• 제목/요약/키워드: Material Removal

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Mixed matrix membranes for dye removal

  • Evrim Celik-Madenli;Dilara Kesiktas
    • Membrane and Water Treatment
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    • 제14권4호
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    • pp.175-180
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    • 2023
  • Mixed matrix membranes (MMMs) can be a promising alternative for the solution of dye removal from coloured effluents. Polymeric membranes are widely used due to their good film-forming ability, flexibility, separation properties, and cost. However, they have low mechanical, chemical, and thermal resistances. Moreover, the fouling of polymeric membranes is high because of their hydrophobic nature. Hence, there is an increasing interest in organic-inorganic hybrid membranes as a new-generation membrane material. It has been shown that carbon nanotubes have the potential to increase the material properties of polymers with their low density, high strength, hardness, and exceptional aspect ratio. In this work, carbon nanotubes blended MMMs were prepared and methyl orange removal efficiency of them was investigated. Compared to the bare membranes, MMMs showed not only increased hydrophilicity, water content, and pure water flux but also increased methyl orange rejection and flux recovery

Effect of Amine Functional Group on Removal Rate Selectivity between Copper and Tantalum-nitride Film in Chemical Mechanical Polishing

  • Cui, Hao;Hwang, Hee-Sub;Park, Jin-Hyung;Paik, Ungyu;Park, Jea-Gun
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.546-546
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    • 2008
  • Copper (Cu) Chemical mechanical polishing (CMP) has been an essential process for Cu wifing of DRAM and NAND flash memory beyond 45nm. Copper has been employed as ideal material for interconnect and metal line due to the low resistivity and high resistant to electro-migration. Damascene process is currently used in conjunction with CMP in the fabrication of multi-level copper interconnects for advanced logic and memory devices. Cu CMP involves removal of material by the combination of chemical and mechanical action. Chemicals in slurry aid in material removal by modifying the surface film while abrasion between the particles, pad, and the modified film facilitates mechanical removal. In our research, we emphasized on the role of chemical effect of slurry on Cu CMP, especially on the effect of amine functional group on removal rate selectivity between Cu and Tantalum-nitride (TaN) film. We investigated the two different kinds of complexing agent both with amine functional group. On the one hand, Polyacrylamide as a polymer affected the stability of abrasive, viscosity of slurry and the corrosion current of copper film especially at high concentration. At higher concentration, the aggregation of abrasive particles was suppressed by the steric effect of PAM, thus showed higher fraction of small particle distribution. It also showed a fluctuation behavior of the viscosity of slurry at high shear rate due to transformation of polymer chain. Also, because of forming thick passivation layer on the surface of Cu film, the diffusion of oxidant to the Cu surface was inhibited; therefore, the corrosion current with 0.7wt% PAM was smaller than that without PAM. the polishing rate of Cu film slightly increased up to 0.3wt%, then decreased with increasing of PAM concentration. On the contrary, the polishing rate of TaN film was strongly suppressed and saturated with increasing of PAM concentration at 0.3wt%. We also studied the electrostatic interaction between abrasive particle and Cu/TaN film with different PAM concentration. On the other hand, amino-methyl-propanol (AMP) as a single molecule does not affect the stability, rheological and corrosion behavior of the slurry as the polymer PAM. The polishing behavior of TaN film and selectivity with AMP appeared the similar trend to the slurry with PAM. The polishing behavior of Cu film with AMP, however, was quite different with that of PAM. We assume this difference was originated from different compactness of surface passivation layer on the Cu film under the same concentration due to the different molecular weight of PAM and AMP.

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합성 금속-유기 골격체 NH2-MIL-101(Fe)를 이용한 염료의 흡착 및 광분해 제거 (Adsorption and Photocatalytic Degradation of Dyes Using Synthesized Metal-Organic Framework NH2-MIL-101(Fe))

  • 이준엽;최정학
    • 한국환경과학회지
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    • 제27권7호
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    • pp.611-620
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    • 2018
  • In this study, a metal-organic framework (MOF) material $NH_2$-MIL-101(Fe) was synthesized using the solvothermal method, and characterized by X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR), UV-visible spectrophotometry, field-emission scanning electron microscopy (FE-SEM), energy dispersive X-ray spectroscopy (EDS), transmission electron microscopy (TEM), and surface area measurements. The XRD pattern of the synthesized $NH_2$-MIL-101(Fe) was similar to the previously reported patterns of MIL-101 type materials, which indicated the successful synthesis of $NH_2$-MIL-101(Fe). The FT-IR spectrum showed the molecular structure and functional groups of the synthesized $NH_2$-MIL-101(Fe). The UV-visible absorbance spectrum indicated that the synthesized material could be activated as a photocatalyst under visible light irradiation. FE-SEM and TEM images showed the formation of hexagonal microspindle structures in the synthesized $NH_2$-MIL-101(Fe). Furthermore, the EDS spectrum indicated that the synthesized material consisted of Fe, N, O, and C elements. The synthesized $NH_2$-MIL-101(Fe) was then employed as an adsorbent and photocatalyst for the removal of Indigo carmine and Rhodamine B from aqueous solutions. The initial 30 min of adsorption for Indigo carmine and Rhodamine B without light irradiation achieved removal efficiencies of 83.6% and 70.7%, respectively. The removal efficiencies thereafter gradually increased with visible light irradiation for 180 min, and the overall removal efficiencies for Indigo carmine and Rhodamine B were 94.2% and 83.5%, respectively. These results indicate that the synthesized MOF material can be effectively applied as an adsorbent and photocatalyst for the removal of dyes.

