• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.172-172
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• 2003

It has been known that Pd-MILC shows much faster and lower temperature crystallization than Ni-MILC but it can not be put into practice due to the quality issue of thus fabricated poly crystals. In this study, addition of Pd into Ni-MILC has been attempted in order to take advantages of the Pd-MILC without sacrificing of the Ni-MILC TFTs. It turns out that when 5% of Pd has been added to Ni for MILC, MILC growth rate increases two - three times faster than pure Ni-MILC. The MILC growth rate shows monotonic increase with increase the amount of Pd in Ni up to 50%. Even when small amount of Pd was added to Ni like 5%, crystallization phenomenon already follows the way of Pd-MILC. The Poly-W thus fabricated shows lower leakage current than pure Ni-MILC TFT without losing any amount of on-current This fact is very important in low temperature poly-TFTs because MILC-TFTs, especially suffer from the relatively high leakage current

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.59.1-59.1
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• 2010

Aluminum-induced crystallization (AIC) of amorphous silicon (a-Si) is studied with the structure of a glass/Al/$SiO_2$/a-Si, in which the $SiO_2$ layer has micron-sized laser holes in the stack. An oxide layer between aluminum and a-Si thin films plays a significant role in the metal-induced crystallization (MIC) process determining the properties such as grain size and preferential orientation. In our case, the crystallization of a-Si is carried out only through the key hole because the $SiO_2$ layer is substantially thick enough to prevent a-Si from contacting aluminum. The crystal growth is successfully realized toward the only vertical direction, resulting a crystalline silicon grain with a size of $3{\sim}4{\mu}m$ under the hole. Lateral growth seems to be not occurred. For the AIC experiment, the glass/Al/$SiO_2$/a-Si stacks were prepared where an Al layer was deposited on glass substrate by DC sputter, $SiO_2$ and a-Si films by PECVD method, respectively. Prior to the a-Si deposition, a $30{\times}30$ micron-sized hole array with a diameter of $1{\sim}2{\mu}m$ was fabricated utilizing the femtosecond laser pulses to induce the AIC process through the key holes and the prepared workpieces were annealed in a thermal chamber for 2 hours. After heat treatment, the surface morphology, grain size, and crystal orientation of the polycrystalline silicon (pc-Si) film were evaluated by scanning electron microscope, transmission electron microscope, and energy dispersive spectrometer. In conclusion, we observed that the vertical crystal growth was occurred in the case of the crystallization of a-Si with aluminum by the MIC process in a small area. The pc-Si grain grew under the key hole up to a size of $3{\sim}4{\mu}m$ with the workpiece.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.4
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• pp.25-30
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• 2000

Ion mass doping method has been implemented for the fabrication of large area electronic devices such as TFT-LCD. In this work, the effect of ion mass doping on the velocity and the behavior of MILC was investigated. When amorphous silicon was either doped or bombarded by accelerated ions, MILC velocity was reduced by over 50% and the front edge of MILC became coarse. In order to analyze the dependence of silicon film's properties on ion mass doping, ultraviolet reflectance and sulfate roughness were investigated. Both the velocity and the behavior of MILC were found to be related with the increase of surface roughness by ion bombardment.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.307-309
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• 2005

We investigated light absorption layer effect on metal-induced lateral crystallization (MILC) growth rate and MILC thin films transistors (TFTs). As annealing method, we used scanning-rapid thermal annealing (RTA). MILC growth rate which was crystallized by light absorption layer and using scanning-RTA was 3 times than normal MILC which was without light absorption layer growth rate. Also we compared MILC TFTs characteristics which were combined to light absorption layer with conventional MILC TFTs. After scanning-RTA process, MILC-TFTs which were with light absorption layer were superior to conventional MILC-TFTs. With this new MILC-TFTs structure, we could reduced crystallization time and obtain good electrical properties.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.05a
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• pp.173-179
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• 2005

본 연구에서는 Nickel-Metal Induced Lateral crystallization(Ni-MILC)에 depart에 따른 영향을 관찰함에 있어 Nickel에 Palladium Metal을 인접시켜(Pd assisted Ni-MILC) 그 결정화 속도를 향상시키는 방법을 제안하였다. a-Si에 Phosphorous가 doping 되어 있는 경우 Ni-MILC의 성장은 intrinsic에 비해 2.5배 감소되는 반면, Boron을 doping한 경우 Ni-MILC의 성장은 intrinsic의 경우보다 5배 이상의 성장을 보이게 되는데, well type의 Pd을 인접시킨 경우 Pd에 의해 유도된 tensile stress가 각 doping에 따른 성장 속도를 더욱 증대시키는 것을 확인할 수 있었으며, 이와 같은 현상을 MILC mechanism으로 설명하였다. 이는 Ni-MILC를 이용하여 다결정 실리콘 TFT 제작 시 결정화 속도로 인하여 문제가 되었던 N-type에서의 적용이 가능함과 동시에 contact MILC 등의 방법에도 이용가능성을 의미한다.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.1
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• pp.57-62
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• 1999

Polycrystaline thin film transistors are fabricated on the transparent glass substrate by a lamp-scan annealing. The line-shaped lamp scanning method, which is profitable for large area process, effectively radiated silicon film on glass substrate. Amorphous silion film absorbs the light which is emitted from halogen-lamp and it transformed into crystalline silicon by metal-induced lateral crystallization. In order to enhance the annealing effect, capping layer was deposited on the whole substrate. When the scan speed was 1-2mm/sec, lateral crystallization of amorphous silicon under capping layer was 18~27${\mu}m/scan$. The thin film transistor fabricated by this method shows high electron mobility over 130$cm^2/V{\cdot}sec$

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.12
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• pp.29-34
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• 2000

The effects of electrical stress on MILC(Metal Induced Lateral Crystallization) poly-Si TFT were studied. After the electrical stress was applied on the TFT’s which were fabricated by MILC process, off-state(VG<0V) current was reduced by $10^2{\sim}10^4$ times. However, when the device on which electrical stress was applied was annealed in furnace, the off-state current increased as annealing temperature increased. From the dependence of off-state current on the post-annealing temperature, activation energy of the trap states in MILC poly-Si thin films was calculated to be 0.34eV.