• 제목/요약/키워드: Material Removal rate

검색결과 593건 처리시간 0.037초

Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP

  • Lee, Hyo-Sang;DeNardis, Darren;Philipossian, Ara;Seike, Yoshiyuki;Takaoka, Mineo;Miyachi, Keiji;Furukawa, Shoichi;Terada, Akio;Zhuang, Yun;Borucki, Len
    • Transactions on Electrical and Electronic Materials
    • /
    • 제8권2호
    • /
    • pp.67-72
    • /
    • 2007
  • High Pressure Micro Jet (HPMJ) pad conditioning system was investigated as an alternative to diamond disc conditioning in copper CMP. A series of comparative 50-wafer marathon runs were conducted at constant wafer pressure and sliding velocity using Rohm & Haas IC1000 and Asahi-Kasei EMD Corporation (UNIPAD) concentrically grooved pads under ex-situ diamond conditioning or HPMJ conditioning. SEM images indicated that fibrous surface was restored using UNIPAD pads under both diamond and HPMJ conditioning. With IC1000 pads, asperities on the surface were significantly collapsed. This was believed to be due to differences in pad wear rates for the two conditioning methods. COF and removal rate were stable from wafer to wafer using both diamond and HPMJ conditioning when UNIPAD pads were used. Also, HPMJ conditioning showed higher COF and removal rate when compared to diamond conditioning for UNIPAD. On the other hand, COF and removal rates for IC1000 pads decreased significantly under HPMJ conditioning. Regardless of pad conditioning method adopted and the type of pad used, linear correlation was observed between temperature and COF, and removal rate and COF.

생물막공정에 의한 상수원수의 수질개선에 관한 연구 (A Study on the Quality Improvement of Raw-Water Using Submerged Biofilter)

  • 이수식;안승섭
    • 상하수도학회지
    • /
    • 제13권1호
    • /
    • pp.81-94
    • /
    • 1999
  • This study aims at a proposal of the plan that can improve raw water quality by an experimental study using influent water of Nak-dong river, which has been used as raw water for drinking in U-city, through the establishment of the submerged biofilter process PILOT PLANT of media packing channel method. From the analysis of removal efficiency for each water quality item of the collected sample, following results are obtained. First of all, the removal rate of suspended material, BOD, COD, T-N, TOC, turbidity, and $NH_3$ -N appear 82%, 78%, 42%, 15%, 57%, 43%, 54%, and 55% respectively and it is known that the submerged biofilter process of media packing channel method takes effects on water quality improvement from the above analysis results of water treatment efficiency. And the analyzed results for water temperature, residence time, and activities of microorganism, which can be the factors affect on water quality improvement, are as follows. 1) The removal rate variation of SS, BOD, and COD attendant on water temperature change is examined and it is known that the removal rate increases at $13^{\circ}C$ or above. 2) The removal rate of SS, BOD, and COD attendant on residence time is most active in the range of 0~18hr, 0~1.8hr, 0~2.7hr respectively, so it is found that the removal rate becomes smaller after 2.7hr. 3) From the examination of microorganism activity with the abundance of normal bacteria, it is found that the floating bacteria decrease as the flow distance from raw water inflow point of PILOT PLANT increases, and the adhesive bacteria have no concern with the flow distance. And it its known that the biomass of fine algae decreases as the flow distance from the raw water inflow point of PILOT PLANT increases from the examination with Chl-a.

  • PDF

맥동식 침전지에서 맛·냄새 유발물질 제거 특성 (Removal Property of Taste and Odor Causing Material in Pulsator Clarifier)

  • 정일용;차민환
    • 한국물환경학회지
    • /
    • 제27권1호
    • /
    • pp.104-109
    • /
    • 2011
  • The removal efficiencies of 2-methylisoborneol (MIB) and geosmin were investigated to reveal removal characteristics of typical organic compounds causing disagreeable taste and odor at the conventional water treatment plant installed with pulsator clarifier patented by the French company $Degr{\acute{e}}mont$. The injection rate of Powdered Activated Carbon (PAC) into water was changed step wisely as we conducted jar tests in the laboratory and water treatment in the actual plant. 2-MIB concentration decreased linearly while geosmin did exponentially along with the injection rate of PAC at our jar tests. The removal efficiency of geosmin by PAC injection was considerably higher than that of 2-MIB. In the real pulsator clarifier, 2-MIB concentration started decreasing as the injection rate reached up to 10 mg/L of PAC. On the other hand, the concentration of geosmin in water decreased proportional to the injection rate of PAC. In the sand filtration, removal efficiencies of 2-MIB and geosmin on July were much higher than those on March. It was carefully suggested beforehand and found afterwards that general microorganisms notably existed in the sand filter with no chlorine in filter influent and backwash water and the sand filter biologically activated removed much more odor compounds. It was considered as the reason why the removal efficiency of 2-MIB and geosmin was increased. The microbial activity maybe increased in summer with water temperature rising and low filtration rate possibly increased contact time between odor compounds and general microorganisms.

내면 플런지 연삭과 스러스트 연삭의 비교 (A Study on the Comparison of Internal Plunge Grinding and Internal Thrust Grinding)

  • 최환;서창연;서영일;이충석
    • 한국기계가공학회지
    • /
    • 제15권1호
    • /
    • pp.68-73
    • /
    • 2016
  • In this paper, the grinding characteristics in internal grinding methods(plunge, thrust) were studied with vitreous CBN wheels using machining center. Grinding experiments were performed according to the same material removal rate conditions such as a wheel speed, depth of cut and workpiece speed. And the grinding force, machining error and grinding ratio were investigated though these experiments. Based on the experimental results, the grinding characteristics on internal grinding methods were compared.

