• Journal of Welding and Joining
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• v.15 no.6
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• pp.32-40
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• 1997

Solid state diffusion bonding is the joining process performed by creep and diffusion, which is accelerated by heating below melting temperature and proper pressing, in vacuum or shielding gas atmosphere. By this process we can obtain sufficient joint which can't be expected from the fusion welding. For Ti-6Al-4V alloy, the optimum solid state diffusion bonding condition and mechanical properties of the joint were found, and micro void morphology at bond interface was observed by SEM. The results of tensile test showed sufficient joint, whose mechanical properties are similar to that of base metal. 850$^{\circ}$C, 3MPa is considered as the optimum bonding condition. Void morphology at interface is long and flat at the initial stage. As the percentage of bonded area increases, however, small and round voids are found. Variation of void shape can be explained as follows. As for the void shrinkage mechanism, at the initial stage, power law creep is the dominant, but diffusion mechanism is dominant when the percentage of bonded area is increased.

• Journal of the Korean Magnetics Society
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• v.16 no.1
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• pp.75-78
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• 2006

In case of contacts between semiconductor and metal in semiconductor circuits, they become unstable because of thermal budget. To prevent these problems, we use diffusion barrier that has a good thermal stability between metal and semiconductor. So we consider the diffusion barrier to prevent the increase of contact resistance between the interfaces of metals and semiconductors, and the increase of resistance and the reaction between the interfaces. In this paper we deposited tungsten boron carbon nitride (W-B-C-N) thin film on silicon substrate. The impurities of the $1000\;{\AA}-thick$ W-B-C-N thin films provide stuffing effect for preventing the inter-diffusion between metal thin films $(Cu-2000\;{\AA})$ and silicon during the high temperature $(700\~1000^{\circ}C)$ annealing process.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.379-381
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• 2009

The simulation model for metal-supported Solid Oxide Fuel Cell(SOFC) is developed in this study. Open circuit voltage is calculated using Nernst equation and Gibbs free energy is required by thermodynamic. The exchange current densities are compared with experimental results since exchange current density is most effective factor for the activation loss. Liu's study is used for the exchange current density of cathode, BSCF, and Koide's result is applied for the exchange current density of anode, Ni/YSZ. For the ohmic loss, ionic conductivity of YSZ is described from Kilner's mode and the data are compared with Wanzenberg's experimental data. Diffusivity is an important factor for the mass transfer through the porous medium. Both binary diffusion and Knudsen diffusion are considered as the diffusion mechanism. For validation, simulation results at this work are compared with our experimental results.

• Analytical Science and Technology
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• v.12 no.6
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• pp.465-471
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• 1999

Chloromethylated polystyrene resins supported diethylenetriamine of linear and claw types have been prepared by the reaction of diethylenetriamine with chloromethylated polystyrene. The kinetics of adsorption of transition metal ions on polystyrene resins were measured by the limited-bath technique. This paper reports the results of the diffusion coefficients, entropies of activation, and free energies of activation. The ratedetermining step of the adsorption of transition metals on the resins is a process of diffusion through the particles.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.125-133
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• 1995

Rene80 superalloy was liquid phase diffusion bonded by using pure boron (B) as an insert material. As a basic study for the possibility of practical application of this bonding method, hardness and high temperature tensile strength of the bonded joint and metallurgical analysis were investigated. As experimental results, hardness of the bonded joint was homogenized after bonding and the tensile strength at 1144K was obtained to 90% of that of base metal. But there were some problems to be improved also, that means the joint was hardened after bonding due to increase of B content and elongation was much lower than that of base metal. Flat area and (Mo, Cr, W) boride, which should be harmful for bonding strength, were observed on the fractured surface of the tensile tested specimen.

