• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.269-274
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• 1999

As the semiconductor industry enters the next century, we are facing to the technological changes and challenges. Optical lithography has driven by the miniaturisation of semiconductor devices and has been accompanied by an increase in wafer productivity and performance through the reduction of the IC image geometries. In the last decade, DRAM(Dynamic Random Access Memories) have been quadrupoling in level of integration every two years. Korean chip makers have been produced the memory devices, mainly DRAM, which are the driving force of IC＇s(Integrated Circuits) development and are the technology indicator for advanced manufacturing. Therefore, Korean chip makers have an important position to predict and lead the patterning technology. In this paper, we will be discussed the limitations of the optical lithography, such as KrF and ArF. And, post optical lithography technology, such as E-beam lithography, EUV and E-beam Projection Lithography shall be introduced.

• Journal of the Korea Society of Computer and Information
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• v.23 no.4
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• pp.1-8
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• 2018

In this paper, we propose an adaptive partition cache replacement policy and evaluate the performance of our scheme using various monitoring ratios to help lifetime extension of non-volatile main memory systems without performance degradation. The proposal combines conventional LRU (Least Recently Used) replacement policy and Early Eviction Zone (E2Z), which considers a dirty bit as well as LRU bits to select a candidate block. In particular, this paper shows the performance of non-volatile memory using various monitoring ratios and determines optimized monitoring ratio and partition size of E2Z for reducing the number of writebacks using cache hit counter logic and hit predictor. In the experiment evaluation, we showed that 1:128 combination provided the best results of writebacks and runtime, in terms of performance and complexity trade-off relation, and our proposal yielded up to 42% reduction of writebacks, compared with others.

• IEMEK Journal of Embedded Systems and Applications
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• v.8 no.5
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• pp.255-264
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• 2013

Resolving of memory access latency is one of the most important problems in modern embedded system design. Recently, tons of studies are presented to reduce and hide the access latency. Burst/page data transfer modes are representative hardware techniques for achieving such purpose. The burst data transfer capability offers an average access time reduction of more than 65 percent for an eight-word sequential transfer. However, solution of utilizing such burst data transfer to improve memory performance has not been accomplished at commercial level. Therefore, this paper presents a new technique that provides the maximum utilization of burst transfer for memory accesses with local variables in code by reorganizing variables placement.

• IE interfaces
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• v.11 no.2
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• pp.149-157
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• 1998

In this paper, various techniques considering the characteristics of computer memory management are suggested, which can be used in the implementation of simplex method. First, reduction technique of indirect addressing, redundant references of memory, and scatter/gather technique are implemented, and the effectiveness of the techniques is shown. Loop-unrolling technique, which exploits the arithmetic operation mechanism of computer, is also implemented. Second, a subroutine frequently called is written in low-level language, and the effectiveness is proved by experimental results. Third, row-column linked list and Gustavson's data structure are compared as the data structure for the large sparse matrix in LU form. Last, buffering technique and memory-mapped file which can be used in reading large data file are implemented and the effectiveness is shown.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1335-1336
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• 2007

Among the emerging non-volatile memory technologies, phase change memories are the most attractive in terms of both performance and scalability perspectives. Phase-change random access memory(PRAM), compare with flash memory technologies, has advantages of high density, low cost, low consumption energy and fast response speed. However, PRAM device has disadvantages of set operation speed and reset operation power consumption. In this paper, we investigated scalability of $Ge_{1}Se_{1}Te_{2}$ chalcogenide material to improve its properties. As a result, reduction of phase change region have improved electrical properties of PRAM device.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.68 no.2
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• pp.364-369
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• 2019

Generally, since memory chips should be tested all, considering its volume, the reduction in test time for detecting faults plays an important role in reducing the overall production cost. The parallel testing of chips in one ATE is a competitive solution to solve it. In this paper, NOC is proposed as test interface architecture between DUTs and ATE. Because NOC can be extended freely, there is no limit on the number of DUTs tested at the same time. Thus, more memory can be tested with the same bandwidth of ATE. Furthermore, the proposed NOC-based parallel test method can increase the efficiency of channel usage by packet type data transmission.

• Proceedings of the Korean Institute of Intelligent Systems Conference
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• 2003.09a
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• pp.640-643
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• 2003

A Walsh function based associative memory is capable of storing m patterns in a single pattern storage space with Walsh encoding of each pattern. Furthermore, each stored pattern can be matched against the stored patterns extremely fast using algorithmic parallel processing. As such, this special type of memory is ideal for real-time processing of large scale information. However this incredible efficiency generates large amount of crosstalk between stored patterns that incurs mis-recognition. This crosstalk is a function of the set of different sequencies [number of zero crossings] of the Walsh function associated with each pattern to be stored. This sequency set is thus optimized in this paper to minimize mis-recognition, as well as to maximize memory saying. In this paper, this Walsh memory has been applied to the problem of face recognition, where PCA is applied to dimensionality reduction. The maximum Walsh spectral component and genetic algorithm (GA) are applied to determine the optimal Walsh function set to be associated with the data to be stored. The experimental results indicate that the proposed methods provide a novel and robust technology to achieve an error-free, real-time, and memory-saving recognition of large scale patterns.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• The Transactions of the Korea Information Processing Society
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• v.5 no.1
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• pp.24-32
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• 1998

The bus contention among bus-based shared-memory multiprocessors limits their performance. In addition, under split bus transaction environment, multiprocessors may make some memory requests unnecessary stand by in the memory access buffer, which makes system performance worse. This unnecessary stand-by can be eliminated by maintaining the bitmap table which contains the status bit for each memory block. However, this mechanism requires a great size of SRAM for the status information, which is fully mapped from the whole memory blocks. To solve this problem, we propose a bitmap cache which exploits partial mapping and locality of references. The simulation results show that the proposed system can greatly reduce the capacity of SRAM for the status information with little deteriorating its performance.

• ETRI Journal
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• v.31 no.6
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• pp.784-794
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• 2009

We present a full HD (1080p) H.264/AVC High Profile hardware encoder based on fast motion estimation (ME). Most processing cycles are occupied with ME and use external memory access to fetch samples, which degrades the performance of the encoder. A novel approach to fast ME which uses shared multibank memory can solve these problems. The proposed pixel subsampling ME algorithm is suitable for fast motion vector searches for high-quality resolution images. The proposed algorithm achieves an 87.5% reduction of computational complexity compared with the full search algorithm in the JM reference software, while sustaining the video quality without any conspicuous PSNR loss. The usage amount of shared multibank memory between the coarse ME and fine ME blocks is 93.6%, which saves external memory access cycles and speeds up ME. It is feasible to perform the algorithm at a 270 MHz clock speed for 30 frame/s real-time full HD encoding. Its total gate count is 872k, and internal SRAM size is 41.8 kB.