• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1840-1843
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• 2003

The Magnetorheological fluid has the properties that its viscosity has drastic changed under some magnetic fields therefore, Magnetorheological fluids has been used for micro polishing of the micro part( for example, a aspherical surface in a micro lens). The polishing process may appears as follows. A part rotating on the spindle is brought into contact with an Magnetorheological finishing(MRF) fluids which is set in motion by the moving wall. In the region where the part and the MRF fluid ate brought into contact, the applied magnetic field creates the conditions necessary for the material removal from the part surface. The material removal takes place in a certain region contacting the surface of the part which can be called the polishing spot or zone. The polishing mechanism of the material removal in the contact zone is considered as a process governed by the particularities of the Bingham flow in the contact zone. Resonable calculated and experimental magnitudes of the material removal rate for glass polishing lends support the validity of the approach.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.7
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• pp.46-52
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• 2004

The Magnetorheological fluid has the properties that its viscosity has drastic changed under some magnetic fields therefore, Magnetorheological fluids has been used fur micro polishing of the micro part(for example, a spherical surface in a micro lens). The polishing process may appears as follows. A part rotating on the spindle is brought into contact with an Magnetorheological finishing(MRF) fluids which is set in motion by the moving wall. In the region where the part and the MRF fluid are brought into contact, the applied magnetic field creates the conditions necessary for the material removal from the part surface. The material removal takes place in a certain region contacting the surface of the part which can be called the polishing spot or zone. The polishing mechanism of the material removal in the contact zone is considered as a process governed by the particularities of the Bingham flow in the contact zone. Resonable calculated and experimental magnitudes of the material removal rate for glass polishing lends support the validity of the approach.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.2
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• pp.322-328
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• 2002

In wire-electrical discharge machining (W-EDM), the dielectric plays an important role as the working fluid. It affects the material removal rate and the properties of the machined surface. This paper deals with the effects of the electrical conductivity of dielectric and cobalt percentage of sintered carbides on the machining characteristics and the machined surface integrities with deionized water as dielectric. A series of experiments have been performed on sintered carbides having different cobalt contents. Experimental results show that a higher cobalt content of WC decreases the metal removal rate and worsens the surface quality. Lower electrical conductivity of the dielectric results in a higher metal removal rate as the gap between wire electrode and workpiece reduced. Especially, the surface integrities of rough-cut workpiece, wire electrode, and debris were analyzed also through scanning electron microscopy(SEM) and surface roughness tester. By energy dispersive spectrometry(EDS), it is confirmed that micro cracks and some of electrode material are found on the workpiece surface.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.735-738
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• 2000

The characteristics of wire electrical discharge machining (WEDM) are governed by many factors such as the power supply type, operating condition and electrode material. This work deals with the effect of wire electrode materials on the machining characteristics such as, metal removal rate, surface characteristics and surface roughness during WEDM A wire's thermal physical properties are melting point, electrical conductivity and vapor pressure. One of the desired qualities of wire is a low melting point and high vapor pressure to help expel the contaminants from the gap. They are determined by the mix of alloying elements (in the case of plain brass and coated wire) or the base core material(i.e. molybdenum). Experiments have been conducted regarding the choice of suitable wire electrode materials and influence of the properties of these materials on the machinability and surface characteristics in WEDM, the experimental results are presented and discussed from their metallurgical aspect. And the coating effect of various alloying elements(Au, Ag, Cu, Zn, Cr, Mn, etc.) to the Cu or 65-35 brass core on them was reviewed also. The removal rate of some coated wires are higher than that of 65-35 brass electrode wire because the wire is difficult to break due to the wire cooling effect of Zn evaporation latent heat and the Zn oxide on the surface is effective in preventing short circuit. The removal rate increases with increasing Zn content from 35, 40 and Zn coated wire

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.223-227
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• 2002

As the channel length of device shrinks below $0.13{\mu}m$, CMP(chemical mechanical polishing) process got into key process for global planarization in the chip manufacturing process. The removal rate and non-uniformity of the CMP characteristics occupy an important position to CMP process control. Especially, the post-CMP thickness variation depends on the device yield as well as the stability of subsequent process. In this paper, every wafer polished two times for the improvement of oxide CMP process characteristics. Then, we discussed the removal rate and non-uniformity characteristics of post-CMP process. As a result of CMP experiment, we have obtained within-wafer non-uniformity (WIWNU) below 4 [%], and wafer-to-wafer non-uniformity (WTWNU) within 3.5 [%]. It is very good result, because the reliable non-uniformity of CMP process is within 5 [%].

