• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.95-96
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• 2009

• Journal of Mechanical Science and Technology
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• 제15권12호
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• pp.1676-1682
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• 2001

This work deals with the electrical conductivity of dielectric and cobalts percentage on output parameters such as metal removal rate and surface roughness value of sintered carbides cut by wire-electrical discharge machining (WEDM). To obtain a precise workpiece with good quality, some extra repetitive finish cuts along the rough cutting contour are necessary, Experimental results show that increases of cobalt amount in carbides affects the metal removal rate and worsens the surface quality as a greater quantity of solidified metal deposits on the eroded surface. Lower electrical conductivity of the dielectric results in a higher metal removal rare as the gap between wire electrode and workpiece reduced. Especially, the surface characteristics of rough-cut workpiece and wire electrode were analyzed too. To obtain a good surface equality without crack, 4 finish-cuts were necessary reducing fille electrical energy and the offset value.

• Tribology and Lubricants
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• 제28권6호
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• pp.272-277
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• 2012

Finite element analysis was carried out using wafer-scale and particle-scale models to understand the mechanism of the fast removal rate(edge effect) at wafer edges in the chemical-mechanical polishing process. This is the first to report that a particle-scale model can explain the edge effect well in terms of stress distribution and magnitude. The results also revealed that the mechanism could not be fully understood by using the wafer-scale model, which has been used in many previous studies. The wafer-scale model neither gives the stress magnitude that is sufficient to remove material nor indicates the coincidence between the stress distribution and the removal rate along a wafer surface.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.537-537
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• 2008

Copper (Cu) has been widely used for interconnection structure in intergrated circuits because of its properties such as a low resistance and high resistance to electromigration compared with aluminuim. Damascene processing for the interconnection structure utilizes 2-steps chemical mechanical polishing(CMP). After polishing, the removal of abrasive particles on the surfaces becomes as important as the polishing process. In the paper, buffing process for the removal of colloidal silica from polished Cu wafer was proposed and demonstrated.

• 대한기계학회논문집A
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• 제28권11호
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• pp.1807-1812
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• 2004

The application of chemical mechanical polishing(CMP) has a long history. Recently, CMP has been used in the planarization of the interlayer dielectric(ILD) and metal used to form the multilevel interconnections between each layers. Therefore, much research has been conducted to understand the basic mechanism of the CMP process. CMP performed by the down force and the relative speed between pad and wafer with slurry is typical tribo-system. In general, studies have indicated that removal rate is relative to energy. Accordingly, in this study, CMP results will be analyzed by a viewpoint of the friction energy using friction force measurement. The results show that energy would not constant in the same removal rate conditions

• Tribology and Lubricants
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• 제38권6호
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• pp.247-254
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• 2022

Chemical mechanical polishing (CMP) is a hybrid surface-polishing process that utilizes both mechanical and chemical energy. However, the recently emerging semiconductor substrate and thin film materials are challenging to process using the existing CMP. Therefore, previous researchers have conducted studies to increase the material removal rate (MRR) of CMP. Most materials studied to improve MRR have high hardness and chemical stability. Methods for enhancing the material removal efficiency of CMP include additional provision of electric, thermal, light, mechanical, and chemical energies. This study aims to introduce research trends on CMP using ultraviolet (UV) light to these methods to improve the material removal efficiency of CMP. This method, photocatalysis-assisted chemical mechanical polishing (PCMP), utilizes photocatalytic oxidation using UV light. In this study, the target materials of the PCMP application include SiC, GaN, GaAs, and Ru. This study explains the photocatalytic reaction, which is the basic principle of PCMP, and reviews studies on PCMP according to materials. Additionally, the researchers classified the PCMP system used in existing studies and presented the course for further investigation of PCMP. This study aims to aid in understanding PCMP and set the direction of future research. Lastly, since there have not been many studies on the tribology characteristics in PCMP, research on this is expected to be required.

• 대한기계학회논문집B
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• 제27권7호
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• pp.929-937
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• 2003

In general, the electric motor for driving the centrifuge of Decanter type is selected based on the power(starting power) necessary to start the bowl and the screw shaft. However the operation cost of the machine is dependent on the power needed at a steadily operating condition, including the power against the bearing friction and that for the sludge removal. In this paper, the formulation for the sludge-removal power is presented. Sample calculation for a specific design shows that the sludge-removal power is increased with the friction coefficient. It also reveals that the power is mainly dependent on the length of the screw blade rather than the beach angle. Further it is shown that the power increases in square of the rotational speed of the machine.

• Tribology and Lubricants
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• 제34권5호
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• pp.175-182
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• 2018

Accumulation of coal ash at the boiler wall reduces combustion and fuel efficiency. The design of a wall blower is important to effectively remove coal ash. We present numerical results for the removal of coal ash from boiler walls of domestic coal-fired power plants, associated with the computational fluid dynamics for the flow from spray nozzle to boiler wall. The numerical model simulates an erosion process in which the multiphase fluid comprising saturated vapor and fluid water is sprayed from the nozzle, and the water particles impact the boiler wall. We adopt the Finnie erosion model for water particles. We obtain the erosion rate density as a function of nozzle angle and its injection angle. As excessive coal ash removal usually induces damage to the boiler wall, the removal operation typically focuses on a large area with uniform depth rather than the maximum removal of coal ash at a specific location. In order to estimate the removal performance of the wall blower nozzle considering several functionality and reliability factors, we evaluate the optimal injection and nozzle angles with respect to the biggest cumulative and highest erosion rates, as well as the widest range and lowest standard deviation of the erosion rate distribution.

• 한국정밀공학회지
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• 제26권5호
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• pp.150-156
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• 2009

The removal of tiny particles adhered to surfaces is one of the crucial prerequisite for a further increase in IC fabrication, large area displays and for the process in nanotechnology. Various cleaning techniques (wet chemical cleaning, scrubbing, pressurized jets and ultrasonic processes) currently used to clean critical surfaces are limited to removal of micrometer-sized particles. Therefore the removal of sub-micron sized particles from silicon wafers is of great interest. For this purpose various cleaning methods are currently under investigation. In this paper, we report on experiments on the cleaning effect of 100nm sized fluorescence particles on silicon wafer using the plasma shockwave occurred by femtosecond laser. The plasma shockwave is main effect of femtosecond laser cleaning to remove particles. The removal efficiency was dependent on the gap distance between laser focus and surface but in some case surface was damaged by excessive laser intensity. These experiments demonstrate the feasibility of femtosecond laser cleaning using 100nm size fluorescence particles on wafer.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.33-36
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• 2003

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina $(Al_2O_3)$ abrasive containing slurry with 5 % $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with 5 % $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.