• Journal of Korean Society of Steel Construction
• /
• v.15 no.4 s.65
• /
• pp.403-412
• /
• 2003

The composite metal deck plate system has been widely used for office structures. Recently, however, the flat deck plate has been developed to apply the composite slab system to residential structures. Reduction in construction cost and time can be expected by using expanded metal instead of wire mesh as crack control reinforcements. This study proposed a composite slab system composed of a new-shaped steel deck plate and expanded metal. Twelve specimens were tested to evaluate the structural performance of the new composite slab system. The test results were summarized mainly in terms of maximum load carrying capacity and failure behaviors of each specimen.

• Steel and Composite Structures
• /
• v.35 no.4
• /
• pp.475-494
• /
• 2020

Presented are experimental results from 24 full-scale push test specimens to study the behaviour of composite beams with trapezoidal profiled sheeting laid transverse to the beam axis. The tests use a single-sided horizontal push test setup and are divided into two series. First series contained shear loading only and the second had normal load besides shear load. Four parameters are studied: the effect of wire mesh position and number of its layers, placing a reinforcing bar at the bottom flange of the deck, normal load and its position, and shear stud layout. The results indicate that positioning mesh on top of the deck flange or 30 mm from top of the concrete slab does not affect the stud's strength and ductility. Thus, existing industry practice of locating the mesh at a nominal cover from top of the concrete slab and Eurocode 4 requirement of placing mesh 30 mm below the stud's head are both acceptable. Double mesh layer resulted in 17% increase in stud strength for push tests with single stud per rib. Placing a T16 bar at the bottom of the deck rib did not affect shear stud behaviour. The normal load resulted in 40% and 23% increase in stud strength for single and double studs per rib. Use of studs only in the middle three ribs out of five increased the strength by 23% compared to the layout with studs in first four ribs. Eurocode 4 and Johnson and Yuan equations predicted well the stud strength for single stud/rib tests without normal load, with estimations within 10% of the characteristic experimental load. These equations highly under-estimated the stud capacity, by about 40-50%, for tests with normal load. AISC 360-16 generally over-estimated the stud capacity, except for single stud/rib push tests with normal load. Nellinger equations precisely predicted the stud resistance for push tests with normal load, with ratio of experimental over predicted load as 0.99 and coefficient of variation of about 8%. But, Nellinger method over-estimated the stud capacity by about 20% in push tests with single studs without normal load.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2016.02a
• /
• pp.351.1-351.1
• /
• 2016

While conventional electronic devices have been fabricated on the rigid and brittle Si based wafer as a semiconducting substrate, future devices are increasingly finding applications where flexibility and stretchability are further integrated to enable emerging and wearable devices. To achieve high flexibility and stretchability, various approaches are investigated such as polymer based conducting composite, thin metal films on the polymer substrate, and structural modifications for stretchable electronics. In spite of many efforts, it is still a challenge to identify a solution that offers both high stretchability and superior electrical properties. In this paper, we introduce a highly stretchable entangled-mesh graphene showing a potential to address such requirements as stretchability and good electrical performance. Entangle-mesh graphene was synthesized by CVD graphene on the Cu foil. To analyze the mechanical properties of entangled-mesh graphene, endurance and stretching tester have been used.

• Proceedings of the KSME Conference
• /
• 2001.06c
• /
• pp.492-497
• /
• 2001

In the finite element analysis of metal forming processes using general Lagrangian formulation, element nodes in the mesh move and elements are distorted as the material is deformed. The excessive degeneracy of mesh interrupts finite element analysis and thus increases the error of plastic deformation energy. In this study, a remeshing scheme using so-called mesh compression method is proposed to effectively analyze the flash which is generated usually in hot forging processes. In order to verify the effectiveness of the method, several examples are tested in two-dimensional and three-dimensional problems.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
• /
• 2009.10a
• /
• pp.251-254
• /
• 2009

A new type of dye-sensitized solar cells(DSCs) based on Ti-mesh electrode without using TCO layer is fabricated for high-efficient and low-cost solar cell application. The TCO-Iess DSCs sample is composed of a [glass/ dye sensitized $TiO_2$ layer/ Ti-mesh electrode/ electrolyte/ metal counter electrode]. The Ti-mesh electrode with high conductivity can collect electrons from the $TiO_2$ layer and allows the ionic diffusion of $I^-/I_3{^-}$ through the mesh hole. Thin Ti-mesh (${\sim}40{\mu}m$ in thickness) electrode material is processed using rapid prototype method. Electrical performance of as-fabricated DSCs is presented and discussed in detail.

