• 제목/요약/키워드: Materials aging

검색결과 1,331건 처리시간 0.027초

CuAINi 형상기억합금의 시효처리에 따른 상변태 거동 (Phase Transformation Behavior on Aging Treatment in CuAINi Shape Memory Alloy)

  • 앙권승;강조원
    • 열처리공학회지
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    • 제6권4호
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    • pp.213-222
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    • 1993
  • This research was performed to investigate the transformation behavior and shape memory effect of Cu-13.5Al-4.5Ni(wt%) alloy with various aging temperature and time. The results obtained in this study are as follows: Transformation temperature was very increased when aging temperature is at $250^{\circ}C$. The variation of transformation temperature in first reverse transformation cycle and second was very significant, but there was little difference in case of 2nd and 3rd. Transformation temperature at various aging temperature was increased with increasing of aging temperature and time. Microvickers hardness was increased with increasing of aging temperature and time. It was found that ${\alpha}$ and ${\gamma}_2$ phase were created by aging of long time at high temperature.

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스프링용 Ti-3Al-8V-6Cr-4Mo-4Zr 타이타늄 합금의 시효열처리 최적화 (Aging Treatment Optimization of Ti-3Al-8V-6Cr-4Mo-4Zr Alloy for Spring Application)

  • 윤창석;박양균;김종형;이수창;이동근
    • 열처리공학회지
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    • 제30권6호
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    • pp.279-284
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    • 2017
  • Mechanical properties of titanium alloy can be improved by controlling microstructure through heat treatment. In this study, Ti-3Al-8V-6Cr-4Mo-4Zr metastable beta titanium alloy, was controlled for excellent mechanical property and sound formability through various high temperature heat treatment and aging conditions and the optimum heat treatment conditions were determined. The specimens were heat-treated at $950^{\circ}C$, followed by various aging treatments from $430^{\circ}C$ to $500^{\circ}C$ for 1 to 24 h. As aging temperature and holding time increased, hardness increased by ${\beta}^{\prime}$ phase formation and precipitation of secondary ${\alpha}$ phase in ${\beta}$ matrix. However, the optimum aging temperature and holding time for mechanical properties were at $450{\sim}470^{\circ}C$ for 8~16 hr. Hardness values of the specimen aged at $450^{\circ}C$ for 8 h were found to be the highest. These results can be effectively applied to fabrication of spring with better formability and mechanical property.

Preparation and Characterization of Organic-inorganic Hybrid Composite Film with Plate-shaped Alumina by Electrophoretic Deposition as a Function of Aging Time of Sol-Gel Binder

  • Kim, Doo Hwan;Park, Hee Jeong;Choi, Jinsub;Lim, Hyung Mi
    • 한국세라믹학회지
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    • 제52권5호
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    • pp.366-373
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    • 2015
  • Sol-gel binder was prepared by hydrolysis and condensation reaction using boehmite sol and methyltrimethoxysilane as a function of aging-time. The coating slurry was composed of a plate-shape alumina in the sol-gel binder for the EPD process, in which particles dispersed in the slurry were deposited on the electrode under an electric field due to the surface charge. We studied the effects of three parameters: the content of boehmite, the aging time, and the applied voltage, on the physical, thermal, and electrical properties of the hybrid composite films by EPD. The amount of boehmite was 10 ~ 20 wt% and the aging time was 0.5 ~ 72, with a fixed amount of plate-shape alumina of 10 wt%. The condition of applied voltage was 5 ~ 30 V with a distance of 2 cm between the electrode during the EPD process. We confirmed that a structure of hybrid composite films of well-ordered plate alumina was deposited on the substrate when the film was prepared using a sol-gel binder composed of 15 wt% boehmite with 1 hr aging time and EPD at 10 V. The process shows a weight loss of 7% at $500^{\circ}C$ in TGA and a breakdown voltage of 8 kV at $87{\mu}m$.