An Optimum 2.5D Contour Parallel Tool Path

  • Kim, Hyun-Chul;Yang, Min-Yang
    • International Journal of Precision Engineering and Manufacturing
    • /
    • 제8권1호
    • /
    • pp.16-20
    • /
    • 2007
  • Although conventional contour parallel tool paths obtained from geometric information have successfully been used to produce desired shapes, they seldom consider physical process concerns such as cutting forces and chatter. In this paper, we introduce an optimized contour parallel path that maintains a constant material removal rate at all times. The optimized tool path is based on a conventional contour parallel tool path. Additional tool path segments are appended to the basic path to achieve constant cutting forces and to avoid chatter vibrations over the entire machining area. The algorithm was implemented for two-dimensional contiguous end milling operations with flat end mills, and cutting tests were conducted to verify the performance of the proposed method.

CMP공정에서 연마결과에 영향을 미치는 패드 물성치에 관한 연구 (Study on Pad Properties as Polishing Result Affecting Factors in Chemical Mechanical Polishing)

  • 김형재;김호윤;정해도
    • 한국정밀공학회지
    • /
    • 제17권3호
    • /
    • pp.184-191
    • /
    • 2000
  • Properties of pad are investigated to find the relationship between the chemical mechanical polishing(CMP) results, such as material removal rate and within wafer non-uniformity(WIWNU), and its properties. Polishing pressure is considered as important factors to affect the results, so behavior of ordinary polymer is studied to define the polishing result affecting properties of pad. Experimental setup is devised to identify the behavior of pad and several different pads are used in chemical mechanical polishing experiments to verify the correlations between pad properties and polishing results. The results indicate that the viscoelastic properties of pad had relationships with the polishing results, and shows correlation between suggested properties of pad and polishing result.

  • PDF

CMP 패드 컨디셔닝 온도에 따른 산화막의 연마특성 (CMP Properties of Oxide Film with Various Pad Conditioning Temperatures)

  • 최권우;김남훈;서용진;이우선
    • 한국전기전자재료학회논문지
    • /
    • 제18권4호
    • /
    • pp.297-302
    • /
    • 2005
  • Chemical mechanical polishing(CMP) performances can be optimized by several process parameters such as equipment and consumables (pad, backing film and slurry). Pad properties are important in determining removal rate and planarization ability of a CMP process. It is investigated the performance of oxide CMP process using commercial silica slurry after the pad conditioning temperature was varied. Conditioning process with the high temperature made the slurry be unrestricted to flow and be hold, which made the removal rate of oxide film increase. The pad became softer and flexible as the conditioning temperature increases. Then the softer pad provided the better surface planarity of oxide film without defect.

펄스지속시간에 따른 형상방전가공 특성 (Characteristics of Die Sinking Electical Discharge Machining for Pulse Duration)

  • 우정윤;왕덕현;윤존도
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 1997년도 춘계학술대회 논문집
    • /
    • pp.827-831
    • /
    • 1997
  • Conductive veramic matrix composite(CMC) workpiece of TiC 33%/Al /sab 2/O /sab 3/ 66% Y /sab 2/ O /sab 3/ was machined by die sinking electrical discharge machining(EDM) according to different pulse duration and suty factor for reverse polarity of electrode. Material removal rate(MRR) was examined by process under various operating conditions. The surface morphology was evaluated by surface roughness values and scanning electron microscopy(SEM) research. The more MRR was obtained according to increase pulse duration and duty factor. Also the maximum surface roughness(Rmax) of EDMed surface was slightly changed with increased pulse duration and duty factor. The SEM photographs of EDMed surface showed wide recast wide recast distribution region of melting materials in purse duration 0.130(ms) than 0.048(ms).

  • PDF

Cu CMP에서 Large sized particles이 연마속도에 미치는 영향 (Effects of Large Sized Particles on Removal Rate during Cu CMP)

  • 송재훈;엄대홍;홍의관;강영재;박진구
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
    • /
    • pp.1304-1307
    • /
    • 2004
  • 실제 Cu CMP 공정이 진행되는 동안 연마입자의 응집현상을 관찰하긴 어렵다. 따라서 본 연구에서는 인위적으로 첨가한 large particle들이 공정 중에 발생하는 응집입자라 가정하고 각 공정에 따른 연마속도와 friction force를 측정하여 large particle을 첨가하지 않은 슬러리와 비교 평가해보았다. large particle을 첨가한 슬러리의 경우에 각 공정변수에 따라 연마속도와 friction force가 작아짐을 관찰하였다. 즉, 슬러리 내에 응집현상이 발생하게 된다면 large particle이 연마의 방해 인자로 나타남을 관찰 할 수 있었다.

  • PDF

화학적기법을 이용한 유리의 초음파가공 특성 (Characteristics of Chemical-assisted Ultrasonic Machining of Glass)

  • 김병희;전성건;김헌영;전병희
    • 대한기계학회:학술대회논문집
    • /
    • 대한기계학회 2003년도 춘계학술대회
    • /
    • pp.1349-1354
    • /
    • 2003
  • Ultrasonic Machining process is an efficient and economical means of precision machining on glass and ceramic materials. However, the mechanics of the process with respect to crack initiation and propagation, and stress development in the ceramic workpiece subsurface are still not well understood. In this research, we investigate the basic mechanism of chemical assisted ultrasonic machining(CUSM) of glass through the experimental approach. For the purpose of this study, we designed and fabricated the desktop micro ultrasonic machine. The feed is controlled precisely by using the constant load control system. During the machining experiment, the effects of HF(hydrofluoric acid) characteristics and machining condition on the surface roughness and the material removal rate are measured and compared.

  • PDF