• Journal of Mechanical Science and Technology
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• v.20 no.2
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• pp.227-233
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• 2006

Engineering ceramics have many unique characteristics both in mechanical and physical properties such as high temperature hardness, high thermal, chemical and electrical resistance. However, its machinability is very poor in conventional machining due to its high hardness and severe tool wear. In the current experimental study, alumina $(Al_2O_3)$ was ultrasonically machined using SiC abrasives under various machining conditions to investigate the material removal rate and surface quality of the machined samples. Under the applied amplitude of 0.02mm, 27kHz frequency, three slurry ratios of 1:1, 1:3 and 1:5 with different tool shapes and applied static pressure levels, the machining was conducted. Using the mesh number of 240 abrasive, slurry ratio of 1:1 and static pressure of $2.5kg/cm^2$, maximum material removal rate of $18.97mm^3/min$ was achieved. With mesh number of 600 SiC abrasives and static pressure of $3.0kg/cm^2$, best surface roughness of $0.76{\mu}m$ Ra was obtained.

• Advances in aircraft and spacecraft science
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• v.9 no.2
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• pp.131-148
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• 2022

The paper presents the surface-modified NACA 2412 airfoil performance with variable cavity characteristics such as size, shape and orientation, by numerically investigated with the pre-validation study. The study attempts to improve the airfoil aerodynamic performance at 30 m/s with a variable angle of attack (AOA) ranging from 0° to 20° under Reynolds number (R_e) 4.4×10⁵. Through passive surface control techniques, a boundary layer control strategy has been enhanced to improve flow performance. An intense background survey has been carried out over the modifier orientation, shape, and numbers to differentiate the sub-critical and post-critical flow regimes. The wall-bounded flows along with its governing equations are investigated using Reynolds Average Navier Strokes (RANS) solver coupled with one-equational transport Spalart Allmaras model. It was observed that the aerodynamic efficiency of cavity airfoil had been improved by enhancing maximum lift to drag ratio ((l/d) max) with delayed flow separation by keeping the flow attached beyond 0.25C even at a higher angle of attack. Detailed investigation on the cavity distribution pattern reveals that cavity depth and width are essential in degrading the early flow separation characteristics. In this study, overall general performance comparison, all the cavity airfoil models have delayed stalling compared to the original airfoil.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.10a
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• pp.54-54
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• 2003

DLC films were deposited on Si(100) substrates by inductively coupled plasma (ICP) assisted chemical vapor deposition (CVD). A mixture of acetylene (C$_2$H$_2$) and argon (Ar) gases was used as the precursor and plasma source, respectively. The structure of the films was characterized by the Raman spectroscopy. Results from the Raman spectroscopy analysis indicated that the property change of the DLC films is due to the sp$^3$ and sp$^2$ ratio in the films under various conditions such as ICP power, working pressure and RF substrate bias. The hydrogen content in the DLC films was determined by an electron recoil detector (ERB). The roughness of the films was measured by atomic force microscope (Am). A microhardness tester was used for the hardness and elastic modulus measurement. The DLC film showed a maximum hardness of 37㎬. In this work, the relationship between deposition parameters and mechanical properties were discussed.

• Journal of Ceramic Processing Research
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• v.13 no.spc2
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• pp.193-197
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• 2012

Oxygen plasma has been treated on the surface of indium-tin-oxide (ITO) to improve the efficiency of the organic light-emitting diodes (OLEDs) device. The plasma treatment was expected to inject the holes effectively due to the control of an ITO work-function and the reduction of surface roughness. To optimize the treatment condition, a surface resistance and morphology of the ITO surface were investigated. The effect on the electrical properties of the OLEDs was evaluated as a function of oxygen plasma powers (0, 200, 250, 300, and 450 W). The electrical properties of the devices were measured in a device structure of ITO/TPD/Alq3/BCP/LiF/Al. It was found the plasma treatment of the ITO surface affects on the efficiency of the device. The efficiency of the device was optimized at the plasma power of 250 W and decreased at higher power than 250 W. The maximum values of luminance, luminous power efficiency, and external quantum efficiency of the plasma treated devices increase by 1.4 times, 1.4 times, and 1.2 times, respectively, compared to those of the non-treated ones.

• The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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• v.5 no.3
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• pp.169-177
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• 1976

The importance of surface conditions of nucleate boiling is well recognized and it has been known that the heat transfer to boiling liquid is closely related to the bubble population density. The bubble population density should depend on various factors such as heat flux, surface roughness, surface contamination, properties of liquid, etc. In this paper the effect of surface conditions on heat transfer in nucleate boiling is treated. The experiments were carried out with distilled water boiler, on the horizontal heating surfaces, sintered with various bronze particle, under atmospheric pressure. In addition, experimental investigation for the polished bronze surface was performed. By studing a coefficient Xb defined by eq. (9), which represents the bubble foaming ability of heating surface, generalized fomula on the heat transfer in the nucleate toiling were expressed. The coefficient $X_b$, determined empirically, is not constant and indicates a major influence of the sintered metal surfaces on the $\Delta$, necessary to sustain nucleate boiling at any given heat flux. In this study, the main results are obtained as follows; (1) At low temperature difference, the coefficient $X_b$ of sintered metal surface was found to he higher than the polished surface throughout the full range of experiments. (2) The optimum sintered structure showing the maximum coefficient $X_b$ has been confirmed to exist and it is encountered when particle diameter is $256{\mu}$.