Influence of the Cure Systems on Long Time Thermal Aging Behaviors of NR Composites

  • Choi, Sung-Seen;Kim, Jong-Chul;Lee, Seung-Goo;Joo, Yong-L.
    • Macromolecular Research
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    • 제16권6호
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    • pp.561-566
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    • 2008
  • NR composites with different curing systems were aged thermally at 60, 70, 80, and $90^{\circ}C$ for 2-185 days in a convection oven, and the changes in the crosslink density were investigated as a function of the accelerated thermal aging. The overall crosslink densities increased with increasing aging time irrespective of the aging temperatures and curing systems. The changes in crosslink density were enhanced by increasing the aging temperature. The degree of the increased crosslink density was in the following order: "the conventional cure system > the semi-EV system > the EV system". For short term thermal aging, the change in crosslink density with the aging time was complicated, particularly for low temperature aging. The activation energies of the change in crosslink density with thermal aging using the conventional and semi-EV cure systems increased and then remained relatively constant with increasing aging time, whereas that of the specimen with an EV cure system tended to increase linearly. The experimental results were explained by the dissociation of the existing polysulfidic linkages and the formation of new cross links through the crosslinking-related chemicals remaining in the sample.

LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 열처리의 영향 (Effect of Heat Treatment on Mechanical Reliability of Solder Joints in LED Package)

  • 고민관;안지혁;이영철;김광석;윤정원;정승부
    • 대한금속재료학회지
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    • 제50권1호
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    • pp.71-77
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    • 2012
  • We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

Ti-50.85atNi 합금의 변태거동 및 형상기억특성 미치는 시효처리의 영향 (Effect of Isochronic Aging on Transformation Behavior in Ti-50.85at%Ni Alloy)

  • 김재일;성장현;김영희;이준희;관기수일
    • 열처리공학회지
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    • 제22권2호
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    • pp.101-107
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    • 2009
  • Effect of isochronic aging on transformation behavior of Ti-50.85at%Ni alloy were investigated by differential scanning calorimeter (DSC). The martensitic transformation temperature increases with increasing annealing temperature until reaching a maximum, and then decreases with further increasing annealing temperature. This can be rationalized by interaction between the distribution of $Ti_3Ni_4$ precipitates and Ni content in the matrix. The R-phase transformation temperature increases with increasing annealing temperature until reaching a maximum, and then decreases with a further increase of annealing temperature. This is attributed to the change of Ni content in the matrix caused by precipitation of $Ti_3Ni_4$. The occurrence of the multiple-stage martensitic and R-phase transformation is attributed to precipitation-induced inhomogeneity of the matrix, both in terms of composition and of internal stress fields.

P-형 Skutterudite 소재의 고온 열전물성 제어를 위한 공정 개발 (Process Development for Enhancement of High Temperature Thermoelectric Properties in a p-Type Skutterudite)

  • 류붕거;노창완;최순목
    • 한국전기전자재료학회논문지
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    • 제33권6호
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    • pp.495-499
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    • 2020
  • Power factor improvement at high temperatures has been a major research topic for the development of skutterudite thermoelectric materials. Here, we attempted to optimize the process parameters for manufacturing skutterudite materials, especially for p-type systems. We focused on the effect of aging time variation to maximize the high-temperature performance of the Ce-filled Fe3CoSb12 skutterudite system. The optimized aging time was concluded to be a key parameter for the formation of single-phase nanostructures in this p-type skutterudite system. The optimized condition was effective in reducing the bipolar effect at high temperature ranges by increasing the carrier concentration in the p-type system. To confirm the conclusions, the electrical conductivity, Seebeck coefficient, and power factor were measured. The results matched well with the microstructure and with those of an XRD analysis performed for the system.

Cu pillar 범프 내의 금속간화합물 성장거동에 미치는 시효처리의 영향 (Effect of Thermal Aging on the Intermetallic compound Growth kinetics in the Cu pillar bump)

