• 한국세라믹학회지
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• 제43권11호
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• pp.734-737
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• 2006

A series of manganite-based superlattices composed of half-metallic $La_{2/3}Sr_{1/3}MnO_3/LaMnO_3$ and insulating LaMnO$_3$ stacking layers were fabricated by employing pulsed laser deposition method. The dc resistivity increased drastically by simply reducing the stacking periodicity. The resistivity enhancement was accompanied by a gradual decrease in the temperature (T$_c$) of the Metal-to-Insulator Transition (MIT). This observation was interpreted as a small decrease in the effective metallic fraction near the percolation threshold. For the stacking periodicity less than a certain critical value, there appeared another transition to an insulating state at temperatures far below T$_c$. This low-temperature transition seems to be closely related to the AF-type (C-type) orbital ordering in newly formed insulating domains.

• 한국방사선학회논문지
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• 제15권5호
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• pp.697-704
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• 2021

3D 프린팅 FDM방식의 재료인 필라멘트 중 차폐성능을 지닌 필라멘트는 국내에 판매되지 않고 있으며 관련 연구도 미비하다. 이에 본 연구는 금속 입자가 함유된 필라멘트의 물성과 방사선의 차폐능력을 평가하여 3D 프린트를 이용한 방사선 차폐체 개발의 기초자료를 제공하고자 한다. 금속입자 강화재가 함유된 금속 필라멘트 5가지를 선정 후 ASTM의 평가방법을 이용하여 인장강도, 밀도, XRD, 무게측정 등 물성을 평가하고 방사선 차폐능력을 알아보기 위하여 한국산업표준의 방호용구류 시험방법에 따라서 방사선 차폐율을 구하였다. 인장강도는 PLA + SS가 가장 높았고 ABS + W가 가장 낮았으며 밀도는 ABS + W 가 3.13 g/cm3으로 가장 높게 나타났다. XRD결과 시편의 표면의 입자의 XRD peak 패턴이 각 입자 강화재 분말 금속의 패턴과 일치함을 확인 할 수 있어 프린트된 시편이 분말금속이 함유 되었음을 확인하였다. 3D 프린트 복합 필라멘트별 차폐효과는 ABS + W, ABS + Bi, PLA + SS, PLA + Cu, PLA + Al의 순서로 실효원자번호와 밀도에 비례하여 차폐율이 높게 나타났다. 본 연구에서는 강화재로 금속 분말이 함유된 금속입자 복합 필라멘트는 방사선의 차폐능력을 가지는 것이 확인되었으며 향후 방사선 차폐용 필라멘트의 사용가능성을 확인하였다.

• 한국결정성장학회지
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• 제8권2호
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• pp.233-239
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• 1998

화학기상증착법을 이용하여 tetramethylsilane(TMS)과 hexamethyldisilane(HMDS)으로부터 SiC층을 증착시켰다. 반응관 내의 압력은 1torr를 유지시켰으며, $H_2$ 가스를 사용하여 precursor를 반응로내로 수송하였고 $1200^{\circ}C$의 반응온도로 SiC 증착이 이루어졌다. 기판은 tantalum으로 masking한 Si-wafer와 platinum, molybdenum으로 masking한 MgO 단결정을 사용하였다. 금속층(Ta, Pt, Mo)에서의 SiC 증착 양상과 Si, MgO 위에서의 SiC 증착 양상을 비교함으로써 SiC 증착의 선택성을 관찰하였다. 증착층의 주된 상은 X-선 회절분석에 의해 $\beta-SiC$로 확인되었다. 또한 전자현미경 분석을 통해 각 층에서의 증착 양상의 차이를 조사하였다.

• 통합자연과학논문집
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• 제6권3호
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• pp.170-175
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• 2013

Silicon nanowires were detached and obtained from silicon nanowire arrays on silicon substrate using a ultrasono-method. Silicon nanowire arrays on silicon substrate were prepared with an electroless metal assisted etching of p-type silicon. The etching solution was an aqueous HF solution containing silver nitrate. SEM observation shows that well-aligned nanowire arrays perpendicular to the surface of the silicon substrate were produced. After sonication of silicon nanowire array, an individual silicon nanowire was confirmed by FESEM. Optical characteristics of SiNWs were measured by FT-IR spectroscopy. The surface of SiNWs are terminated with hydrogen.

• 한국레이저가공학회지
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• 제2권3호
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• pp.52-61
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• 1999

The laser induced forward transfer(LIFT) technique employs a pulsed laser to transfer parts of a thin metal film from an optically transparent target onto an arbitrary substrate in close proximity to the metal film on the target. In this work, a two-step method, the combination of LIFT process, in which a Au film deposited on the $Al_2$O$_3$ substrate by Nd:YAG laser and subsequent Au electroless metal plating on the by LIFT process generated Au seed, was presented. The influence of laser parameters, wavelength, laser power, film thickness and overlap ratio of pulse tracks, on the shapes of deposit and conductor line after electroless plating is experimentally studied. As a results, the threshold power densities for ablation, deposition and metallization were determined and comparison of threshold value between the wave length 1064nm and the second harmonic generated 532nm. In odor to determine a possible application in the electronic industry, a smallest conduct spot size, line width and isolated line space were generated.