Biofiltration of Air Streams Contaminated Hydrogen Sulfide : Performance Evaluation of Different Carriers

  • Jeong, Gwi-Taek;Lee, Gwang-Yeon;Lee, Kyoung-Min;Cha, Jin-Myoung;Joe, Yong-Il;Park, Don-Hee
    • 한국생물공학회:학술대회논문집
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    • 한국생물공학회 2005년도 생물공학의 동향(XVII)
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    • pp.456-462
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    • 2005
  • The objective of this study was to develop a removal process by which $H_2S$ could be biologically removed from the odoriferous gases generated in the waste food recycling process. In order to develop this process we were first required to select a proper biofilter support protocol. When the selected biofilter equipment was then tested suing a synthetic odoriferous gas containing 600 ppm of $H_2S$, we noted a maximal removal rate of 658 $g-H_2S/m^3{\cdot}hr$, using polypropylene fibrils as supporting materials. Under identical experimental conditions, we obtained a value of 411.2 $g-H_2S/m^3{\cdot}hr$, using polyurethane as a support material. We also conducted a trial in which volcanic stone was utilized as a support material, and in this trial, we logged a maximal 105.1 $g-H_2S/m^3{\cdot}hr$ removal rate. As the result of our experiments, we concluded that polypropylene fibrils constituted the ideal material for the removal of $H_2S$ gas via biological treatment.

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패드 그루브의 치수가 CMP 연마특성에 미치는 영향 (The Effects of Groove Dimensions of Pad on CMP Characteristics)

  • 박기현;김형재;최재영;서헌덕;정해도
    • 대한기계학회논문집A
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    • 제29권3호
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    • pp.432-438
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    • 2005
  • CMP characteristics such as material removal rate and edge effect were measured and investigated in accordance with pad grooving effect, groove width, depth and pitch. GSQ (Groove Stiffness Quotient) and GFQ (Groove Flow Quotient) were proposed to estimate pad grooving characteristics. GSQ is defined as groove depth(D) divided by pad thickness(T) and GFQ is defined as groove width(W) divided by groove pitch(P). As GFQ value increased, material removal rate increased some point but gradually saturated. It seems that material removal rate is not affected by each parameter respectively but by interaction of these parameters such as groove dimensions. In addition, an increase in GFQ and GSQ causes edge effect to be improved. Because, pad stiffness decreases as GSQ and GFQ increase. In conclusion, groove influences relative pad stiffness although original mechanical properties of pad are unchanged by grooving. Also, it affects the flow of slurry that has an effect on the lubrication regime and polishing results. The change of groove dimensions has influence on pad stiffness and slurry flow, so that polishing results such as removal rate and edge effect become changed.

미세조류의 Methane 발효특성

  • 강창민;최명락
    • 한국미생물·생명공학회지
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    • 제24권5호
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    • pp.597-603
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    • 1996
  • This study was carried out to examine degradation characteristics of microalgae Chlorella vulgaris in methane fermentation. We measured COD and VS reduction, gas and methane productivity, VFA (volatile fatty acid), respectively. Then we calculated material balance and hydrolysis rates in soluble and solid material. The substrate concentration was controlled from 14 gCOD$_{cr}$/l to 64 gCOD$_{cr}$/l in batch cultures, and HRT (hydraulic retention time) controlled from 2 days to 30 days in continuous experi- ments. The results were as follows. In batch culture, accumulated gas productivity increased with the increase of the substrate concentration. The SS and VSS was removed all about 30% increase of substrate concentration and the most of the degradable material removed during the first 10 days. The curve of gas and methane production rate straightly increased until substrate concentration is 26 gCOD$_{cr}$/l. In continuous culture experiments, the removal rates at HRT 10days were 20% for total COD and TOC, respectively. At longer HRT, there was no increase in the removal efficiency. At HRT 15 days, the removal rates were 30% for SS and VSS, respectively. Soluble organic materials were rapidly degraded, and so there was no accumulated. Soluble COD concentration was not increase regardless of HRT-increasing. That meaned the hydrolysis was one of the rate-limiting stage of methane fermentation. The first-order rate constants of hydrolysis were 0.23-0.28 day$^{-1}$ for VSS, and 0.07-0.08 day$^{-1}$ for COD.