• Proceedings of the KIEE Conference
• /
• 2009.07a
• /
• pp.1074_1075
• /
• 2009

A new type of dye-sensitized solar cells(DSCs) based on Ti-mesh electrode without using TCO layer is fabricated for high-efficient low-cost solar cell application. The TCO-less DSCs sample is composed of a [glass/ dye sensitized $TiO_2$ layer/ Ti-mesh electrode/ electrolyte/ metal counter electrode]. The Ti-mesh electrode with high conductivity can collect electrons from the $TiO_2$ layer and allows the ionic diffusion of $I^-/I_3^-$ through the mesh hole. Thin Ti-mesh ($\sim40{\mu}m$ in thickness) electrode material is processed using rapid prototype method. Electrical performance of as-fabricated DSCs is presented and discussed in detail.

• Current Photovoltaic Research
• /
• v.9 no.1
• /
• pp.6-10
• /
• 2021

The mesh mask screen, which is generally used for screen printing metallization of silicon solar cell, requires high squeegee pressure and low printing speed. These requirements are acting as a limiting factor in production yield in photovoltaic industries. In order to improve the productivity, a metal mask, which has high durability and high printing speed, has been researched. In this paper, the characteristics of each solar cell, in which electrodes were formed by using a metal mask and a mesh mask, were analyzed through recombination current density. In particular, the metal-induced recombination current density (Jom) representing the recombination of the emitter-metal interface was calculated using the shading method, and the resulting efficiency and open-circuit voltage were analyzed through the diode equation. As a result of analyzing the proportion of the metal-induced recombination current density to the total emitter recombination current density, it was analyzed that the reduction of the metal-induced recombination current density through the metal mask is an important factor in reducing the total recombination current density of the solar cell.

• Journal of Dental Rehabilitation and Applied Science
• /
• v.28 no.4
• /
• pp.327-337
• /
• 2012

The object of this study was to find out the effect of various reinforcing materials including Quarts Splint$^{TM}$ Mesh on the transverse strength of the denture resin. QC-20 and Lucitone199$^{(R)}$ were used as the denture resin, and polyethylene fiber Ribbond$^{(R)}$, light curing quarts fiber Quarts Splint$^{TM}$ Mesh, metal mesh were used as the reinforcing materials. Ten specimens were fabricated for each group and the size of specimens was $2.0{\times}10.0{\times}65.0mm$. To compare the effect of resin thickness, additional specimens of $2.5{\times}10.0{\times}65.0mm$, $3.0{\times}10.0{\times}65.0mm$ were fabricated. In the control group, the transverse strength of Lucitone199$^{(R)}$ was significantly higher than that of QC-20(p<0.05). Among the specimens of 2.0 mm thickness fabricated with $Lucitone199^{(R)}$ and QC-20, they showed high transverse strength in the order of metal mesh, Quarts Splint$^{TM}$ Mesh, Ribbond$^{(R)}$, and control group. In the specimens of 2.0 mm, 2.5 mm thickness, the transverse strength of Quarts Splint$^{TM}$ Mesh were significantly higher than that of QC-20(p<0.05). But in the specimens of 3.0 mm thickness, there was no significant difference.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2015.05a
• /
• pp.81-81
• /
• 2015

inkjet printing system으로 flexible 기판위에 metal interconnection 혹은 metal mesh를 제작 할 때 metal과 flexible substrate 의 접착력을 향상 시키고 선폭을 조절하기 위하여 surface roughness를 생성 시키고 표면을 hydrophobic 하게 개질 하였다. 그 결과 metal line의 선폭과 접착력이 향상됨을 알 수 있었다.

• The Journal of Korean Academy of Prosthodontics
• /
• v.30 no.3
• /
• pp.411-436
• /
• 1992

The purpose of this study was to assess the adhesion of resilient denture liners (such as, heat-cured silicone molloplast B,cold- cured silicone Mollosil) to polymethyl metacrylate (K-33) and metal (Megalloy) in the laboratory by peel test. The resilient denture lines were processed according to manufactures instruction, onto prepared specimens(original resin base plate, rough resin base plate, stippled metal plate, mesh metal plate ) 75mm long and 25m wide. And then, the peel test was performed by instron. The results were as follows : 1. The bonding strength of Mollosil was stronger than that of Molloplast B except the specimen of stippled metal plate. 2. The tensile strength of Mollosil was weaker than that of Molloplast Bas tearing of Mollosil was occured in the peel test. 3. Mesh metal plate had the highest bonding strength in the case of Molloplast B and Mollosil. But stippled metal plate have high bonding strength in the case of Molloplast B and have the lowest bonding strength in the case of Mollosil. 4. The bonding strength of rough resin base plate was stronger than that of original resin base plate in the case of Molloplast B and Mollosil. 5. The bonding strength of metal plates was stronger than that of resin base plates in the case of Molloplast B and Mollosil except the case of bonding strength between the stippled metal plate and Mollosil. 6. It seems that the Increase of surface and retention form of metal plate and resin base plate produces higher physical bonding strength.