• Structural Engineering and Mechanics
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• v.90 no.2
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• pp.127-142
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• 2024

In recent decades, pultruded glass fiber-reinforced polymer (GFRP) members including those of box sections have attracted the attention of researchers. Nevertheless, the lack of uniform and consistent material properties, simplified design methods, and practical design codes have so far been the main barrier for field applications. Consequently, this paper highlights the existing knowledge concerning the flexural behavior of pultruded GFRP profiles and their failure modes. In particulate, it reviews the most commonly accepted design expressions and code provisions addressing the flange local buckling of pultruded GFRP box beams as the most likely failure mode. In addition, the material characterization of GFRP sections is described in detail along with the standard test methods to quantify the material characterization of GFRP laminates. It is shown that the critical flange local buckling stresses of pultruded GFRP box beams can be predicted with reliable accuracy using the expressions promulgated by ASCE (1984) (in which the flange plates are considered simply-supported at web-flange junction) and EUR 27666. The expressions stipulated in ASCE (2010) highly overestimates the critical flange local buckling stresses of GFRP box beams resulting in unconservative predictions.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.12
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• pp.1075-1079
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• 2005

The Pseudo MOSFET measurements technique has been used for the electrical characterization of the nano SOI wafer. Silicon islands for the Pseudo MOSFET measurements were fabricated by selective etching of surface silicon film with dry or wet etching to examine the effects of the etching process on the device properties. The characteristics of the Pseudo MOSFET were not changed greatly in the case of thick SOI film which was 205 nm. However the characteristics of the device were dependent on etching process in the case of less than 100 nm thick SOI film. The sub 100 nm SOI was obtained by thinning the silicon film of standard thick SOI wafer. The thickness of SOI film was varied from 88 nm to 44 nm by chemical etching. The etching process effects on the properties of pseudo MOSFET characteristics, such as mobility, turn-on voltage, and drain current transient. The etching Process dependency is greater in the thinner SOI wafer.

• Advances in nano research
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• v.16 no.1
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• pp.53-69
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• 2024

Advancements in the technology of building materials has led to diverse applications of nanomaterials with the aim to monitor concrete structures. While there are myriad instances of the use of nanoparticles in building materials, the production of smart nano cement-composites is often expensive. Thereupon, this research aims to discover a sustainable nanomaterial from tyre waste using the pyrolysis process as part of the green manufacturing circle. Here, Nano Structure Tyre-Char (NSTC) is introduced as a zero-dimension carbon-based nanoparticle. The NSTC particles were characterized using various standard characterization techniques. Several salient results for the NSTC particles were obtained using microscopic and spectroscopic techniques. The size of the particles as well as that of the agglomerates were reduced significantly using the milling process and the results were validated through a scanning electron microscope. The crystallite size and crystallinity were found to be ~35nm and 10.42%, respectively. The direct bandgap value of 5.93eV and good optical conductivity at 786 nm were obtained from the ultra violet visible spectroscopy measurements. The thermal analysis reveals the presence of a substantial amount of carbon, the rate of maximum weight loss, and the two stages of phase transformation. The FT-Raman confirms the presence of carboxyl groups and a ID/IG ratio of 0.83. Water contact angle around 140° on the surface implies the highly hydrophobic nature of the material and its low surface energy. This characteristic process assists to obtain a sustainable nanomaterial from waste tyres, contributing to the development of a smart building material.

• Proceedings of the Korean Society of Crop Science Conference
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• 2006.04a
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• pp.606-607
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• 2006

• Proceedings of the Korean Society of Crop Science Conference
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• 2006.04a
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• pp.576-577
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• 2006

• Smart Structures and Systems
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• v.30 no.3
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• pp.255-261
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• 2022

When no extensometer is available in a generic tensile-compression test carried out by a universal testing machine (for instance the model BIONIX from Material Testing Systems (MTS)), the test results only provide the relative displacement between the machine grips. The test does not provide any information on the local behaviour of the material. This contribution presents the potential of an application of Digital Image Correlation (DIC) toward the reconstruction of the behaviour along the specimen. In particular, the authors test a Ni-Ti shape memory alloys (SMA) specimen with emphasis on the coupling of the two measurement techniques.

• International Journal of Safety
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• v.3 no.1
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• pp.1-5
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• 2004

This study discusses frequency analysis based on autoregressive (AR) time series model, and the characterization of surface quality in orthogonal cutting of a fiber-matrix composite materials. A sparsely distributed idealized composite material, namely a glass reinforced polyester (GFRP) was used as workpiece. Analysis method employs a force sensor and the signals from the sensor are processed using AR time series model. The experimental correlations between the fiber pull-out and AR model coefficients are then established.

• Proceedings of the KIEE Conference
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• 2000.11d
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• pp.857-859
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• 2000

A planar MEA(Multi-channel Electrode Array) has been developed for monitoring the electrical activity of electrogenic cells in a cell culture by an extracellular recording. The material, fabrication process, characterization of the array, cleaning effect and impedance according to opening size by impedance measurement are described.

• Bulletin of the Korean Chemical Society
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• v.12 no.3
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• pp.322-328
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• 1991

We have studied a characterization method of accurate size of spherical particles by fitting experimental light scattering profile to the rigorous theoretical scattering function. An efficient software has been developed for computation of the theoretical scattering function and regression analysis. A light scattering instrument has been built and the necessary data acquisition and analysis are carried out by use of a personal computer with an emphasis on the reduction of analysis and time aiming that this study will be extended toward a development of a practical particle sizing apparatus. The performance of the instrument and the software has been evaluated with latex spheres and found to be satisfactory.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.10
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• pp.894-900
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• 2006

This paper reports the fabrication and characterization of $32{\times}32$ thermal cantilever array for nano-scaled memory device applications. The $32{\times}32$ thermal cantilever array with integrated tip heater has been fabricated with micro-electro-mechanical systems(MEMS) technology on silicon on insulator(SOI) wafer using 9 photo masking steps. All of single-level cantilevers(1,024 bits) have a p-n junction diode in order to eliminate any electrical cross-talk between adjacent cantilevers. Nonlinear electrical characteristic of fabricated thermal cantilever shows its own thermal heating mechanism. In addition, n-channel high-voltage MOSFET device is integrated on a wafer for embedding driver circuitry.