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.169-172
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• 1999

In this experimental study we Proposed the double dielectric barrier discharge (DDBD) reactor to produce as high an electric field as possible. The experiment are conducted for applied voltage from 15 to 20[tV], flow gas rage at 2[1/min] and pulse rate at 120[pulses/s] and 240[pulses/s]. SPD connection of DDBD which combine the surface discharge with the silence discharge was most effective to reduce the NOx. In the decomposition efficiency per watt, the low pulse rate gave hotter efficiency than that of the high pulse rate. However in DeNOx rate, the high pulse rate gave better performance than that of the low pulse rate. NOx removal rate increased with increasing the applied voltage in all reactors.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.5
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• pp.451-457
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• 2000

Experimental investigations on the effect of two kinds of additives ; aqueous NaOH solution and ammonia(NH$_3$) for removal of NOx and SO$_2$ simultaneously by corona discharge were carried out. The simulated combustion flue gas was[NO(0.02[%])-SO$_2$(0.08[%])-$CO_2$-Air-$N_2$] Volume percentage of aqueous NaOH solution used was 20[%] and $N_2$flow rate was 2.5[$\ell$/min] for bubbling aqueous NaOH solution Ammonia gas(14.81[%]) balanced by argon was diluted by air. NH$_3$ molecular ratios(MR) based on [NH$_3$] and [NO+SO$_2$] were 1, 1.5 and 2.5 The vapour of aqueous NaOH solution and NH$_3$was introduced to the main simulated combustion flue gas duct through injection systems which were located at downstream of corona discharge reactor. NOx(NO+NO$_2$) removal rate by injecting the vapour of aqueous NaOH solution was much better than that by injecting NH$_3$however SO$_2$removal rate by injecting NH$_3$was much better than that by injecting the vapour of aqueous NaOH SO$_2$removal rate slightly increased with increasing applied voltage. When the vapour of aqueous NaOH solution and NH$_3$were simultaneously injection NOx and SO$_2$ removal rate were significantly increased.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.917-921
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• 2002

In this paper, we made different types of non-thermal plasma reactors such as Metal-particle reactor with $Al_2O_3$ to measure NOx removal characteristic and the dielectric effect for NOx removal. NOx removal rate is not so good when we use just dielectric of $Al_2O_3$ at the Metal-particle reactor, also we just put sludge pellets(100%) without Metal-particle reactor with $Al_2O_3$ and dielectric such as $TiO_2$, $BaTiO_3$ to measure the effect of sludge for NOx removal so that NOx removal rate is almost the same. However NOx removal rate is more than 90% in case of the reactor of composition shape used both dielectric of $Al_2O_3$ and sludge pellets at the same time. In case of the shape of plasma reactor with dielectric, the Metal-particle reactor with $Al_2O_3$, and the metal-particle reactor with both $Al_2O_3$ and dielectric such as $TiO_2$, $BaTiO_3$ at the same time, they are almost the same effect for NOx removal, so we made MNPR(Metal-particle Non-thermal Plasma Reactor with $Al_2O_3$) to reduce these kinds of demerits. Finally, we think MNPR should be much better than other reactors for NOx removal.

• Tribology and Lubricants
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• v.34 no.3
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• pp.115-122
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• 2018

Chemical mechanical polishing (CMP) is a hybrid processing method in which the surface of a wafer is planarized by chemical and mechanical material removal. Since mechanical material removal in CMP is caused by the rolling or sliding of abrasive particles, interfacial friction during processing greatly influences the CMP results. In this paper, the trend of tribology research on CMP process is discussed. First, various friction force monitoring methods are introduced, and three elements in the CMP tribo-system are defined based on the material removal mechanism of the CMP process. Tribological studies on the CMP process include studies of interfacial friction due to changes in consumables such as slurry and polishing pad, modeling of material removal rate using contact mechanics, and stick-slip friction and scratches. The real area of contact (RCA) between the polishing pad and wafer also has a significant influence on the polishing result in the CMP process, and many researchers have studied RCA control and prediction. Despite the fact that the CMP process is a hybrid process using chemical reactions and mechanical material removal, tribological studies to date have yet to clarify the effects of chemical reactions on interfacial friction. In addition, it is necessary to clarify the relationship between the interface friction phenomenon and physical surface defects in CMP, and the cause of their occurrence.

• 한국연소학회:학술대회논문집
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• 2007.05a
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• pp.155-160
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• 2007

This study was conducted to find out the chlorine removal characteristics of waste plastic mixture by pyrolysis process with thermogravimetric analysis(TGA) and a lab-scale pyrolyzer. The material used as plastic wastes were PE (Poly-ethylene), PP (Poly-prophylene), and PVC (Poly Vinyl Chloride). Experimental procedure were composed of three steps; 1st step: TGA of PVC, PP and PE, 2nd step: chlorine removal rate of PVC in a lab-scale pyrolyzer, 3rd step: chlorine removal rate of PVC-PE and PVC-PP mixture in a pyrolyzer. Through the results of TGA, we can estimate the basic pyrolysis characteristics of each plastic, and then we can also derive the design parameters and operating conditions of the lab-scale pyrolyzer. The results can be used as primary data for designing a system to produce RPF (Refuse Plastic Fuel), a waste incinerator and a pyrolysis/gasification process.