• Korean Journal of Materials Research
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• v.28 no.4
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• pp.195-200
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• 2018

This study investigated the effects of the post annealing temperatures on the electrical and interfacial properties of a metal-semiconductor-metal photodetector(MSM-PD) device. The interdigitate type MSM-PD devices had the structure Al(500 nm) / Ti(200 nm) / poly-Si(500 nm). Structural analyses of the MSM-PD devices were performed by employing X-ray diffraction(XRD), scanning electron microscopy(SEM) and transmission electron microscope(TEM). Electrical characteristics of the MSM-PD were also examined using current-voltage(I-V) measurements. The optimal post annealing condition for the Schottky contact of MSM-PD devices are $350^{\circ}C$-30minutes. However, as the annealing temperature and time are increased, electrical characteristics of MSM-PD device are degraded. Especially, for the annealing conditions of $400^{\circ}C$-180minutes and $500^{\circ}C$-30minutes, the I-V measurement itself was impossible. These results are closely related to the solid phase reactions at the interface of MSM-PD device, which result in the formation of intermetallic compounds such as $Al_3Ti$ and $Ti_7Al_5Si_{12}$.

• Korean Journal of Metals and Materials
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• v.50 no.12
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• pp.939-948
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• 2012

A 3-ply clad metal consisting of aluminum and copper was fabricated by roll bonding process and the microstructures and mechanical properties of the roll-bonded and post-roll-bonding heat treated Cu/Al/Cu clad metal were investigated. A brittle interfacial reaction layer formed at the Cu/Al interfaces at and above $400^{\circ}C$. The thickness of the reaction layer increased from $12{\mu}m$ at $400^{\circ}C$ to $28{\mu}m$ at $500^{\circ}C$. The stress-strain curves demonstrated that the strength decreased and the ductility increased with heat treatment up to $400^{\circ}C$. The clad metal heat treated at $300^{\circ}C$ with no indication of a reaction layer exhibited an excellent combination of the strength and ductility and no delamination of layers up to final fracture in the tensile testing. Above $400^{\circ}C$, the ductility decreased rasxpidly with little change of strength, reflecting the brittle nature of the intermetallic interlayers. In Cu/Al/Cu clad heat treated above $400^{\circ}C$, periodic parallel cracks perpendicular to the stress axis were observed at the interfacial reaction layer. In-situ optical microscopic observation revealed that cracks were formed in the Cu layer due to the strain concentration in the vicinity of horizontal cracks in the intermetallic layer, promoting the premature fracture of Cu layer. Vertical cracks parallel to the stress axis were also formed at 15% strain at $500^{\circ}C$, leading to the delamination of the Cu and Al layers.

• Journal of Power System Engineering
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• v.19 no.1
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• pp.50-55
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• 2015

This study takes AC8A, which is a representative light weight alloy as matrix, and nickel as reinforcement for its superior properties. The manufacturing method applied in this study required low pressure for the infiltration of the metal matrix into the reinforcement. Porous Ni was applied as preform. The fabrication was conducted under 0.3 MPa at 600, 700 and 750 degrees centigrade, respectively. Intermetallic compounds Al3 generated between Al and Ni were observed in the composites. Microstructure, Vickers' hardness and wear characteristics of the composites were also investigated. The result indicates that the structures of compounds created at 650 degree centigrade were distributed densely; the grain size of the substances and the compounds was increased with the infiltration temperature.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.145-150
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• 2011

There is problem to reduce the car body weight for improving fuel consumption and $CO_2$ generation. As one of the solution, the multi material car body concept using aluminum alloys and high strength steels is proposed recently. Therefore, new welding processes by which these dissimilar material can be joined in high reliability and productivity are demanded. Laser spot welding was developed for joining of dissimilar metals. In the present work, Laser spot welding of zinc coated steel and aluminum alloy was investigated, and the process parameters were studied. Otherwise, the influences of process parameters on the weldability, the formation of intermetallic compound layer and the mechanical properties have been investigated. When intermetallic compound layer thickness was more than 1mm, specimen was failure in the interface.

• Journal of Korea Foundry Society
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• v.31 no.6
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• pp.354-361
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• 2011

The liquid metal shearing device was constructed and assembled with a commercial high-pressure die-caster in order to induce intensive turbulent shearing force on molten aluminum alloys. The effect of the liquid metal shearing on the microstructure and tensile properties of A356 alloys was investigated with the variation of iron content. The experimental results show that dendritic primary ${\alpha}$-Al phase was effectively modified into a equiaxed form by the liquid metal shearing. It was also found that the needle-like ${\beta}$-AlFeSi phase in a Fe containing A356 alloy was changed into a blocky shape resulting in the improved mechanical properties. Based on the mechanical properties, it was suggested that the iron content in A356 alloy could be more widely tolerated by utilizing the liquid metal shearing HPDC process.