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구리 CMP 공정변수 최적화를 위한 실험계획법(DOE) 연구 (A Study on DOE Method to Optimize the Process Parameters for Cu CMP)

  • 최민호;김남훈;김상용;장의구
    • 한국전기전자재료학회논문지
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    • 제18권1호
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    • pp.24-29
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    • 2005
  • Chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing. Copper has been the candidate metallization material for ultra-large scale integrated circuits (ULSIs), owing to its excellent electro-migration resistance and low electrical resistance. However, it still has various problems in copper CMP process. Thus, it is important to understand the effect of the process variables such as turntable speed, head speed, down force and back pressure are very important parameters that must be carefully formulated in order to achieve desired the removal rates and non-uniformity. Using a design of experiment (DOE) approach, this study was performed investigating the main effect of the variables and the interaction between the various parameters during CMP. A better understanding of the interaction behavior between the various parameters and the effect on removal rate, non-uniformity and ETC (edge to center) is achieved by using the statistical analysis techniques. In the experimental tests, the optimum parameters which were derived from the statistical analysis could be found for higher removal rate and lower non-uniformity through the above DOE results.

혼합 산화제가 W-CMP 특성에 미치는 영향 (Effects of Mixed Oxidizer on the W-CMP Characteristics)

  • 박창준;서용진;김상용;이우선
    • 한국전기전자재료학회논문지
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    • 제16권12S호
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    • pp.1181-1186
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    • 2003
  • Chemical Mechanical Polishing (CMP) is an essential dielectric planarization in multilayer microelectronic device fabrication. In the CMP process, it is necessary to minimize the extent of surface defect formation while maintaining good planarity and optimal material removal rates. The polishing mechanism of W-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. Thus, it is important to understand the effect of oxidizer on W passivation layer, in order to obtain higher removal rate (RR) and very low non-uniformity (NU %) during W-CMP process. In this paper, we compared the effects of oxidizer or W-CMP process with three different kind of oxidizers with 5 wt% hydrogen peroxide such as Fe(NO$_3$)$_3$, H$_2$O$_2$, and KIO$_3$. The difference in removal rate and roughness of W in stable and unstable slurries are believed to caused by modification in the mechanical behavior of Al$_2$O$_3$ particles in presence of surfactant stabilizing the slurry.

Application of novel hybrid bioadsorbent, tannin/chitosan/sericite, for the removal of Pb(II) toxic ion from aqueous solution

  • Choi, Hee-Jeong;Yu, Sung-Whan
    • Korean Journal of Chemical Engineering
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    • 제35권11호
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    • pp.2198-2206
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    • 2018
  • We addressed the development of a novel, low-cost, and high-efficient material from hybrid materials, known as microcapsules. Microcapsules are a composite adsorbent made of a mixture of tannin, sericite and chitosan. The FT-IR analysis showed that the microcapsules contain hydroxyl, carboxyl, carbonyl, and amino groups, which play an important role in the adsorption of heavy metals. The microcapsules were able to remove 99% of Pb(II) in 30 min, and obtained a removal efficiency of more than (13-50)%, compared with the single adsorbents of tannin, chitosan, and sericite. In adsorption kinetic analysis, pseudo-second-order adsorption was more suitable than pseudo-first-order adsorption, and chemical adsorption did not limit the adsorption rate of Pb(II) ion. In isothermal adsorption, Langmuir adsorption was more suitable than Freundlich adsorption, and the maximum Langmuir adsorption capacity was 167.82 (mg/g). Furthermore, desorption and reusability studies, as well as the applicability of the material for wastewater treatment, demonstrated that microcapsules offer a promising hybrid material for the efficient removal of significant water pollutants, i.e., Pb(II) from aqueous solutions.

금속파티클-$Al_2O_3$ hybrid 반응기의 NOx 제거에 미치는 유전체 영향 (Effect of dielectrics on NOx removal of Metal particle-$Al_2O_3$ hybrid type reactor)

  • 김종석;박재윤;정장근;김태용;고희석;김형만
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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    • pp.917-921
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    • 2002
  • In this paper, we made different types of non-thermal plasma reactors such as Metal-particle reactor with $Al_2O_3$ to measure NOx removal characteristic and the dielectric effect for NOx removal. NOx removal rate is not so good when we use just dielectric of $Al_2O_3$ at the Metal-particle reactor, also we just put sludge pellets(100%) without Metal-particle reactor with $Al_2O_3$ and dielectric such as $TiO_2$, $BaTiO_3$ to measure the effect of sludge for NOx removal so that NOx removal rate is almost the same. However NOx removal rate is more than 90% in case of the reactor of composition shape used both dielectric of $Al_2O_3$ and sludge pellets at the same time. In case of the shape of plasma reactor with dielectric, the Metal-particle reactor with $Al_2O_3$, and the metal-particle reactor with both $Al_2O_3$ and dielectric such as $TiO_2$, $BaTiO_3$ at the same time, they are almost the same effect for NOx removal, so we made MNPR(Metal-particle Non-thermal Plasma Reactor with $Al_2O_3$) to reduce these kinds of demerits. Finally, we think MNPR should be much better than other reactors for NOx removal.

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