• Journal of the Korean Society for Heat Treatment
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• v.14 no.5
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• pp.282-285
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• 2001

Based on the mass balance of anion and cation fluxes, the parabolic rate constant ($K_p$) of oxide grown during the high-temperature oxidation of metal is theoretically calculated. It is assumed that the diffusion of oxygen anion and metal cation through oxide scale obeys the Fick's 1st law, the growth of oxide is controlled by the diffusion of ions, electrical potential gradient as driving force for diffusion of ions is ignored, and oxidation occurs within an existing oxide layer. Then, the parabolic rate constant can be expressed by $K_p=[2{\rho}_{MmOn}{M^2}_{MmOn}(mD_oC_o{^e}+nD_MC_M{^e})/nm]$.

• Journal of Technologic Dentistry
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• v.21 no.1
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• pp.15-26
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• 1999

This study was carried out by observing to composition of oxide on the surface of dental porcelain low gold alloy with various Indium additions according to the degassing and analysing the change composition of additional elements In on diffusion behaviors of Porcelain-matal surface. The specimens used were Au-Pd-Ag alloys by small indium addition. These specimens were treated for 10min at $1000^{\circ}C$ in vacuum condition. To investigate the microsturcture of oxidized alloy surface, SEM and EDAX were used, and EPMA were used to investigate the diffusion behaviors of porcelain-metal surface. X-ray diffraction were used to observe the morphological changes in the oxidation zone. The results of this study were obtained as follows ; 1) The hardness of alloy increased with increasing amount of In addition. 2) The formation of oxidation increased with increasing In content after heat treatment. 3) Diffusion of indium elements increased with increasing In content in metal-porcelain surface after firing. 4) The oxidations of alloy surface were mainly $In_2O_3$.

• Corrosion Science and Technology
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• v.16 no.2
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• pp.64-68
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• 2017

The interactions between corrosion pits on stainless steel under loading conditions are studied by using a cellular automata model coupled with finite element method at a mesoscopic scale. The cellular automata model focuses on a metal/film/electrolyte system, including anodic dissolution, passivation, diffusion of hydrogen ions and salt film hydrolysis. The Chopard block algorithm is used to improve the diffusion simulation efficiency. The finite element method is used to calculate the stress concentration on the pit surface during pit growth, and the effect of local stress and strain on anodic current is obtained by using the Gutman model, which is used as the boundary conditions of the cellular automata model. The transient current characteristics of the interactions between corrosion pits under different simulation factors including the breakdown of the passive film at the pit mouth and the diffusion of hydrogen ions are analyzed. The analysis of the pit stability product shows that the simulation results are close to the experimental conclusions.

• Korean Journal of Materials Research
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• v.31 no.6
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• pp.331-338
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• 2021

Ti-Al-Si target and Cr-Si target are sputtered alternately to develop a multi-layered nitride coating on a steel mold to improve die-casting lifetime. Prior to the multi-layer deposition, a CrN layer is developed as a buffer layer on the mold to suppress the diffusion of reactive elements and enhance the cohesive strength of the multi-layer deposition. Approximately 50 nm CrSiN and TiAlSiN layers are deposited layer by layer, and form about three ㎛-thickness of multi-layered coating. From the observation of the uncoated and coated steel molds after the acceleration experiment of liquid metal injection casting, the uncoated mold is severely eroded by the adhesion of molten metallic glass. On the other hand, the multi-layer coating on the mold prevents element diffusion from the metallic glass and mold erosion during the experiment. The multi-layer structure of the coating transforms the nano-composite structured coating during the acceleration test. Since the nano-composite structure disrupts element diffusion to molten metallic glass, despite microstructure changes, the coating is not eroded by the 1,050 ℃ molten metallic glass.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.2
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• pp.97-101
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• 2003

New Pt/Ti and hi/Ti double-metal structures have been investigated for the application of a diffusion barrier between Cu and Si in deep submicron integrated circuits. Pt/Ti and Ni/Ti were deposited using E-beam evaporator at room temperature. The performance of Pt/Ti and Ni/Ti structures as diffusion barrier against Cu diffusion was examined by charge pumping method, gate leakage current, junction leakage current, and SIMS(secondary ion mass spectroscopy). These evaluation indicated that Pt/Ti(200${\AA}$/100${\AA}$) film is a good barrier against Cu diffusion up to 450$^{\circ}C$.