• Journal of Welding and Joining
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• v.30 no.3
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• pp.38-43
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• 2012

In this study, active metal brazing methods for $ZrO_2$ and Ti alloy were discussed. To get a successful metal-ceramic bonding, various factors (melting temperature, corrosion, sag resistance, thermal expansion coefficient etc. of base materilas and filler metal) should be considered. Moreover, in order to clarify bonding between the metal and ceramic, the mechanism of the interfacial structure of the joints should be identified. The driving force for the formation of metal and ceramic interfaces is the reduction of the free energy which occurs when their contact becomes complete. Interfacial bonding depends on the material combinations and the bonding processes. This study describes the bonding between ceramic and metal in an active metal brazing.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.133-133
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• 1998

In the thin film alloy formation of the transition metals ion-beam-mixing technique forms a metastable structure which cannot be found in the arc-melted metal alloys. Sppecifically it is well known that the studies about the electronic structure of ion-beam-mixed alloys pprovide the useful information in understanding the metastable structures in the metal alloy. We studied the electronic change in the ion-beam-mixed ppt-Ct alloys by XppS and XANES. These analysis tools pprovide us information about the charge transfer in the valence band of intermetallic bonding. The multi-layered films were depposited on the SiO2 substrate by the sequential electron beam evapporation at a ppressure of less than 5$\times$10-7 Torr. These compprise of 4 ppairs of ppt and Cu layers where thicknesses of each layer were varied in order to change the alloy compposition. Ion-beam-mixing pprocess was carried out with 80 keV Ae+ ions with a dose of $1.5\times$ 1016 Ar+/cm2 at room tempperature. The core and valence level energy shift in these system were investigated by x-ray pphotoelectron sppectroscoppy(XppS) pphotoelectrons were excited by monochromatized Al K ａ(1486.6 eV) The ppass energy of the hemisppherical analyzer was 23.5 eV. Core-level binding energies were calibrated with the Fermi level edge. ppt L3-edge and Cu K-edge XANES sppectra were measured with the flourescence mode detector at the 3C1 beam line of the ppLS (ppohang light source). By using the change of White line(WL) area of the each metal sites and the core level shift we can obtain the information about the electrons pparticippating in the intermetallic bonding of the ion-beam-mixed alloys.

• Korean Journal of Materials Research
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• v.5 no.8
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• pp.913-920
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• 1995

RFe$_2$(R=rare earth) Laves Phase intermetallic compounds are one of the promising materials for magnetostrictive applications, due to large magnetostriction coefficients in the order of 10$^{-3}$ . However, because RFe$_2$intermetallic compounds have large magnetostriction constants as well as large magnetocrystalline anisotropy constants, a large external magnetic field is necessary to reach saturation magnetostriction. Hence researches on giant magnetostriction have been concentrated on producing materials exhibiting a high value of magnetostriction in a low magentic field. The main research trend of the giant magnetostriction to obtain the large value in the low magnetic filed, fortunately as the signs of magnetocrystalline anisotropy constans in RFe$_2$intermetallic compounds alternate with the rare earth metals, has been to substitute the rare earth metal for others and hence to reduce the magnetocrystalline anisotropy energy. In addition, amorphous RFe$_2$alloys have been researched. In this research, both of the methods which are substitution of the rare earth metal and amorphization in RFe$_2$ intermetallic compounds are simultaneously conducted to obtain the large magnetostriction coefficient in the low external magnetic field. Among them, SmFe$_2$and PrFe$_2$are selected, and amorphized in substrate-free bulk state. Magnetism in amorphous bulk (Sm$_{1-x}$ Pr$_{x}$) Fe$_2$alloys is investigated in the low magnetic field.ld.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.1-7
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• 2020

The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge).

• Journal of Korea Foundry Society
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• v.25 no.2
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• pp.80-87
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• 2005

The microstructure and mechanical property of the Ni and Ni-Cr porous metal reinforced AC4C matrix composites fabricated by squeeze casting were investigated. In this study Ni, Ni-Cr porous metals which are estimated to be easy to fabricate by squeeze casting are used as strengtheners for composite materials. As a matrix material, Al-7wt.%Si-0.3wt.%Mg(AC4C) has been used. In case of Ni/AC4C and Ni-Cr/AC4C composite, $750^{\circ}C$ melt temperature and minimum 25MPa squeezing pressure are needed to produce sound composite materials. The observation of interfacial reaction zone at various heat treatment condition shows that atsolutionizing temperature of above $520^{\circ}C$, the interfacial reaction zone increases proportionally with heat treatment time and the reaction products formed by interfacial reactions are mainly composed by $Al_{3}Ni$ and $Al_{3}Ni_{2}$ phases.