• 대한의용생체공학회:의공학회지
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• 제24권6호
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• pp.495-500
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• 2003

본 연구의 목적은 컴퓨터 그래픽 모델을 사용하여 보행 시 족부 관절의 기구학적 특성을 알아보는 것이었다. 모델에서 모든 관전은 단일중심(monocentric), 1 자유도 힌지 관절로 구성되었다. 보행 시 족부의 모션데이터는 4대의 카메라를 사용한 모션측정기로 얻었으며, 이 모션데이터를 피험자의 밭의 크기에 맞게 스케일링된 모델에 입력하여 시뮬레이션을 수행하였다. 첫 번째 발목발허리관절(tarsometatarsal joint)의 운동 범위(range of motion)는 $-8^{\circ}\;\~\;-13^{\circ}$ 이었으며, 발허리발가락관절(metatarsophanlangeal joint)에서의 운동범위는 $-13^{\circ}\;\~\;-48^{\circ}$ 이었다. 발목발허리관절과 발허리발가락관절에서의 기구학적인 데이터는 이전 연구와 비교했을 때 비슷한 경향을 나타내었다. 따라서 본 연구에서 제시하는 컴퓨터 그래픽을 기반으로 한 족부 모델링은 족부 관절의 생체역학적 해석을 위한 유용한 방법이라 할 수 있을 것이다.

• 대한금속재료학회지
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• 제50권1호
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• 한국주거학회:학술대회논문집
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• 한국주거학회 2006년도 추계학술발표대회 논문집
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• pp.370-373
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• 2006

Lastly, the problem of filling occurs in the process of concealed joint of adjacent components and was seen in joints between the structure and an electrical or mechanical device. Therefore, the dry processing which replaces wet joint was seen in joints between the structure and a door, ones between the structure and a finishing materials, ones between a gypsum board and electrical device, and ones between a water pipe and a tile finishing. And a process of separating the area of jointed parts in order to eliminate the problem of overlap was seen in joints between a door and a finishing material and ones between a gypsum board on the ceiling and a light. Lastly, an analysis of a process of exposing concealed parts indicated that the problem of filling could be applied to joints between the structure and an electrical or mechanical device and ones between a finishing material and a mechanical device. This study sought out methods to apply Environment Friendly Multi Housing Remodeling that allow easy remodeling as part of environment- preserving policies. It also contains basic data useful to implement long-life houses in the future by presenting a comprehensive design standard for them

• 대한기계학회논문집
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• 제19권4호
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• pp.918-928
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• 1995

This paper deals with the various mechanical properties and fatigue strength in the FRW1 (friction welded interface) of high speed steel (HSS-Co) to SM55C through the tensile test, hardness test and fatigue test. The data of FRW specimens are also compared with those of the base materials (HSS-Co and SM55C steel). Three kinds of specimens used in this study are the friction welded joints, HSS-Co and SM55C carbon steel with circumferential notch, saw notch and smooth, respectively. It is confirmed that the applied welding conditions are optimum methods in order to minimize the heat affected zone (HAZ) and hardness distribution at the HAZ. The fatigue strengths at N = 10$^{6}$ cycles of smooth, circumferential notch and saw notch specimens in the FRW joints are about 299.2 MPa, 123.8 MPa and 247.5 MPA, respectively. The fatigue strength of the friction welded joints is almost equal to that of the SM55C carbon steel in the optimum welding conditions. The fatigue cracks initiated at the welded zone are propagated along the side of SM55C steel.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.250-255
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• 2008

This study utilized a high speed lap-shear test to evaluate the mechanical behavior of Sn-37Pb/Cu and Sn-37Pb/Electroless Nickel immersion Gold under bump metallization solder joints under high speed loading and hence the drop reliability. The samples were aged for 120 h at different temperatures ($120^{\circ}C,\;150^{\circ}C,\;170^{\circ}C$) and afterward tested at different displacement rates (0.01 mm/s to 500 mm/s) to examine the effects of aging on the drop life reliability. The combination of the stress-strain graphs captured from the shear tests and identifying a fracture mode dominant in the samples for different strain rates leads us to conclude that the drop reliability of solder joints degrades as the aging temperature increases, possibly due to the role of the IMC layer. This study successfully demonstrates that the analysis based on a high speed lap-shear test could be critically used to evaluate the drop reliability of solder joints.