• Transactions on Electrical and Electronic Materials
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• 제13권2호
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• pp.78-84
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• 2012

An in-situ optical monitoring method for real-time process monitoring of electrochemical copper deposition (CED) is presented. Process variables to be controlled in achieving desired process results are numerous in the CED process, and the importance of the chemical bath conditions cannot be overemphasized for a successful process. Conventional monitoring of the chemical solution for CED relies on the pH value of the solution, electrical voltage level for the reduction of metal cations, and gravity measurement by immersing sensors into a plating bath. We propose a nonintrusive optical monitoring technique using three types of optical sensors such as chromatic sensors and UV/VIS spectroscopy sensors as potential candidates as a feasible optical monitoring method. By monitoring the color of the plating solution in the bath, we revealed that optically acquired information is strongly related to the thickness of the deposited copper on the wafers, and that the chromatic information is inversely proportional to the ratio of $Cu$ (111) and {$Cu$ (111)+$Cu$ (200)}, which can used to measure the quality of the chemical solution for electrochemical copper deposition in advanced interconnection technology.

• 한국전기전자재료학회논문지
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• 제29권7호
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• pp.414-423
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• 2016

In the present study, the $CuN_x-Cu-CuN_x$ layer the partial pressure ratio Cu metal of Ar and $N_2$ gas using a DC magnetron sputtering device, was generated by the In-situ method. $CuN_x$ layer was able to obtain a surface reflectance reduction effect from the advantages of the process and the external light. $CuN_x$ layer is gas partial pressure, DC the Power, the deposition time variable transmittance in response to the thickness and partial pressure ratio, the reflectance was measured. $Ar:N_2$ gas ratio 10:10(sccm), DC power 0.35 A, was derived Deposition time 90 sec optimum conditions. Thus, according to the optimal thickness and the composition ratio was derived surface reflectance of 20.75%. In addition, to derive the value of ${\Delta}$ Ra surface roughness of 0.467. It was derived $CuN_x$ band-gap energy of about 2.2 eV. Thus, to ensure a thickness and process conditions can be absorbed to maximize the light in a wavelength band in the visible light region. As a result, the implementation of the $12k{\Omega}$ base line resistance of using the Cu metal. This is, 5 inch Metal mesh TSP(L/S: $4/270{\mu}m$) is in the range of the reference operation.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.252.2-252.2
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• 2013

ZnO nanostructures have a lot of interest for decades due to its varied applications such as light-emitting devices, power generators, solar cells, and sensing devices etc. To get the high performance of these devices, the factors of nanostructure geometry, spacing, and alignment are important. So, Patterning of vertically- aligned ZnO nanowires are currently attractive. However, many of ZnO nanowire or nanorod fabrication methods are needs high temperature, such vapor phase transport process, metal-organic chemical vapor deposition (MOCVD), metal-organic vapor phase epitaxy, thermal evaporation, pulse laser deposition and thermal chemical vapor deposition. While hydrothermal process has great advantages-low temperature (less than $100^{\circ}C$), simple steps, short time consuming, without catalyst, and relatively ease to control than as mentioned various methods. In this work, we investigate the dependence of ZnO nanowire alignment and morphology on si substrate using of nanosphere template with various precursor concentration and components via hydrothermal process. The brief experimental scheme is as follow. First synthesized ZnO seed solution was spun coated on to cleaned Si substrate, and then annealed $350^{\circ}C$ for 1h in the furnace. Second, 200nm sized close-packed nanospheres were formed on the seed layer-coated substrate by using of gas-liquid-solid interfacial self-assembly method and drying in vaccum desicator for about a day to enhance the adhesion between seed layer and nanospheres. After that, zinc oxide nanowires were synthesized using a low temperature hydrothermal method based on alkali solution. The specimens were immersed upside down in the autoclave bath to prevent some precipitates which formed and covered on the surface. The hydrothermal conditions such as growth temperature, growth time, solution concentration, and additives are variously performed to optimize the morphologies of nanowire. To characterize the crystal structure of seed layer and nanowires, morphology, and optical properties, X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM), Raman spectroscopy, and photoluminescence (PL) studies were investigated.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.250-254
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• 2000

High temperature superconducting films deposited on metal Ag wire were prepared with YBCO powders by electrophoretic deposition method. $I_2$was used as additives for surface charge of YBCO particles. When 2~3 wt.% $BaF_2$ was added in the YBCO suspension, the pores and cracks of film surface were decreased and film density could be increased. In case of YBCO films, the critical current density ($J_{c}$) was calculated at the value of $1458{\;}A/\textrm{cm}^2$ (77K, 0K) by 4 point prove method.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.56-56
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• 2010

We report a low-temperature fabrication of organic/inorganic nanohybrid dielectrics for organic thin film transistors. The self-assembled organic layers (SAOLs) were grown by repeated sequential adsorptions of C=C-terminated alkylsilane and metal (Al or Ti) hydroxyl with ozone activation, which was called "molecular layer deposition (MLD)". The $TiO_2$ and $Al_2O_3$ inorganic layers were grown by ALD, which relies on sequential saturated surface reactions resulting in the formation of a monolayer in each sequence and is a potentially powerful method for preparing high quality multicomponent superlattices. The MLD method combined with ALD (MLD-ALD) was applied to fabricate SAOLs-$Al_2O_3$-SAOLs-$TiO_2$ nanohybrid superlattices on polymer substrates at relatively low temperature. The MLD method is an ideal fabrication technique for various flexible electronic devices.