  • 임기태;이장희;김병준;이기욱;이민재;주영창;박영배
    • 마이크로전자및패키징학회지
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    • 제14권4호
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    • pp.15-20
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    • 2007
  • 시효처리에 따른 Cu pillar 범프 내 다양한 계면에서의 금속간화합물 성장거동을 각각 120, 150, $165^{\circ}C$의 온도에서 300시간동안 시효처리하면서 연구하였다. 분석 결과 Cu pillar와 SnPb 계면에서는 $Cu_6Sn_5$$Cu_3Sn$이 관찰되었고, 시효처리 시간이 경과함에 따라 parabolic 형태로 성장하였다. 또한 시효처리 온도가 높을수록 시간에 따른 $Cu_6Sn_5$$Cu_3Sn$의 성장속도는 더욱 빨랐다. kirkendall void는 Cu Pillar와 $Cu_3Sn$ 사이의 계면과 $Cu_3Sn$ 내부에서 형성되었고, 시효처리 시간이 경과함에 따라 성장하였다. 리플로우 후에 SnPb와 Ni(P)사이의 계면에서는 $(Cu,Ni)_6Sn_5$가 형성되었고, 시효처리 시간에 따른 $(Cu,Ni)_6Sn_5$거 두께 변화는 관찰되지 않았다. 시효처리 온도와 시간에 따른 금속간화합물의 두께 변화를 이용하여 전체$(Cu_6Sn_5+Cu_3Sn)$금속간화합물과 $Cu_6Sn_5,\;Cu_3Sn$ 금속간화합물의 성장에 대한 활성화 에너지를 구해본 결과 각각 1.53, 1.84, 0.81 eV의 값을 가지고 있었다.

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졸 합성시 숙성이 γAl2O3 입자의 표면특성에 미치는 영향 (Effects of Surface Characterization of γAl2O3 Particles by Aging in the Sol Preparation)

  • 유승준;곽동희;김형기;황운연;박형상;윤호성;장희동
    • Korean Chemical Engineering Research
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    • 제46권3호
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    • pp.545-549
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    • 2008
  • ${\gamma}-AlO$(OH) 졸 입자 뿐만 아니라 소성처리된 ${\gamma}-Al_2O_3$ 입자의 표면특성을 ${\gamma}-AlO$(OH) 졸 제조시 숙성단계에 의하여 조절하였다. 연구결과, ${\gamma}-AlO$(OH) 졸 입자의 등전점은 숙성 증가에 따라 pH 9.25에서 pH 8.70까지 감소하였으며 ${\gamma}-Al_2O_3$ 입자의 경우는 pH 9.90에서 pH 8.86까지 감소하였다. 숙성에 따른 ${\gamma}-Al_2O_3$ 입자의 산, 염기 특성을 고찰한 결과, ${\gamma}-Al_2O_3$ 입자의 산량은 숙성시간의 증가에 따라 0.1367 mmol/g에서 0.0783 mmol/g까지 감소하였으며, Hammett 산성도함수 $H_o$는 4.8 이상의 산세기를 보였다. 한편 ${\gamma}-Al_2O_3$ 입자의 염기량은 숙성시간의 증가에 따라 0.4399 mmol/g에서 0.3074 mmol/g 까지 감소하였다. 따라서 졸-겔법에 의한 ${\gamma}-Al_2O_3$ 제조시 숙성공정이 산, 염기점의 양을 포함한 표면특성을 조절할 수 있는 중요 공정변수임을 제시하였다.

슈퍼 2상 스테인리스강의 공식에 미치는 R상의 영향 (Effect of and R Phase on the Pitting Corrosion in Super Duplex Stainless Steel)

  • 이병찬;오은지;강창룡
    • 한국재료학회지
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    • 제24권11호
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    • pp.610-616
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    • 2014
  • In this study, we investigated the precipitation behavior of the R-phase precipitated at the initial stage of aging and its effect on the pitting corrosion of 25%Cr-7%Ni-4%Mo super duplex stainless steel. The R-phase in super duplex stainless steel was mainly precipitated at the interface of ferrite/austenite phases and inside of the ferrite phase during the initial stage of aging, and it was transformed into the ${\sigma}$-phase with an increase in aging time. The ferrite phase was decomposed into a new austenite phase and ${\sigma}$-phase. The R phase was an intermetallic compound, which represented a lower Ni and higher Mo than the matrix, and also had a higher Mo and Cr concentration than the ${\sigma}$ phase. With an increasing aging time, the pitting potential $E_p$ was increased slowly by the precipitation of the R-phase, and it was then steeply decreased by the precipitation of the ${\sigma}$-phase. The R-phase was decreased the pitting potential, but its effect was smaller than effect of ${\sigma}$-phase.