• 한국안전학회지
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• 제25권1호
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• pp.1-8
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• 2010

The tensile and fatigue experiments were conducted with tensile-shear specimens for investigating the strength of adhesive bonded and mechanical press joints of SPCC steel sheet used in the field of the automobile industry. The optimal punch press force was evaluated 50kN for combining epoxy adhesive bonding and mechanical press joining with a diameter of 8.3mm using SPCC sheet with a thickness of 0.8mm. The combining epoxy adhesive bonding and mechanical press joining exhibits the maximum tensile force of 750N. The fatigue strengths of the combination of adhesive bond and mechanical press joint and pure adhesive joint were evaluated 370N and 320N at 106cycles, respectively. These values correspond to 22% and 20% of their maximum tensile forces, respectively. However, the fatigue strength of the combination of adhesive bond and mechanical press joining was much lower than that of pure mechanical press joining.

• 대한기계학회논문집A
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• 제21권2호
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• pp.327-336
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• 1997

This paper addresses an analytical approach to the mechanical error analysis and tolerance design of a four-bar path generator with lubricated joints. The mobility method is applied to consider lubrication effects and the four-bar path generator is stochastically modeled by using the clearance vector model for methanical error analysis. To show the validity of the proposed method, the mechanical errors obtained by applying the method to a four-bar path generator are compared with those by Monte Carlo simulation. Based on this analytical method, an optimal tolerance design problem is formulated and solved for the four-bar path generator.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.208-213
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• 2002

When a thermoset conductive adhesive joints are subjected to the thermal cycles, the thermal stresses are developed around the joints. Most of in-plane, hi-axial components of these residual stresses induces large tensile peel stresses and weakens adhesive joints. Also these stresses vary with thermal cycles, and result in thermal fatigue loading and debonding propagation. In this study, the thermal ratchetting effect in conductive adhesive joints are evaluated by the finite element analysis with the viscoelastic material model. In order to Investigate the relationship between thermal ratchetting and glass transition temperature, the mathematical material model has been developed experimentally by dynamic mechanical analysis. These material models are implemented to the finite element analysis with thermal loading cycles. And the stress profiles around the conductive adhesive joints are calculated. It has been observed that the thermal ratchetting occurs when the maximum temperature of thermal cycles is above the glass transition temperature. The peel and shear stress components increase as the thermal loading time increases. This will contributes to thermal fatigue fracture of the joints.

• 한국기계가공학회지
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• 제17권1호
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• pp.34-41
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• 2018

A flange joint is a pipe connection used to prevent the leakage of high-pressure fluids by inserting a gasket and tightening the bolts. Among several kinds of gaskets available, metal ring type joint gaskets are most widely used in conditions that require high-temperature and high-pressure fluid flow, such as oil pipelines, gas pipes, pumps, valve joints, etc. The purpose of this study is to investigate the contact pressure and stress characteristics closely related to the sealing performance of Class 900 flange joints used in high temperature and high pressure environments. The dimensions of flange joints with five different nominal pipe sizes were determined with reference to those specified in ASME 16.5. The metal ring gaskets inserted in the joints were octagonal and oval gaskets. The bolt tensile forces calculated from the tightening torques were input as the bolt pretension loads in order to determine the contact pressure and stress levels after fastening. Loading was composed of three steps, including the fastening step, and different amounts of applied pressures were used in each analysis to investigate the effect of fluid pressure on the contact force of the joints. A general-purpose software, ANSYS 17.2, was used for the analysis.

• 한국전기전자재료학회논문지
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• 제32권1호
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• pp.6-12
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• 2019

Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.