn-Al composite was electro-deposited at 40$^{\circ}C$ in the ranges of current density of 5-50 A/$dm^2$ in the flowing electrolyte. The content of aluminium particles codeposited increased slightly with increasing flow rate of electrolyte from 0.5 m/sec to 1.0 m/sec, and decreased with increasing current density from 5 A/$dm^2$ to 50 A/$dm^2$. The content of aluminium particles codeposited by using the electrolyte containing zinc hydroxide(0.1M) was 2~4 wt%. The Al powder was codeposited mainly near the surface layer of the electrodeposits. The dissolution rate of aluminium particles in the electrolyte containing 0.1M $Zn(OH)_2$ and Boric acid was 0.41 g/l. day in comparison with 1.5 g/l. day dissolution rate in pure chloride bath.

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강소성 유한요소해석의 안정화와 고능률화에 관한 연구 (Computational strategies for improving efficiency in rigid-plastic finite element analysis)

  • 추만석;김영석
    • 대한기계학회논문집
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    • 제13권3호
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    • pp.317-322
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    • 1989
  • 본 연구에서는 Liu의 매트릭스를 강소성 유한요소법에 도입하여 통상의 소성가공 공정중에 있는 피가공물의 3차원 변형을 실용적인 수준에서 해석 가능케 하는 강소성 유한요소법을 도입하여 통상의 소성가공 공정중에 있는 피가공물의 3차원 변형을 실용적인 수준에서 해석 가능케 하는 강소성 유한요소법을 제안하고 실례를 통하여 제안한수법에 의하여 얻어진 해의 안정성과 계산효율을 검토한다.

Calorizing(Aluminizing) 코팅 층의 표면특성 고찰 (Characterization of Coating Layer formed on the Metal Surface by Calorizing)

  • 하진욱
    • 한국산학기술학회논문지
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    • 제1권1호
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    • pp.49-54
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    • 2000
  • Calorizing(또는 Aluminizing)에서 코팅분말의 입자크기 및 코팅온도가 금속표면에 형성된 코팅 층의 특성에 미치는 영향을 SEM과 EDXS를 사용하여 자세히 고찰하였다. 코팅분말은 입자크기별로 3단계로 분리하여 사용하였으며 코팅온도는 950℃ 와 980℃로 변화하였다. Calorizing 처리는 팩 세멘테이션 방법을 사용하여 아르곤 분위기에서 5시간 동안 행하였다. Calorizing 처리 결과 코팅분말의 입자크기가 감소하고 코팅온도가 증가할수록 코팅 층의 두께와 코팅 층에서의 알루미늄의 함량이 증가하였다. 또한 오팅분말의 크기가 작은 경우(150-200 mesh) 코팅 층 표면에 형성된 기공이 현저히 감소하였고 표면의 균일성도 우수함을 알 수 있었다.

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Front Surface Grid Design for High Efficiency Solar Cells

  • Gangopadhyay Utpal;Kim, Kyung-Hae;Basu Prabir Kanti;Dhungel Suresh Kumar;Jung, Sung-Wook;Yia, Jun-Sin
    • Transactions on Electrical and Electronic Materials
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    • 제6권2호
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    • pp.78-84
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    • 2005
  • Standard crystalline solar cells are generally fabricated with the front grid pattern of silver paste contact. We have reported a detailed theoretical analysis of the proposed segmented cross grid line pattern in this paper. This work was carried out for the optimization of spacing and width of grid finger, main busbar and sub-busbar. The overall electrical and optical losses due to front contact were brought down to $10\%$ or even less as compared to the usual loss of $15\%$ or more in the conventional screen printed silver paste technology by choosing proper grid pattern and optimizing the grid parameters. The total normalized power loss for segmented mesh grid with plated metal contact was also observed and the total power loss could be brought down to $10.04\%$ unlike $11.57\%$ in the case of continuous grid and plated contact. This paper is able to outline the limitations of conventional screen printed contact.

A new Tone's method in APOLLO3® and its application to fast and thermal reactor calculations

  • Mao, Li;Zmijarevic, Igor
    • Nuclear Engineering and Technology
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    • 제49권6호
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    • pp.1269-1286
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    • 2017
  • This paper presents a newly developed resonance self-shielding method based on Tone's method in $APOLLO3^{(R)}$ for fast and thermal reactor calculations. The new method is based on simplified models, the narrow resonance approximation for the slowing down source and Tone's approximation for group collision probability matrix. It utilizes mathematical probability tables as quadrature formulas in calculating effective cross-sections. Numerical results for the ZPPR drawer calculations in 1,968 groups show that, in the case of the double-column fuel drawer, Tone's method gives equivalent precision to the subgroup method while markedly reducing the total number of collision probability matrix calculations and hence the central processing unit time. In the case of a single-column fuel drawer with the presence of a uranium metal material, Tone's method obtains less precise results than those of the subgroup method due to less precise heterogeneous-homogeneous equivalence. The same options are also applied to PWR UOX, MOX, and Gd cells using the SHEM 361-group library, with the objective of analyzing whether this energy mesh might be suitable for the application of this methodology to thermal systems. The numerical results show that comparable precision is reached with both Tone's and the subgroup methods, with the satisfactory representation of intrapellet spatial effects.

신축성 전자소자를 위한 신축성 전극 및 스트레인 센서 개발 동향 (Technology of Stretchable Interconnector and Strain Sensors for Stretchable Electronics)

  • 박진영;이원재;남현진;좌성훈
    • 마이크로전자및패키징학회지
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    • 제25권4호
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    • pp.25-34
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    • 2018
  • In this paper, we review the latest technical progress and commercialization of stretchable interconnectors, stretchable strain sensors, and stretchable substrates for stretchable electronics. The development of stretchable electronics can pave a way for new applications such as wearable devices, bio-integrated devices, healthcare and monitoring, and soft robotics. The essential components of stretchable electronic devices are stretchable interconnector and stretchable substrate. Stretchable interconnector should have high stretchability and high electrical conductivity as well as stability under severe mechanical deformation. Therefore several nanocomposite-based materials using CNT, graphene, nanowire, and metal flake have been developed. Geometric engineering such as wavy, serpentine, buckled and mesh structure has been well developed. Stretchable substrate should also pose high stretchability and compatibility with stretchable sensing or interconnecting material. We summarize the recent research results of new materials for stretchable interconnector and substrate as well as strain sensors. The Important challenges in development of the stretchable interconnector and substrate are also briefly discussed.