• Korean Journal of Materials Research
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• v.19 no.2
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• pp.68-72
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• 2009

This study investigated dry etching of acrylic in capacitively coupled $SF_6$, $SF_6/O_2$ and $SF_6/CH_4$ plasma under a low vacuum pressure. The process pressure was 100 mTorr and the total gas flow rate was fixed at 10 sccm. The process variables were the RIE chuck power and the plasma gas composition. The RIE chuck power varied in the range of $25{\sim}150\;W$. $SF_6/O_2$ plasma produced higher etch rates of acrylic than pure $SF_6$ and $O_2$ at a fixed total flow rate. 5 sccm $SF_6$/5 sccm $O_2$ provided $0.11{\mu}m$/min and $1.16{\mu}m$/min at 25W and 150W RIE of chuck power, respectively. The results were nearly 2.9 times higher compared to those at pure $SF_6$ plasma etching. Additionally, mixed plasma of $SF_6/CH_4$ reduced the etch rate of acrylic. 5 sccm $SF_6$/5 sccm $CH_4$ plasma resulted in $0.02{\mu}m$/min and $0.07{\mu}m$/min at 25W and 150W RIE of chuck power. The etch selectivity of acrylic to photoresist was higher in $SF_6/O_2$ plasma than in pure $SF_6$ or $SF_6/CH_4$ plasma. The maximum RMS roughness (7.6 nm) of an etched acrylic surface was found to be 50% $O_2$ in $SF_6/O_2$ plasma. Besides the process regime, the RMS roughness of acrylic was approximately $3{\sim}4\;nm$ at different percentages of $O_2$ with a chuck power of 100W RIE in $SF_6/O_2$ plasma etching.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.43-48
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• 2011

The maximum current density of copper electrorefining is 350 A/$m^2$ and the higher current density is required to promote the copper productivity. The 1000 A/$m^2$ high current density is possible when rotating disc electrode is employed to reduce diffusion thickness. The copper electroplating with 1000 A/$m^2$ is possible at 400 rpm. Thiourea and glue were used to improve the electrodeposition behaviors during copper electrorefining process. Potentiodynamic polarization tests were conducted to investigate the effects of additives on copper electrodeposition. Galvanostatic tests were also conducted at 1000 A/$m^2$. Copper were electroplated on cylindrical rotating electrodes to give the uniform flow on the electrode surface. The lowest surface roughness was obtained when 16 ppm thiourea was added to the electrolytes. The surface roughness was increased with glue concentration. The surface hardness was not influenced by addition of glue. The copper nuclei were getting smaller with thiourea concentration, however there is no glue effects on copper nucleation.

• Korean Chemical Engineering Research
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• v.44 no.5
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• pp.513-519
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• 2006

We developed two kinds of the microchip for application to electrophoresis based on both glass and quartz employing the MEMS fabrications. The poly-Si layer deposited onto the bonding interface apart from channel regions can play a role as the optical slit cutting off the stray light in order to concentrate the UV ray, from which it is possible to improve the signal-to-noise (S/N) ratio of the detection on a chip. In the glass chip, the deposited poly-Si layer had an important function of the etch mask and provided the bonding surface properly enabling the anodic bonding. The glass wafer including more impurities than quartz one results in the higher surface roughness of the channel wall, which affects subsequently on the microflow behavior of the sample solutions. In order to solve this problem, we prepared here the mixed etchant consisting HF and $NH_4F$ solutions, by which the surface roughness was reduced. Both the shape and the dimension of each channel were observed, and the electroosmotic flow velocities were measured as 0.5 mm/s for quartz and 0.36 mm/s for glass channel by implementing the microchip electrophoresis. Applying the optical slit with poly-Si layer provides that the S/N ratio of the peak is increased as ca. 2 times for quartz chip and ca. 3 times for glass chip. The maximum UV absorbance is also enhanced with ca. 1.6 and 1.7 times, respectively.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.6
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• pp.723-730
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• 2012

The radar cross section(RCS) of a trihedral corner reflector(TCR) should be accurately computed when it is used as an external calibration target for a satellite synthetic aperture radar(SAR) calibration campaign. This paper presents the RCS analysis on a trihedral corner reflector which is installed on a calibration site, using the wave reflection from the rough surface and the wave diffraction from the TCR edges. The results in this paper show quantitatively the effect of the front surface on the RCS of a TCR. The difference of the RCS between a TCR in air and a TCR on a ground surface is computed by including the interaction term which consists of the edge diffraction from the TCR edges and the surface reflection from the front rough surface. The reflection coefficient of a randomly rough surface is a function of the surface roughness and dielectric constant of the surface. The RCS of $10{\lambda}$ size TCR on a ground is 0.46 dB higher than TCR in air at 9.65 GHz, and this can reach at maximum 1.55 dB depending on a surface condition and TCR size. The effect of the front surface on the RCS of a TCR increases, as the surface roughness decreases, the soil moisture increases, and the size of TCR in wavelength decreases.

• Korean Journal of Optics and Photonics
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• v.17 no.1
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• pp.47-53
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• 2006

The Integrated Ballistics Identification Systems (IBIS) is widely used for bullet and casing signature identification. The IBIS obtains a pair of ballistic signatures from two bullets (or casings) using optical microscopy, and estimates a correlation score which can represent the degree of signature match. However, this method largely depends on lighting and surface conditions because optical image contrast is primarily a function of test surface's slope, shadowing, multiple reflections, optical properties, and illumination direction. Moreover, it can be affected with surface height variation. To overcome these problems and improve the identification system, we used well known surface topographic techniques, such as confocal microscopy and white-light scanning interferometry. The measuring instruments were calibrated by a NIST step height standard and verified by a NIST sinusoidal profile roughness standard and a commercial roughness standard. We also suggest a new analysis method for the ballistic identification. In this method, the maximum cross-correlation function CCFmax is used to quantify the degree of signature match. If the compared signatures were exactly the same, CCFmax would be $100\%$.